Latest Posts
Dr. Kurt Schroder Receives Inventor of the Year Award by Austin Intellectual Property Law Association
AUSTIN, TEXAS – [October 5, 2023] – Dr. Kurt Schroder, a distinguished plasma physicist with degrees from both Massachusetts Institute...
When Plasma Matters
As the company boasts some of the most advanced plasma equipment in the industry, CCO Peter Dijkstra discusses how Trymax...
Talking With Trymax About Innovative Plasma-Based Equipment
This interview with Trymax Semiconductor’s Peter Dijkstra, Chief Commercial Officer (CCO), and Karsten Arts, Process Engineer first appeared in Atomic...
Plasma Treatment During Fan-Out Packaging Maximizes Performance and Optimizes Costs
In recent years, there has been an increased focus on fan-out wafer-level packaging (FOWLP) due to the smaller packaging size...
Solve your Semiconductor Packaging Problems with Nordson ELECTRONICS SOLUTIONS at SEMICON Taiwan 2020
Talk to the experts and see demonstrations of the latest equipment for test and inspection, fluid dispensing, and plasma treatment...
Chip Targets joins MASER Engineering & Hirex Engineering in Offering MIP Decapsulation Services
Chip Targets is pleased to announce that it has increased its wide range of service capabilities to include atmospheric Microwave...
SPTS Technologies Honored with Queen’s Award for Enterprise in Innovation 2020 for its Mosaic™ fxP Plasma Dicing System
Prestigious Award Recognizes SPTS’s Plasma Dicing Innovation in Advanced Packaging Technologies for the Global Semiconductor Industry NEWPORT, UNITED KINGDOM, 21...
IFTLE 408: Plasma Dicing; Intel compares High-density Packaging for HI
Plasma Dicing Advanced packaging is bringing with it new ways to separate die from the wafer. In the past, wafer...
Trymax Launches New UV Curing and Charge-Erase Product Line
Trymax Semiconductor Equipment BV, a global leader in plasma solutions for semiconductor manufacturers, announces the addition of an ultraviolet (UV)...
