Latest Posts - Page 2
Community Member Monthly News – August 2023
News you may not have seen this month from our community members. Along with some upcoming participation to keep an...
Brewer Science Unveils Innovative Advanced Packaging Solutions at SEMICON Taiwan and Advanced Packaging Summit 2023
Innovative bonding materials presented at leading Asia technology conferences Tapei, Taiwan – August 28, 2023 – Brewer Science, Inc., will...
SEMICON Taiwan – Community Member Preview
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its...
Brewer Science Expands Vichy Manufacturing Center to Support Semiconductor Growth
Vichy, Missouri – August 16, 2023 – Brewer Science, a global leader in developing and manufacturing next-generation materials and products for...
Sustainability 101: Is B Corp Certification In Your Company’s Future?
If you are familiar with B Corp certification, you probably associate B Corps with consumer brands like Patagonia or Ben...
Brewer Science Presents Printed and Flexible CO2 Sensors at Carbon 2023 Conference
Cost-efficient and robust screen-printed sensors are the future of CO2 sensing Cancun, Mexico– July 13, 2023 –Brewer Science, Inc., a...
3D InCites Community Member Monthly Highlights — June
Our 3D InCites Community Members had an abundant amount of news to share this month, so we thought we should...
Brewer Science’s High-Temperature-Stable, Gapfilling Planarizing Material Revolutionizes Advanced ArF and EUV Processes
OptiStack® SOC450 material provides zero shrinkage up to 550°C when baking in N2 June 15, 2023 – Rolla, MO –...
Brewer Science Earns Intel’s 2023 EPIC Distinguished Supplier Award
Brewer Science is one of only 22 Distinguished Award recipients across Intel’s global supply chain Rolla, MO, June 22, 2023 –...
2023 ECTC Community Member Preview
Wow, wow, wow, 3D InCites community members are going to be well represented at next week’s Electronics Components Technology Conference...
Brewer Science and PulseForge Bring Photonic Debonding to Semiconductor Advanced Packaging at Scale
Co-presenting “Photonic Debonding for Wafer–Level Packaging” at CS MANTECH, held May 15-18 in Orlando, FL. Orlando, Florida – April 25,...
Community Member Monthly Highlights — November
Onto Innovation announced the completion of a newly constructed cleanroom manufacturing area on site in Bloomington. Equipped with 20 new...
SEMI Attends COP 27
COP 27 was held in the second and third week of November 2022. In the media, there was news of...
Community Member Monthly Highlights – October
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
Cross-disciplinary Experience is Key to Intern Success
As a graduate student in computer science, I was excited to learn about a machine learning internship at Brewer Science....
U.S. Department of Commerce Appoints Brewer Science Executive to Chips Act Advisory Committee
Brewer Science commends Ken Joyce for appointment to the DOC Industrial Advisory Committee, advising CHIPS for America R&D efforts. ROLLA,...
Community Member Monthly Highlights – September
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
3DInCites Community Members Well Represented at IMAPS Boston — Here’s a Preview
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
