Francoise News - Page 44
CEA-Leti Launches Open 3D(TM) Initiative
CEA-Leti today announced the launch of a major new platform that provides industrial and academic partners with a global offer...Soitec announces successful completion of acquisition of Altatech Semiconductor
Soitec announced the successful completion of its acquisition of all of the outstanding shares composing the capital of Altatech Semiconductor S.A., a...EDA Approaches to 3D IC Tools
When I was in high school and then in college, I used my mother’s Smith-Corona MANUAL typewriter to write all...Ziptronix Direct Oxide Bond Technology Gains Momentum
At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the...Sales of Amkor Technology’s Next Generation Through Mold Via Package-on-Package Solutions Surpass 100 Million Units
Amkor Technology, Inc. , a leading provider of semiconductor assembly and test services, today announced that its innovative Through Mold...The Great 3D Supply Chain Debate: The Handoff
The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far...Rambus and ITRI Collaborate to Develop Interconnect and Advanced 3D Packaging Technologies
Rambus Inc, one of the world's premier technology licensing companies, announced today it is engaging with the Industrial Technology Research...The Many Dimensions of 3D Adoption
Day Two of 3D ASIP and even though the conference opened with declarations that “3D is here” it’s clear after...3D Integration: It’s HEEEEEEERE!
Got up before dawn to catch the 6am flight to SFO for RTI’s 3D Architectures for Systems Integration and Packaging...IEDM Panel Gives 3D the Green Light
Word on the street is, if 3D is serving a niche market, it’s going to be a big niche! At...BiTS Workshop Rebrands to Keep Pace with Packaging Evolution
The Burn‐in & Test Socket Workshop (BiTS Workshop) announced today that it is changing its name to The Burn‐in &...Ziptronix Goes Commercial
Ever since I got involved in the world of advanced packaging, and particularly 3D, I’ve had a soft spot for...MonolithIC 3D Inc. Issued 5th Patent on 3D IC Technology
MonolithIC 3D Inc., a Silicon Valley startup, announced today that it has been issued its fifth patent on monolithic 3D-IC...Applied Materials Announces Atomic-Level Film Treatment to Reduce Chip Power Consumption
Applied Materials, Inc. today announced a breakthrough technology for reducing power consumption in semiconductor chips with its new Applied Producer® OnyxTM...Ziptronix CTO to Speak at RTI Meeting on 3-D Architectures For Semiconductor Integration and Packaging, Dec. 14
Paul Enquist, Ziptronix Inc.’s chief technology officer and vice president of R&D, will provide an update on direct bond technology...IEDM 3D Panel: Is 3D Just Hype?
We’ve been hearing so much lately from the 3D integration cheering section, that it’s actually hard to believe that there...
