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A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.

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The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on more than 20 informative presentations, where focused experts gave an in-depth view of new and/or improved technologies for 3DIC-related advanced packaging. Before we address these, allow me a one-sentence recap of Part 1’s key message: We no longer have one major application, like mainframes, PCs, a... »

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The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1

Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D Architectures for Semiconductor Integration and Packaging conference (3D ASIP Conference). Rechristened to 3D Architectures for Heterogeneous Integration and Packaging (still 3D ASIP), each December sees several hundred key players from across the supply chain meeting to discuss mar... »

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IEDM 2017 Looks Way Beyond Moore’s Law

The International Electronic Device Manufacturing Conference (IEDM) has always focused on device scaling, successfully guiding our industry for several decades along the challenging paths of Moore’s Law and the ITRS Roadmap. Both were primarily focused on digital functions. However, we all must agree that the real world around us is analog. To allow our electronic devices to better assist us in... »

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Sir Walter Raleigh towered above the 50th IMAPS Symposium

Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and was knighted in 1585. In 1587 he initiated the founding of Raleigh. Last week he welcomed – appropriately dressed – about one thousand semiconductor experts to the 50th International Symposium on Microelectronics at the Raleigh, NC, Convention Center (Figure 1). If you look closer at thi... »

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EDPS 2017: NOT the usual Electronic DESIGN Process Symposium

When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold steps EDPS was traditionally held in the spring. We moved EDPS to the fall because that’s a time when more new IC projects are being planned. After many years of holding it in Monterey, we moved EDPS to Milpitas to make it more easily accessible for Silicon Valley folks... »

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem

Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share some of my general impression of this, as usual, very well-organized event. After several decades of experience with alliance management and ecosystem building, I see TSMC as the master of these discipl... »

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IMAPS 2017 SiP Conference Takes on Sonoma

California’s Wine Country attracts visitors from all over the world. They can enjoy the scenic countryside, historic places, golf courses, tennis courts, gambling and of course great wine and excellent food. How well can a highly technical conference compete with all these “distractions”? Please read about the sessions I attended and judge for yourself! The Inaugural Conference and Exhibitio... »

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Take-Aways from Test Vision 20/20 Workshop and SEMICON West Advanced Packaging Sessions

I am convinced that increasing device complexity, higher quality requirements (e.g. automotive and medical), as well as the need for faster production ramp-ups, will force our industry to pay even more attention to design-in quality, expand self-test, even add redundancy to control logic and interconnects. In addition, wafer-probe and final test need to be expanded. Therefore, attending the Test V... »

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Mission Impossible? Not for SEMI!

San Francisco’s Moscone Center (above), the traditional home of SEMICON West trade shows, is undergoing major reconstruction work. Looking at this picture of the South Hall you may ask yourself: “Can anybody organize a large trade show here and make it a big success?” My answer is: “YES, the SEMI team can! They did exactly this in July for SEMICON West 2017!” With some very creative spac... »

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DAC 54: From Grey to Colorful and Solutions-minded Messaging

The 54th Design Automation Conference (DAC 54) at the Austin Convention Center was very different, compared to the last several years’ events. Walking the exhibition floor, listening to keynotes, SKY talks and CEO interviews I got the following key impressions: While still representing a big part of the audience, the grey-haired men (like myself) were less dominant this year. Many younger people... »

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