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IMAPS 59th International Symposium on Microelectronics: Technical Program and Exhibition Focused on Intelligent Packaging for the AI Era (Heterogeneous Integration & Photonics)
The International Microelectronics Assembly and Packaging Society (IMAPS) will host the 59th International Symposium on Microelectronics (IMAPS Symposium 2026) from...
Here Comes the Sun: Why the Co-Packaged Optics Transition Is “All Right”
Few songs capture the feeling of a long-awaited breakthrough better than the Beatles’ Here Comes the Sun. The song is about...
Koh Young Brings Smart AI Solutions to productronica India 2026 South and Expands Regional Presence
Seoul, Korea – Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will place its Smart AI...
Siemens advances self-verifying agentic AI workflows for semiconductor and PCB design
Combines Siemens’ EDA expertise and software with NVIDIA AI infrastructure and software to improve result quality, time-to-results, tool-calling reliability and...
Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure
$1.5 Billion Multi-Year Advanced Packaging and Development Agreement to Support Expansion of Amkor’s U.S. Advanced Packaging Capacity Amkor Technology, Inc. today...Forge Nano Secures Additional $23 Million in PIPE Financing at $10.00 Per Share, Closes Series D with Samsung Investment Ahead of Public Listing
New commitment brings total PIPE financing to $123 million as Forge Nano continues its path towards its NASDAQ listing All...
Indium Corporation Expert to Present TIMs Solutions for AI Thermal Challenges at IMAPS ThermCon
Learn More and Register Here Indium Corporation® Senior Applications Development Engineer, Engineered Solder Materials (ESM), Ryan Mayberry will present research...
TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States
Taiwan Semiconductor Manufacturing Company (NYSE: TSM) and Amkor Technology, Inc. (Nasdaq: AMKR) today announced a 10-year agreement to foster a...
Siemens partners with Databricks and FFT to turn production data into scalable AI-driven insights
Siemens Industrial Edge and FFT DataBridge connect shopfloor and plant data directly to the Databricks Platform – no IoT middleware...
How Intel Foundry Packaging Technologies Redefine AI and HPC Scalability Limits
By Lori Scott, Senior Director of Marketing, Intel Foundry The Intel Foundry is redefining the scalability limits of artificial intelligence...
Accelerating 2nm & Advanced Packaging through global collaboration
AI is transforming the next-generation advanced foundry for 2nm chips, thus reshaping the semiconductor industry, writes Rozalia Beica. The semiconductor...
From AI momentum to manufacturing reality
AI is moving past the hype, and the first real pressure is showing up in manufacturing. As demand accelerates across...
Siemens collaborates with TSMC to advance AI for Semiconductor Design
Siemens collaborates with TSMC to advance AI-powered automation across the semiconductor design workflow, including AI automated Design Rule Check (DRC)...
Siemens accelerates AI chip verification to trillion‑cycle scale with NVIDIA technology
Siemens and NVIDIA have achieved a major verification breakthrough, capturing trillions of pre‑silicon design cycles in days using Siemens’ Veloce...
Arm expands compute platform to silicon products in historic company first
News highlights Arm extends its platform breadth to include production silicon products for the first time, offering the broadest choice...
Packaging the Future of AI – Key Themes from the IMAPS Device Packaging Conference
This year’s annual International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference (DPC) in Arizona was bursting with excitement and acted...
Applied Materials and SK hynix Announce Long-Term R&D Partnership to Accelerate AI Memory Innovation at EPIC Center in Silicon Valley
March 10, 2026– Joint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth...
Can We Make Data Centers Less Power Hungry?
When the headline reads “Power Usage in Wyoming data center could eclipse consumption if the state’s human residents by 5x,...