Latest Posts
Thermal Analysis Techniques to Improve High Density Semiconductor System Performance
Thermal problems in semiconductor electronic systems often go unnoticed and cause failures. Although thermal problems can be understood and avoided...
How to Transform Innovative Technologies Into Customer-Specific Solutions
Technology innovations don’t reach customers right away. Since 1980 I have observed how our industry has improved key parameters like...
DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging
Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing...
Why is it Taking so Long to Ramp Interposer and 3D IC Designs?
And what are we going to do about it in 2015…? A moment ago I finished reading my predictions for...
3D By Design: A Blog By and For the 3D Design Community
Earlier this year, I published an open letter to chip and system-level designers regarding 3D integration, suggesting they consider 3D...
Are Chip Architects Finally Climbing on the 2.5D and 3D Bandwagon?
Ever since SEMICON West 2014, I’ve been seeing a lot of coverage of the 2.5D and 3D adoption question on...
