Francoise News - Page 11
Seen on the Scene at SEMICON Europa 2018
SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without...
Closing Out My 2018 Conference Season With SEMICON Europa and Electronica
In the past 10 weeks, I’ve attended five conferences: two in Europe, and three in California. Two focused on MEMS...
UnitySC Unveils New Inspection System for the Advanced Packaging and Wafer Processing Ecosystem
Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the...
The MSEC 2018 Technology Showcase: Who Owns the Data?
The competition was fierce and the stakes high for the annual MSEC 2018 technology showcase. which took place during the...
MSEC 2018 Keynote Speaker Examines the Growing Importance of Cybersecurity
Just over a year ago, Napa Valley was in flames, and the annual MEMS and Sensors Executive Congress (MSEC) had...
Talking Nerdy with Exhibitors at IWLPC 2018
With heterogeneous integration, 3D, and advanced wafer-level packaging technologies officially declared the rising stars of the semiconductor industry, materials, process...
Bridging the Interconnect Pitch Gap Calls for 3D Technologies
Last week at IWLPC, keynote speaker, Doug Yu, TSMC, kicked off the event with a similar storyline used by ASE’s...
Hello, Microelectronics and Packaging? Your Opportunities are Calling
There’s no doubt about it. This is a good time to be in the microelectronics and packaging sector of the...
And the winners of the MEMS, Imaging and Sensors Summits tech showcases are…
The technology showcases at the European MEMS and Sensors and Imaging Sensors Summits give start-ups and established companies alike ten...
How Do We Create Smart Cities Without Exploiting Personal Data?
Creating smart cities while also protecting the personal data of its citizens is no easy task these days, particularly with...
Dr. Phil Garrou Makes the Move to 3D InCites
Yes. You read that right. It is my great pleasure to announce that Dr. Phil Garrou is joining 3D InCites...
Ain’t No Mountain High Enough to Keep Rozalia Beica From Success
“Driven” doesn’t even begin to describe Romanian-born Rozalia Beica, global director, strategic marketing, DowDupont. Neither rain, nor sleet, nor whizzing...
3D VLSI is the New Active Interposer
3D very large system integration (3D VLSI) has many aliases. This high-density approach to 3D system integration first appeared on...
Will Fully-Autonomous Vehicles Ever Take Over Our Roads?
At the 2018 European MEMS, Imaging and Sensors Summits, I detected a shift in sentiment around the likelihood (and the...
MEMS, Imaging, and Sensors Summits Show The Power of Collaboration
Last week, at the co-located 2018 European MEMS and Sensors/Imaging and Sensors Summits, held in Grenoble, France, I had the...
Why Today’s Advanced Packages Need Better Inspection and What’s Being Done About It
It’s almost ironic. As CMOS scaling (aka: Moore’s Law) has slowed due to the increased complexity and cost of achieving...
Research Scientist, Maaike M. Visser Taklo, Rises to Her Own Challenge
Throughout my years of writing about the semiconductor industry, I’ve met women from all over the world. I’ve often wondered...
Diversification of Markets Calls for Hybrid Metrology with Multi-Sensor Technology
It used to be that people thought about metrology for front-end process control and inspection for advanced packaging. As wafer...
