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A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.

3D ASIP 2014: All Aboard the 3D IC Train!

Like the previous 10 years, RTI International held the 11th 3D-IC focused conference in early December. Instead of the usual two and a half days, this year it spanned 3 days, because it also offered a 4-hour session about 3D design challenges and solutions available from foundries, EDA and IP vendors, a power-user’s 3D views, as well as a low-power design tutorial presented by Si2’s Jerry Fren... »

Invitation to Participate in Si2 Survey

Dear Semiconductor / EDA expert, In my role as business development consultant, I, Herb Reiter, am getting involved in many new technologies, interesting business opportunities and meeting influential people – like 3D InCites’ Francoise von Trapp. At last week’s 3D ASIP Conference in California, Francoise offered to encourage you to answer a brief survey that will help Si2 and me, in my role... »

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IC and System Designers, This Could be the Best Four Hours Spent this Year

Don’t miss a full morning of expert presentations about 3D-IC and Interposer design tools and methodologies! Since 2004, every December RTI International has organized  a 3D technology focused conference in Burlingame, near the San Francisco Airport. Supply side industry experts presented the progress they had made in developing new manufacturing and metrology equipment, advancements in materi... »

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Kahoots from the IWLPC 3D InCites Panel

Interposer designs and 3D ICs shift a significant part of the value creation to material vendors and assembly/test houses. It’s only logical that Françoise von Trapp, in her role as Queen of 3D, moderated a high-profile 3D panel this week at the International Wafer Level Packaging Conference (IWLPC), at the DoubleTree Hotel in San Jose, CA. The panelists represented a cross section of our indus... »

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TSMC’s 2014 Open Innovation Platform Ecosystem Forum

Like many years before, I had the opportunity to attend the annual TSMC Open Innovation Platform Ecosystem Forum in San Jose’s Convention Center, held this year on September 30, 2014. TSMC always has a lot of progress to report from year to year. Last week’s event was no exception and demonstrated that this large corporation has the finger on the pulse of our industry. In my eyes, the most i... »

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The Intel Developer Forum 2014

This week I had the privilege to attend my first Intel Developer Forum (IDF). Like many of us, I have become more energy-conscious, so took the train to get there and back. On my way back I didn’t have to concentrate on the traffic around me and had time to think about what I learned from Intel’s keynotes and Mega-sessions on the first day. For many years, Intel has been the world’s largest... »

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Highlights from HotChips 2014: 21 HBM Design-ins Ongoing!

Last week, HotChips 2014 (aka HC26) was held at the Flint Center within the De Anza College in Cupertino, California. As in many previous years, I attended both the Sunday tutorial and the main conference on Monday and Tuesday. As usual, there were great keynotes and lots of interesting technology news. The tutorial always focuses on an important technology or market trend. This year was no e... »

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Apple and IBM on the Way to Demonstrate That ONE plus ONE is More Than TWO

Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and IBM are going to cooperate to offer enterprise solutions. See more about this significant step here and in many other headline news coming out this week. The former rivals are joining forces to combine Apple’s user-friendly hardware with IBM’s enterprise experience and s... »

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Should EDA vendors, OSATS, and their customers cooperate more?

Last week, I attended the packaging-focused 64th Electronic Components and Technology Conference (ECTC) 2014 in Orlando. This week I spent three days at the EDA-focused 51st Design Automation Conference in San Francisco. In addition to realizing that these two locations are about three thousand miles apart, I noticed that the packaging and EDA camps are still far apart in regards to share of mind ... »

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Will the Internet of Things Change the Way We Look at 2.5D and 3D ICs?

Years ago I saw Dr. Wayne Dyer on Public Television. He talked about “The Power of Intention”. The engineering-driven half of my mind didn’t pay much attention to such a mushy topic…. until Dr. Dyer confused me with what sounded like a play on words. He said “When you change the way you look at things, the things you look at change!” Thanks to my digital video recorder, I was able to g... »

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