EV Group News - Page 3
EV Group Brings Maskless Lithography to High-volume Manufacturing with LITHOSCALE
LITHOSCALE® incorporates EVG’s MLE™ (Maskless Exposure) technology to bring the benefits of digital lithography to a wide range of applications...
EV Group Completes Construction of State-of-the-Art Cleanroom Facility at Corporate Headquarters
Newly opened Cleanroom V building nearly doubles cleanroom capacity and strengthens capabilities of EVG’s NILPhotonics® and Heterogeneous Integration Competence Centers...
EV Group Earns Astounding Eighth Consecutive Triple Crown Win in VLSIresearch 2020 Customer Satisfaction Survey
EVG achieves ranking among THE BEST Suppliers to Foundation Chip Makers for the first time in survey results; continues win...
EV Group Establishes Heterogeneous Integration Competence Center
New HI Competence Center to help customers accelerate new product development fueled by heterogeneous integration and advanced packaging EV Group...
EV Group Earns Exceptional Seventh Consecutive Triple Crown Win in VLSIresearch 2019 Customer Satisfaction Survey
EVG continues win streak with 17th consecutive year listed among “THE BEST” suppliers in survey results; frequently cited by customers...
EV Group’s MLE Technology Revolutionizes Lithography
EV Group (EVG) today unveiled its maskless exposure technology (MLE™), a revolutionary next-generation lithography technology developed to address future back-end...EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria
Construction of an additional, large cleanroom in St. Florian am Inn creates additional development, demo and pilot production capacity ...
EV Group Wafer Bonding Solutions for Heterogeneous Integration and Wafer-Level Packaging to be Highlighted at ECTC 2019
Technical papers and interactive poster to highlight the breakthrough capabilities of EVG’s ComBond® high-vacuum bonding system and low-temp laser debonding...
EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon for RF Front-end Module Manufacturing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, today announced that it has partnered with Ningbo...
EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing
EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced today that both companies have teamed up to provide...
EV Group Unveils Next-Gen Fusion Wafer Bonder for “More Moore” Scaling and Front-End Processing
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today... EV Group Partners with Plessey to Drive GaN-on-Silicon Monolithic microLED Technology for AR Applications
Plessey, a leading developer of award-winning optoelectronic technology solutions, announces a collaboration with EV Group (EVG), a leading supplier of... Innovations for High Performance Microelectronics Cooperates with EV Group on Low-Temp Covalent Wafer Bonding Technologies
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Earns Sixth Consecutive Triple Crown Win in VLSIresearch 2018 Customer Satisfaction Survey
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Secures Lithography Order from VTT Technical Research Centre for “More than Moore” Applications
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today...
EV Group and IBM Sign License Agreement on Laser Debonding Technology
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and...
