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What to Expect at Virtual SEMICON West 2020

This feels weird, folks. For the first time in 15 years, I didn’t board a flight bound for SEMICON West on the Monday after July 4th.  That was expected since the dates got pushed out by two weeks this year. But now that the event will be held virtually, I’m...

IEDM 2019: Innovative Devices for an Era of Connected Intelligence

The IEEE International Electronic Devices Meeting (IEDM) been one of my favorite conferences for many years. Early in my career, I worked with Roger Haken at Texas Instruments on some of the work he published on materials for trench DRAM. Later on, the papers presented at IEDM helped me help...

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

In addition to Francoise’s post about technology megatrends here, below is part one of my perspective, mostly about the SEMICON West keynotes. Design and Manufacturing Are Finally Combining From July 9-11, many IC manufacturing experts came together at SEMICON West in San Francisco’s very nicely renovated Moscone Center. As an industry...

Extending Moore’s Law through Advanced Packaging

The performance and productivity of microelectronics have increased continuously over the last 50 years due to the enormous advances in lithography and device technology. Today, these technologies are becoming prevalent in 3D packaging, which further enables advances in integrating various technologies (logic, memory, RF, sensors, etc.) in a small form...

CoolCube™: More than a True 3D VLSI Alternative to Scaling

Almost four years ago, we published an article titled “CoolCube™: A True 3DVLSI Alternative to Scaling” on 3D InCites. It described the concept of stacking layers of transistors sequentially on top of each other and documented the research effort happening at Leti to develop a feasible process integration scheme and...

How Do We Create Smart Cities Without Exploiting Personal Data?

Creating smart cities while also protecting the personal data of its citizens is no easy task these days, particularly with growing public awareness and concern about how their data is being used and shared. It’s become a challenge particularly in Europe, where urban designs lend themselves well to smart city...

3D InCites Guide to SEMICON WEST 2016

In past years, we have provided 3D InCites readers with a guide for navigating through the myriad programs that specifically address 3D integration and packaging at SEMICON West. This year, as SEMI has discovered, everything has changed; and thus they themed SEMICON West 2016, “Definitely NOT business a usual.” As...

The Advanced Packaging Industry Reaches its Zenith

To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies. Leaders in the advanced packaging industry have identified new solutions enabling more and more functionalities to be integrated along with many devices in the same...