Latest Posts - Page 2
Si Photonics: 3D ASIP’s Pre-game Show
Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story...
Catching Up With Steve Breit, Coventor, at the TSensors Summit
A journey of a trillion sensors begins with a single step. The TSensors Summit, held at Stanford University on 23... Interview with Fraunhofer IZM-ASSID’s Juergen Wolf: The Collaboration Grows
A few months ago, Juergen Wolf, director of the 3D program at Fraunhofer IZM-ASSID, shared with me a beautifully photographed...
SPTS Ships 1000th DRIE Process Module
Milestone shipment extends company’s leadership in DRIE Newport, United Kingdom, and SEMICON Singapore, 7 May, 2013 – SPTS Technologies, a supplier...
SUSS MicroTec Announces Follow-up Order for 300mm Bonding Tools for HVM 3D ICs
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets has received a...Tour de France in 3D – Day One
Arrived in Paris, 6:55am. Checked in to L’hotel Petit Madeline 8:00am.Tour de France in 3D – Day 3
When it comes to fully understanding 3D integration processes, Sarah-Lyle Dampoux (my tour...Mark your 3D event calendars
A few months back when Ziptronix first revealed details about its direct bond interconnect(DBI), CEO Dan Donabedian told me...3D technology research gets another shot in the arm
It looks like it's 3D to the rescue again. I love it. Yesterday, a collaboration was announced by Semiconductor...
