Latest Posts
Heterointegration, Friend or Foe: Opening the Door for Technologies Beyond Moore’s Law Silicon
What is heterogeneous integration, and is it my friend, or is it my foe? Why does it seem everywhere one...
Executive Interview: Bill Bottoms Talks about Revamping the ITRS Roadmap
As the industry acknowledges that Moore’s Law has hit its twilight years, to be replaced by a system-level approach to...
RIP ITRS V1.0: 1992-2015
Prior to 1992, the high technology industry was ‘immature’. Each supply chain vendor (equipment, materials) would accumulate input from their...
2013 ITRS Roadmap Calls for 3D Power Scaling; Monolithic 3D Gains Traction
At the beginning of April, the Semiconductor Industry Association released the 2013 International Roadmap for Semiconductors (ITRS), which has traditionally...
3D InCites Guide to SEMICON West 3D Events
Each year, I publish a Guide to SEMICON West 3D Events in an attempt to integrate both SEMI-sponsored events with...
2.5D Products and 3DIC Standards and Roadmaps Are On the Move
Naysayers be damned! Full commercialization for 3D ICs in smartphones may be a few years out, but that doesn’t dampen...SEMI Standards, the ITRS Roadmap and other Boring but Important Items for the Progression of 3D IC manufacturing (UPDATED Thurs. Aug 9
Unfortunately, it’s not enough to have customers clamoring for them (3D devices), or that processes, materials and equipment are ready...
