Latest Posts
Siemens accelerates AI chip verification to trillion‑cycle scale with NVIDIA technology
Siemens and NVIDIA have achieved a major verification breakthrough, capturing trillions of pre‑silicon design cycles in days using Siemens’ Veloce...
Arm expands compute platform to silicon products in historic company first
News highlights Arm extends its platform breadth to include production silicon products for the first time, offering the broadest choice...
Packaging the Future of AI – Key Themes from the IMAPS Device Packaging Conference
This year’s annual International Microelectronics Assembly and Packaging Society (IMAPS) Device Packaging Conference (DPC) in Arizona was bursting with excitement and acted...
Applied Materials and SK hynix Announce Long-Term R&D Partnership to Accelerate AI Memory Innovation at EPIC Center in Silicon Valley
March 10, 2026– Joint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth...
Can We Make Data Centers Less Power Hungry?
When the headline reads “Power Usage in Wyoming data center could eclipse consumption if the state’s human residents by 5x,...
What is Agentic AI and What Role Can it Play in (Semiconductor) Logistics?
Editor’s note: Stefan Paul, CEO of Kuehne+Nagel attended the 2025 World Economic Forum in Davos in January with a focus...
Unpacking AI’s Power-Hungry Demands
With artificial intelligence (AI) spearheading many of the innovations in the microelectronics industry, Mike Ranjram, assistant professor at Arizona State...
AI and VLSI
What do oxide transistors, ferroelectrics, 2-dimensional channel layers, CFETS, Advanced packaging, AI, and tradewinds have in common? They were all...
SEMICON West 2024: Riding the Generative AI Winds of Change
Deepak Chopra said, “All great changes are preceded by chaos.” Here’s my Aha! moment from SEMICON West 2024: After great...
Solving the AI Puzzle
An AI package is like a puzzle made up of individual pieces of different sizes and shapes, each one essential...
TechSearch International, Inc. Examines Advanced Packaging’s Growth in AI
Advanced Packaging’s Growth in AI TechSearch International’s latest analysis examines the demand for packages used in AI. As the industry...
Who’s Who in China’s AI Chip Industry
Since 2015, China’s artificial intelligence (AI) industry has developed rapidly through the promotion of a wide range of technologies. From...
How AI & Machine Learning Are Reshaping the Way Transit Systems Move Traffic Patterns
Of the many ways artificial intelligence (AI) and machine learning are poised to improve modern life, the promise of impacting...
ML/AI in Semiconductor Packaging and Electronics Manufacturing
As the semiconductor packaging technology evolves in the “More than Moore” era, many advanced processes have presented challenges in manufacturing....
Autonomous Vehicles Drive AI Advances for Edge Computing
Advances in Edge Computing Must Innovate for Autonomous Vehicles to Realize Their Potential Large numbers of sensors, massive amounts of...
Before SEMICON West 2020, There was IMEC ITF USA 2020
Each year as SEMICON West approaches, I look forward to the IMEC ITF USA event. For the past several years...
Hyris Brings its Coronavirus Environmental Testing Kit to U.S.
The fast-reacting kit allows users to test surfaces on-site or remotely for Coronavirus in just over an hour, providing validation...
5G, AI, and Server Markets Provide Growth, Despite Pandemic
Despite the economic downturn caused by the fight against the Covid-19 virus pandemic, there are some potential growth areas this...
