SUSS MicroTec workshop zeroes in on wafer thinning and handling issues
Last year, it was all about through silicon vias (TSVs), this year, it’s all about everything else needed to...
Francoise News - Page 58
IMEC and SUSS MicroTec to collaborate on wafer bonding for 3D integration
SUSS MicroTec and IMEC have entered a joint development program to develop permanent bonding, temporary bonding...Trends and challenges for thin wafer processing
Processes addressing the handling of ultra-thin wafers have been a hot topic ever since it became clear that they are...A Visit to SUSS MicroTec
It’s been...
A Visit to Nexx Systems
It’s easy to see why NEXX is experiencing growth. It’s all about attitude, and the enthusiasm among NEXX’s team...
SEMI and Semi-Directory Launch Semiconductor Supplier Guide
SEMI and Semi-Directory team up to launch a comprehensive industry-wide supplier guide.My Big Fat 3D Obsession
In one of my all-time favorite movies, My Big Fat Greek Wedding, family patriarch, Kosta Portukalo is obsessed with his...3d is hot at SEMICON West
Given the building momentum around 3D integration schemes and the attention it's getting as the semiconductor bright spot, it's...
