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By Abdelhamid El-Sawy, Ph.D., Senior R&D Scientist and Bud Troche, Senior Director of Wafer Level Packaging, MacDermid Alpha Electronics Solutions Hybrid bonding is reshaping advanced packaging by enabling ultra-fine pitch copper-to-copper interconnects, essential for high-bandwidth memory (HBM), chiplet integration, and 3D heterogeneous systems. While alignment precision, oxide control, and chemical...
The growing demand for semiconductors, from the cloud to the edge, from artificial intelligence (AI) to 5G communications, has exceeded the capabilities of traditional silicon scaling. In the “More than Moore” era, performance requirements for leading-edge semiconductor devices demand extremely fine pitch (<10µm, or even <1µm) interconnection in semiconductor packaging...
For decades, Moore’s Law has been a way to measure performance gains in the semiconductor industry, but the ability to double the density of transistors on a chip every two years is becoming increasingly challenging. With scaling reaching its limit, manufacturers are looking to advanced packaging innovations to extend the...
With over 350 papers in 36 oral sessions and 5 interactive presentations, there was no shortage of content to absorb at the 2023 Electronics Components Technology Conference (ECTC 2023), which took place May 31-June 2 in Orlando, FL. The keynote and panel sessions discussed technical topics including quantum computing, chip-to-wafer...
Hybrid bonding enables an assortment of possible chip architectures, mainly targeted at high-end applications including high-performance computing (HPC), artificial intelligence (AI), servers, and data centers. As the technology matures, further growth is projected into consumer applications, memory devices including high bandwidth memory (HBM), and mobile and automotive applications that could...
Continuing our look at key Hybrid Bonding (HB) papers at the recent ECTC 2022 in San Diego, CA. Applied Materials Hybrid bonding requires a lot of front-end processing tools, thus you can expect Applied Materials (AMAT) to be an entrant in this technology. In its paper “A Holistic Development Platform...
The 72nd IEEE Electronic Components and Technology Conference (ECTC) took place at the end of May in San Diego CA. We all know by now that ECTC is the premier microelectronic packaging conference in the world. While I was not able to attend in person, it was NOT due to...
Successful full-system die-to-wafer transfer at EVG’s Heterogeneous Integration Competence Center™ demonstrates an important step forward in process maturity EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and...
On Definitions and Buzzwords Long-time readers of IFTLE know that I’m sensitive about nomenclature and buzzwords. For instance: “nanotechnology” and “internet of things” are buzz words that are being used way too loosely and have little meaning. I’m OK with 2.5D because I was there when it was first uttered...
Joint Development Program will offer highly configurable, ultra-precision end-to-end hybrid bonding solutions to suit various applications, with optimal line balancing and process requirements ASM PACIFIC TECHNOLOGY (ASM) and EV GROUP (EVG) announced the signing of a joint development agreement (JDA) to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications. Die-to-wafer hybrid bonding...
