Latest Posts
Package-on-Package Interconnects for Fan-out Wafer Level Packages
Consumer electronics designers continue to demand thinner and lighter packages while devices increase in functional complexity. The Fan-Out Wafer Level...
TechSearch International Analyzes CSP Market Growth: QFNs Remain “Work Horse” of the Industry
Driven by use in mobile products such as smartphones, CSPs continue to show growth. TechSearch International’s latest CSP market forecast...
Interconnectology Revisited: Pizza Anyone?
Interconnectology returned as a topic of discussion to the 2014 BiTS Workshop through a keynote discussion delivered by Invensas’ president,...Invensas Unveils Groundbreaking Package-on-Package Solution for Next-Generation Smartphone and Tablet Computing
Invensas Corporation, provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. unveiled its bond via array...Why Wait Until 2016? Invensas Introduces A Bridge to Mobile Wide IO
We’ve all heard it: Wide I/O DRAM on Logic using TSV interconnects will be THE solution for achieving the high...Setting the record straight on TMV and TSV
After attending Curtis Zwenger’s presentation introducing Amkor’s latest contribution to the package-on-package (PoP) family based on the company’s proprietary
