Bill News
Silicon Patents: Repeating the Past
“Those who cannot remember the past are condemned to repeat it” ~ George Santayana Over the past forty years, the presence of legally protected Intellectual...
A Perfect Storm is Brewing for Complex Packaging in 2016
If I had not attended the 2015 3D ASIP conference, my outlook for 2016 would have been less upbeat for...
PDN Noise: PDN and Signal
In a previous blog, I discussed a power design network’s (PDN) self and transfer impedances. Self impedance highlights anti-resonances causing a...
PDN Design, Target Impedance and Path Finding for IC, Package, and PCB
I am fortunate to work with Prof. Madhavan Swaminathan, Founder, CTO, E-System Design, and inventor of our algorithms. Long ago,...
Subscription Renewals: Can We Move to the 21st Century?
If my fitness regimen can be Internet enabled, why can’t my magazine subscription renewals be? We all get them. Some...
Path Finding and 3DPF
In the past year, I have written short pieces explaining how Path Finding methodology can proactively help identify viable solutions...
Is Complex Packaging in High Volume Manufacturing (HVM)?
Over the past year… The amount of 2.5/3D articles published has gained momentum. Some articles discuss when HVM will be achieved for...
RIP ITRS V1.0: 1992-2015
Prior to 1992, the high technology industry was ‘immature’. Each supply chain vendor (equipment, materials) would accumulate input from their...
Can Path Finding be used in the Production Environment?
In previous posts, I have discussed various scenarios when Path Finding can be used. All were focused on the early...
Micro vs. Macro 3D IC Cost Analysis: Can we learn from the mid 1980’s?
Amy Palesko from SavanSys Solutions wrote an excellent 3D IC cost analysis article (The Cost of 3D ICs) on 3D...
Path Finding Series Part 3: The Cost of Non-robust Design
In previous posts, I discussed a process for process-centering a design. In this post, we will examine how non-robust design’s...
Path Finding Series Part 2: What if I do not have a robust design?
In previous posts, I discussed Robust Design analysis as orthogonal Path Finding. This analysis is performed while the design implementation...
Path Finding Series Part 1: NOT a One-trick Pony
In previous posts, I discussed a classical Path Finding methodology.¹ Classical is when various design variables are arranged in different...
Can Product Design learn a Trick from Manufacturing?
You might think this is crazy but bear with me for 421 words. Early in my career, I worked at...
3D By Design: Exploring Viable Path Finding
Fruitful path finding eventually identifies solutions that are viable for mechanical, electrical, thermal, and cost (METC) requirements. Hopefully, more than one...
3D By Design: Are Path Finding Tools the Missing Link?
TechSearch International’s recently published 3D IC Gap Analysis report has a section for a new class of tools called Path...
A Path Finding Based SI Design Methodology for 3D Integration
3D integration is being touted as the next semiconductor revolution by industry. 3D integration involves the use of various interconnects... Path Finding: Who Performs and When?
Microelectronic products all have mechanical, thermal and electrical properties that degrade until the device is permanently damaged. Path finding adds... 