Trine Pierik

Trine Pierik is the 3D InCites community membership director. She is responsible and committed to…

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What’s on the agenda for the 2020 IMAPS Device Packaging Conference (DPC)? So much, and too much to share it all. Our 3D InCites Community members and sponsors are playing key roles…

Booth 56: StratEdge Corporation

StratEdge Corporation, a leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, will have applications specialists available on hand to discuss the many packages available for DC to 63+ GHz and its package assembly services.

Packages include:
• Post-fired ceramic, low-cost molded ceramic, and ceramic QFN packages
• The LL family of leaded laminate copper-moly-copper (CMC) base packages3D InCites Community Members
• High-power semiconductor packages
• Off-the-shelf molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18 GHz. These packages provide enhanced thermal dissipation for high-power gallium nitride devices and come in fully hermetic versions in over 200 standard outlines.
• High-reliability packages that meet stringent military applications. The packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies.

Booth 1: Micross AIT

Micross AIT offers advanced packaging and 3D integration solutions that enable higher-performance systems with decreased size, weight, and power (SWaP). Micross AIT houses an ITAR-registered microfabrication facility that allows them to provide development, custom (flexible) prototyping and production services for its customers. The company provides a comprehensive array of advanced interconnect technologies for realizing its customers’ next-generation electronic systems which include:

  • 3D integration technology: TSV, TGV, Si interposers, 3D IC
  • Advanced interconnect and packaging technologies: Solder bumping, Cu pillar, Cu-based microbumps, IIC Quilt Packaging™ interconnect fabrication
  • Flip-chip & Multi-chip module assembly, including patented PADS fluxless assembly process
  • Novel microfabricated devices, including IR sensor and thin-film thermoelectric solutions
  • Microstructure fabrication and packaging: Monolithic integration, vacuum microelectronics, wafer-level vacuum/hermetic packaging
    Microfabrication facility offering development, custom (flexible) prototyping & small-volume production services for our customer

Booth 32: SPTS Technologies

SPTS Technologies will be exhibiting its wafer processing technologies and solutions. Paul Gray from SPTS will be presenting a paper titled, “Through silicon via undercut profile optimization for 3D packaging applications” at 4:00 pm on Tues 3rd March, in the 3D Integration track. SPTS Technologies, a KLA company, designs, manufactures, sells, and supports advanced etch, PVD, CVD and MVD® wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the advanced Packaging, MEMS, high speed RF device, power management and LED manufacturing.

Booth 47: ASE Group

ASE Group’s John Hunt will be leading a professional development course on Monday afternoon, March 2, entitled Development of Advanced Fan Out Technologies. Note that his morning course, Introduction to Fan-out Technologies has been canceled. Mark Gerber will also be leading two PDCs on Monday: System-in-Package (SiP) System Solutions Through Miniaturization and The Evolution of Flip Chip Package Technology.

Additionally, don’t miss ASE’s Yin Chang present on the topic of Integration Technologies Transforming the World, as part of the Global Business Council, which takes place Wednesday morning, March 4, from 9-noon.

Booth 38: Amkor Technology

Amkor Technology has a full conference schedule leading several track sessions and eight presentations over the three-day event. Packaging experts will be on hand at the booth daily to answer questions and discuss your IC packaging needs.

Presentations Schedule:

Tuesday, March 3
10:30-11:00 AM
“Design Process & Methodology for Achieving High-Volume Production Quality for HDFO Packaging”
11:00-11:30 AM
“Achieving Success in Automotive Leadframe Packages”
12:00-12:30 PM
“Thermal Management Implications for Heterogeneous Integrated Packaging”
2:00-2:30 PM
“The New Technology Solutions for Advanced SiP Devices”
3:00-3:30 PM – “Enhancing the Punch MLF®/QFN Package for Improved Robustness in Automotive Applications”
4:30-5:00 PM
“Thin Quad Die Package (QDP) Development”
Wednesday, March 4
1:30-2:00 PM
“Heterogeneous Packaging, Chiplets and the Quest for Higher Performance”
5:30-6:30 PM
“Thermal Cycling of Aerosol Jet® Printed Silver Interconnects”

Additional Presentations from 3D InCites Community Members 

Tues 5-5:30 pm
Die Crack Prevention and Detection in Advanced Packaging
Woo Young Han, ONTO Innovation

Wed 2:30-3 pm
Applications of Novel High-speed In-line Automatic X-ray Inspection in High-volume Manufacturing
Frank Chen, SVXR, Inc.

Wed. 5:00-5:30 pm
Cu Interconnect Scaling with Hybrid Bonding for 2.5 and 3D Integration
Laura Mirkarimi, Xperi (Thomas Workman, Gill Fountain, Guilian Gao, Jeremy Theil, Gabe Guevara, Bongsub Lee, Dominik Suwito, Pawel Mrozek)

Thurs. 10:15-10:45
Collective D2W Hybrid Bonding for 3D SIC and Heterogeneous Integration
Thomas Uhrmann, EV Group (J. Burggraf, M. Pires)

Poster Sessions: 
067 Thermal Interface Material Dispense in Power Module and 5G Device Package Applications
Hanzhuang Liang, Nordson Asymtek