2023 ECTC Community Member Preview
May 23, 2023 · By Trine Pierik · 3D Event Coverage
Latest Posts - Page 14
3D R&D Round-up: MIT Lincoln Labs works on SOI
At MIT Lincoln Labs (MITLL), R&D processes developing 3D chips using silicon-on-insulator (SOI) wafers is the sole focus. As Phil...TSV Seminar Looks Back to the Future of Etch
Attending last week’s TSV Seminar in Tokyo, hosted by Electronic Journal, posed a bit of a challenge as all but...Discussion Summary: Overcoming weaknesses in dry processes for TSV metallization
This week’s online forum with Alchimer’s executive team, Steve Lerner, CEO; Kathy Cook, Director of Business...SUSS MicroTec workshop zeroes in on wafer thinning and handling issues
Last year, it was all about through silicon vias (TSVs), this year, it’s all about everything else needed to...
3d is hot at SEMICON West
Given the building momentum around 3D integration schemes and the attention it's getting as the semiconductor bright spot, it's...