Press Releases

Inaugural SEMIEXPO Heartland Event Underscores Midwestern U.S. as a Global Hub for Smart Manufacturing and Smart Mobility

The inaugural SEMIEXPO Heartland event welcomed leaders in smart mobility and smart manufacturing to the Indiana Convention Center to explore opportunities for...

Mycronic Global Technologies Acquires RoBAT

Mycronic’s Global Technologies division has acquired RoBAT, a company headquartered in the United Kingdom, which has developed a technology for...

Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council Conference

Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, is pleased to announce that Dr....

Student Engagement and Involvement is a Major Focus of the Upcoming 75th Annual IEEE Electronic Components and Technology Conference

The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging...

Indium Corporation Earns Two New Product Awards for High-Reliability Flux-Cored Wire and Solder Alloy

Indium Corporation, a leading materials provider for the electronics assembly market, earned two CIRCUITS ASSEMBLY New Product Introduction (NPI) Awards for...

ASE Demonstrates CPO that Improves Energy Efficiency for AI applications

Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced that it has demonstrated a co-packaged...

NHanced Semiconductors President Robert Patti to Detail “Foundry 2.0” at SEMIEXPO Heartland

New manufacturing model extends Moore’s Law via advanced packaging, employing a range of 3D IC processes for Foundry 2.0 At...

Finetech Introduces FINEPLACER® femto pro for Advanced Packaging

Finetech proudly introduced the FINEPLACER® femto pro, the next generation in automated multi-purpose bonding technology. Engineered for high-yield and sustainable...

Koh Young Presenting on Real-Time Process Optimization at SEMI Heartland 2025

Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce that Luis Rivera,...

Global Fab Equipment Investment Expected to Reach $110 Billion in 2025

Global fab equipment spending for front-end facilities in 2025 is anticipated to increase by 2% year-over-year (YoY) to $110 billion,...

Indium Corporation to Showcase Innovative Materials Powering AI Technology at Productronica China

As a proven leader in metal-based thermal interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio...

Brewer Science Showcases Water Quality Sensor Innovations at NextFlex Innovation Days 2025

Dr. Brewer’s Keynote Address Challenges the Industry to Rethink the Future of Hybrid Electronics Brewer Science, Inc., a global leader...

Dr. Yan Liu of Indium Corporation Named as MACNY 2025 Innovator of the Year

MACNY, The Manufacturers Association, is proud to announce Dr. Yan Liu, Director of Global Research and Development (R&D) at Indium...

EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI® Automated Production Wafer Bonding System

EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...

Ainos and ASE Partner to Power AI Scent Digitization in Semiconductor Manufacturing

Harnessing AI-Powered Scent Digitization for Smarter, Safer, and More Sustainable Factories Ainos, Inc., a leader in AI-driven scent digitization, has...

Mycronic Global Technologies Division Acquires Hprobe

Mycronic’s Global Technologies division has acquired Hprobe, a company headquartered in Grenoble, France, which has developed a unique technology for...

Brewer Science Advances Midwest Semiconductor Growth at SEMIEXPO Heartland 2025

Dr. Terry Brewer Named Honorary Chairman as SEMIEXPO Heartland Focuses on Smart Manufacturing, Mobility, and Workforce Development Brewer Science, Inc.,...

Koh Young Showcases Inspection Innovations at IPC APEX EXPO 2025

Koh Young, the global leader in True3D measurement-based inspection solutions and the exclusive premier sponsor of IPC APEX EXPO 2025,...

SurplusGLOBAL Establishes European Branch in Munich, Germany, and Appoints EMEA Manager

SurplusGLOBAL, a global leader in the legacy semiconductor equipment industry, has officially announced the establishment of its European branch, SurplusGLOBAL...