Press Releases

Koh Young America Expands Sales Network with Electronic Assembly Products for Colorado and Utah

Koh Young America, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce the addition...

ACM Research Announces Qualification of High-Temperature SPM Tool for Customer in China

ACM Research, Inc., a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, announced its Single-Wafer High-Temperature...

MSTC 2025 to Spotlight Strategies for Bringing MEMS and Sensors Advancements to Market

MEMS and Sensors Technical Congress (MSTC) 2025, the premier technical event on designing, building, and using sensors, will gather industry leaders from...

Brewer Science’s Dr. Douglas Guerrero Honored as SPIE Fellow

SPIE, the international society for optics and photonics, selected Dr. Douglas Guerrero, Senior Technologist at Brewer Science Inc., as a new...

Indium Corporation Powering Sustainability at APEC 2025

As one of the leading materials providers in the electronics assembly and solder industries, Indium Corporation® is proud to feature its lineup...

2025 IEEE Electronic Components and Technology Conference Highlights Microelectronics Packaging and Component Breakthroughs

More than 2,000 scientists, engineers and businesspeople are expected to attend the 75th annual IEEE Electronic Components and Technology Conference (ECTC) from May...

Indium Corporation to Introduce New Heat-Spring® HSx Metal Thermal Interface Material for Semiconductor Test at TestConX

Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx...

SEMI Energy Collaborative Releases Recommendations for Building Low-Carbon Energy Supply in Singapore

The SEMI Energy Collaborative today publicly released its analysis and report: Challenges and Potential Solutions for Acceleration of Low-Carbon Energy Deployment in Singapore. Now...

Indium Corporation Expert to Present on Gold Solder Solutions for Medical Applications at IMAPS 2025 Workshop

Indium Corporation Senior Product Specialist, Jason Farrell, will deliver a technical presentation at the IMAPS Advanced Packaging for Medical Microelectronics Workshop,...

StratEdge to Showcase its Latest Molded Ceramic Packages at Upcoming Industry Conferences

StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, will reveal its newest molded...

Brewer Science to Present at SPIE Advanced Lithography + Patterning 2025

Brewer Science, Inc., an industry pioneer in advanced lithography and patterning innovation, will present its ground-breaking developments in addressing scaling...

ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications

Advanced Semiconductor Engineering, Inc. (ASE) officially launched its fifth plant in Penang, Malaysia. The new plant will see improved manufacturing...

Speakers at Inaugural SEMIEXPO Heartland Event to Highlight Advancements in Smart Manufacturing and Smart Mobility

SEMIEXPO Heartland, SEMI’s first Midwestern U.S. exposition to be held April 1-2 at the Indiana Convention Center in Indianapolis, will...

Global Semiconductor Manufacturing Industry Reports Solid Q4 2024 Results, SEMI Reports

The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-on-year (YoY) growth across most of the...

EV Group Highlights Revolutionary Temporary Wafer Bonding and Debonding Solution for HBM and 3D DRAM at SEMICON Korea

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...

Nova Completes Acquisition of Sentronics

Nova announced that it completed the acquisition of Sentronics Metrology GmbH, a privately held company headquartered in Germany. The transaction...

Nordson Electronics Solutions Introduces the ASYMTEK Select Coat® SL-1040 Ultrasonic Cleaning Station

See this unique nozzle cleaning system and speak with our experts at IPC APEX booth 3200 Nordson Electronics Solutions, a...

Trymax Joins Accuron Technologies Group for Further Growth and Expansion

Accuron Technologies (Accuron), a global precision engineering and technology group, secured a controlling interest in Trymax Semiconductor Equipment (Trymax), a...