AI

TechSearch International Analyzes Trends in Packages for AI Applications

TechSearch International Analyzes Trends in Packages for AI Applications

Artificial Intelligence (AI) combines both hardware and software.  TechSearch International’s latest analysis explains the packages behind AI applications. AI accelerators found in datacenters require high-density packages to support logic plus high bandwidth memory (HBM). Many silicon interposer designs are in mass production and Intel’s EMIB is also used.  Package-on-package (PoP) is use... »

It’s not the Data, it’s what you DO with it; and Other Conversations from SEMICON West 2018

It’s not the Data, it’s what you DO with it; and Other Conversations from SEMICON West 2018

Emerging technologies like artificial intelligence (AI), machine learning (ML) are driving more than just the semiconductor market. They also drove the conversations I had with everyone I spoke with at and around SEMICON West 2018. Turns out people had lots to talk about. AI and Machine Learning I often think back to the 2010 MEMS Executive Summit in Scottsdale Arizona, when Karen Lightman declare... »

SEMICON West Confirms:  AI is the New Killer-app for Semiconductors

SEMICON West Confirms:  AI is the New Killer-app for Semiconductors

SEMICON West (San Francisco, July 10 to 12) confirmed that our industry’s rapid growth will continue. Machine learning (ML) and artificial intelligence (AI) will be the core technologies for a wide range of new applications. Applying AI to win in new and diverse markets – like autonomous cars, medical equipment, military systems, factory automation and a broad range of consumer products – wi... »

3D InCites Top Picks for SEMICON West 2018

3D InCites Top Picks for SEMICON West 2018

Ok folks. It’s that time of year again. SEMICON West 2018 is upon us. By the time you read this – IF you get the time to read this – it’s almost curtain time. Everything that needs to be prepped is done, and if it’s not, it’s too bad, because the show will go on! It seems like every year, there’s more and more content to choose from. And you must choose because it’s pretty much... »

Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…

Co-Design Comes to ECTC 2018: You Can Lead A Horse to Water…

Despite a valiant effort by the ECTC committee to integrate design topics into this year’s agenda, the number of empty seats spoke volumes: Including two plenary sessions on design-focused topics was one thing; getting packaging and process engineers to attend was quite another. While I attended IC Package Co-Design for HI Systems and AI and Its Impact on System Design, I have to admit, I found ... »

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More

ECTC 2018 To Focus on Heterogeneous Integration for Artificial Intelligence, Wearables, and More

Did you get your ECTC Advanced Program and Registration in the mail yet? Mine arrived yesterday, and I was pleased to see that this year’s Electronics Components and Technologies Conference (ECTC 2018), which takes place May 29-June 1, will be all about the new technology darlings driving development in heterogeneous integration: artificial intelligence, the human-machine interface, wearables, B... »

Living the Dream at SEMI’s Industry Strategy Symposium

Living the Dream at SEMI’s Industry Strategy Symposium

As I noted in my day one coverage of SEMI’s Industry Strategy Symposium (ISS 2018), which took place last week at the Ritz-Carleton Hotel in Half Moon Bay, CA, this was the first time I’d been invited to join the industry elite as a member of the press* at this most coveted annual event. In this role, I was made privy to the inner workings of what makes the semiconductor industry tick, and the... »

When It Comes to Robots and AI, We Draw the Line at Beer

When It Comes to Robots and AI, We Draw the Line at Beer

As one of the current key drivers of the semiconductor industry, the development of robots with artificial intelligence has been on my mind quite a bit recently, second only to autonomous vehicles. I am curious to understand why we, as humans, are driven to develop technology that will surpass us in intelligence. While, among other things, AI is predicted to streamline manufacturing, improve medic... »

Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)

Dinner Conversation at the MEMS and Sensors Executive Congress (MSEC17)

One of the things I like best about the annual MEMS and Sensors Executive Congress (MSEC17) hosted by SEMI-MSIG, is being in the presence of some of the greatest minds in the industry. While the presentations are always top-notch, it’s the stimulating dinner conversations they inspire that I look forward to most. This year, I decided to leave the straightforward reporting to my journalist collea... »

Heterogeneous Integration Makes an End Run Around 7nm Silicon at SEMI ASMC 2017

Heterogeneous Integration Makes an End Run Around 7nm Silicon at SEMI ASMC 2017

I like to think that someday soon a perfectly ripe tomato growing on a vine is going to signal its condition via the 5G network to an AI who knows I love heirloom tomatoes at their peak; my AI will place an order for me based on standing instructions (after first confirming I am indeed expected home that evening, and that I already don’t have too many heirlooms on the counter), and an autonomous... »