CEA-Leti today announced the launch of a major new platform that provides industrial and academic partners with a global offer...
Soitec announced the successful completion of its acquisition of all of the outstanding shares composing the capital of Altatech Semiconductor S.A., a...
When I was in high school and then in college, I used my mother’s Smith-Corona MANUAL typewriter to write all...
At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the...
Amkor Technology, Inc. , a leading provider of semiconductor assembly and test services, today announced that its innovative Through Mold...
The supply chain business model for manufacturing 3D stacked ICS has caused perhaps one of the hottest debates so far...
Rambus Inc, one of the world's premier technology licensing companies, announced today it is engaging with the Industrial Technology Research...
Day Two of 3D ASIP and even though the conference opened with declarations that “3D is here” it’s clear after...
Got up before dawn to catch the 6am flight to SFO for RTI’s 3D Architectures for Systems Integration and Packaging...
Word on the street is, if 3D is serving a niche market, it’s going to be a big niche! At...
The Burn‐in & Test Socket Workshop (BiTS Workshop) announced today that it is changing its name to The Burn‐in &...
Ever since I got involved in the world of advanced packaging, and particularly 3D, I’ve had a soft spot for...
MonolithIC 3D Inc., a Silicon Valley startup, announced today that it has been issued its fifth patent on monolithic 3D-IC...
Applied Materials, Inc. today announced a breakthrough technology for reducing power consumption in semiconductor chips with its new Applied Producer® OnyxTM...
Paul Enquist, Ziptronix Inc.’s chief technology officer and vice president of R&D, will provide an update on direct bond technology...
We’ve been hearing so much lately from the 3D integration cheering section, that it’s actually hard to believe that there...
SEMATECH’s 3D Enablement Center (3D EC), together with the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC), has identified...
The partners in a new European research project today announced details of the multinational/multidisciplinary 'SMArt systems Co-design' (SMAC) program. This...
Two weeks ago, wearing my Chip Scale Review Sr. technical editor hat, I attended (along with 11 other journalists) an...
All Silicon System Integration Dresden (ASSID), a leading-edge microelectronic wafer-level packaging and system integration center operated by the Fraunhofer IZM...
