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IFTLE 403: TSMC 4th Generation CoWoS; 2018 Singapore EPTC Part 1
Heterogeneous Integration spurs demand for 3D backend solutions Julian Ho reported in the Jan 10th issue of Digitimes that heterogeneous integration...
IFTLE 401: FOWLP for RF; D2W Hybrid Bonding; FOPLP in Samsung Watch
As its name implies, the International Wafer Level Packaging Conference (IWLPC) initially covered wafer-level packaging (WLP) technologies. As all conferences...
IFTLE 398: Samsung’s 256Gb 3DS (TSV-Stacked) RDIMM; IMAPS 2018 in Pasadena
Samsung at the Leading Edge At the recent Samsung Tech Day, the company unveiled several new technologies: Their 7nm extreme ultraviolet...
Citius, Altius, Fortius Redux: More From SEMICON Korea 2018
The Winter Games are over and the athletes returned home, and the SEMICON Korea 2018 teams from February have their...
Citius, Altius, Fortius: Packaging Topics at SEMICON Korea 2018
Winter 2018, and Korea is at the center of the world in both sports and in electronics. Sports, of course,...
Mission Impossible? Not for SEMI!
San Francisco’s Moscone Center (above), the traditional home of SEMICON West trade shows, is undergoing major reconstruction work. Looking at...
A Fan-Out Wafer Level Packaging Epiphany
I’ve had an epiphany regarding fan-out wafer level packaging (FOWLP). Epiphany: “A usually sudden manifestation or perception of the essential...
2015 Retrospective and Outlook for 2016: 3D NAND Flash One-upmanship
“On average since 1885, the yearly height record has gone up by 10 feet (3 meters) each time. Since the...
Can 3D Super-NAND Improve Cost-per-Bit for 3D NAND?
The 3D NAND floodgates just opened a little wider with today’s announcement from BeSang that it has developed 3D Super-NAND...
With 3D Memory Cubes You Can Finally Break Down the Dreaded Memory Wall
In July and August schools are closed and many people like to take vacation. Typically nothing major happens during these...
IoT: Beyond the Hype
All the hype surrounding the Internet of Things has me worried. First of all, its my opinion that the motivation...
Riding Out on a Horse and in on a Goat: 3D IC Predictions for MEMS
The Lunar New Year is soon upon us, and we will be celebrating the Year of the Goat with firecrackers,...
3D NAND Flash, El Capitan and Peacocks’ Tails – An Outlook for 2015
2014: That was a year that was! Many of you, perhaps remembering my outlook missive from last year, must be...
What’s Different for 3D Stacked DRAM Equipment Shipments in 2015?
Why DID you miss your 2014 3D Stacked DRAM equipment shipment forecast? And what’s different about the outlook for 3D Stacked...
Why You Missed Your 2014 3D Stacked DRAM Equipment Shipment Forecast
Remember SEMICON West 2012? How could you forget? It was all clubbing with your customers at The Redwood Room, DNA...
Are we Getting Mixed Messages on 3D IC Production?
While 3D IC production is underway for memory devices, some say demand for 3D ICs is still years away. Could...
News of 3D NAND Fab Construction: A sign of Progress or a PR Ruse?
While I don’t claim to be an expert in 3D NAND technologies, I do keep my eye on what’s happening...
Samsung’s V-NAND Flash at the 2014 ISSCC: Ye Distant Spires…
True to form, Samsung followed up it’s V-NAND Flash announcement of 2013 with a product chip-level presentation at the 2014 IEEE International Solid-State...
