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Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth sharing from the month previous. If we missed you this month, be sure to add us to your distribution list, we don’t want to leave anyone out. Our community members...
MILPITAS, Calif., Sept. 29, 2022 /PRNewswire/ — KLA Corporation (NASDAQ: KLAC) has announced plans to build a new research-and-development (R&D) and manufacturing center for the SPTS division, in Newport, Wales, UK. The new development designed to meet BREEAM standard of sustainability rating of excellent is expected to include a capital...
Highly-filled, fast-flow material balances reliability and processability, extends company’s package-level underfill leadership with multi-format solutions SEOUL, South Korea, Sept. 14, 2022 /PRNewswire/ — Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications. The material, Loctite EccobondUF 9000AG, enables advanced silicon (Si) node...
We’ve had several clients in both the semiconductor and sustainability spaces this week giving a variety of opinions on how the CHIPS and Science Act of 2022 – now formally signed into U.S. law – might affect their business. CHIPS stands for Creating Helpful Incentives to Produce Semiconductors. The act...
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. About 1,500 professionals from the global microelectronics packaging industry are set to gather next week...
AC3 Fusion is a versatile and more sustainable solution for temperature test in wafer probing MUNICH, APRIL 22nd, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing an extension of the renowned AC3 thermal chuck system, called Fusion. The system...
A Conversation with KLA’s Lena Nicolaides 2021 was a big year for the semiconductor industry, and 2022 is expected to be even bigger. Ironically, despite the mayhem it caused, the chip shortage and its impact on the global supply chain turned out to be the best advertising we could have...
HALF MOON BAY, Calif. — April 5, 2022 — SEMI Industry Strategy Symposium (ISS) 2022 opened yesterday with the theme Semiconductors Leading a Transforming World to highlight semiconductor industry growth opportunities and challenges. The annual three-day conference of C-level and senior industry executives gives a comprehensive outlook of global electronics...
Wafer-level packaging (WLP) saw significant growth in 2021 due in large part to the increased performance needs of data-driven 5G network devices. Because WLP is performed when chips are still on the wafer, ACM Research has been able to leverage and adapt our expertise in front-end solutions to address high-volume...
Last year, we put our money where our mouth is. Instead of just talking about how diversity, equity, and inclusion (DEI) is critical to the future of the semiconductor industry, we created the 3D InCites DEI Fund to help tech start-ups owned by women and under-represented minorities grow and thrive....
