IFTLE 509: IEEE 3DIC 2021 – Glass Embedding and 3D Retinal Prosthesis
Jan 20, 2022 · By Phil Garrou · Blogs, Packaging IFTLE
Latest Posts - Page 6
IFTLE 404: One Micron RDL; FOWLP Die Shift; Antennas for FOWLP
In this IFTLE post, we continue our look at presentations from the 2018 EPTC Conference… Ultratech / IMEC / JSR...
IFTLE 403: TSMC 4th Generation CoWoS; 2018 Singapore EPTC Part 1
Heterogeneous Integration spurs demand for 3D backend solutions Julian Ho reported in the Jan 10th issue of Digitimes that heterogeneous integration...
IFTLE 402: Advanced Packaging Underfills; JEDEC Updates HBM Memory Standard; Intel Foundry Business
Continuing our look at presentations from the recent 2018 IWLPC conference, let’s look at the Jiw Pai Henkel presentation on...
IFTLE 401: FOWLP for RF; D2W Hybrid Bonding; FOPLP in Samsung Watch
As its name implies, the International Wafer Level Packaging Conference (IWLPC) initially covered wafer-level packaging (WLP) technologies. As all conferences...
IFTLE 400: Intel Logic-Logic 3DIC and Chiplets are Finally Here
At the Intel “architecture day” held Dec 12th in Santa Clara, Intel finally announced what some of us have been...
IFTLE 399: Polymer Dielectric Updates from HD Micro, Taiyo Ink, Toray and MicroChem
Who was Madeline on Halloween? Before we start more tech coverage of IMAPS 2018 with a look at polymer dielectric...
IFTLE 398: Samsung’s 256Gb 3DS (TSV-Stacked) RDIMM; IMAPS 2018 in Pasadena
Samsung at the Leading Edge At the recent Samsung Tech Day, the company unveiled several new technologies: Their 7nm extreme ultraviolet...
IFTLE 397: Malicious Embedded Chips? And TSMC Rides the Leading Edge
Malicious Embedded Chips in our Mother Boards? Early October brought a report from Bloomberg that I have heard was the top...
IFTLE 396: DARPA Envisions CHIPS as New Approach to Chip Design and Manufacturing
First a word on the change in venue… After working with Pete Singer at Solid State Technology from 2010-2018 and...
Dr. Phil Garrou Makes the Move to 3D InCites
Yes. You read that right. It is my great pleasure to announce that Dr. Phil Garrou is joining 3D InCites...