Latest Posts
Announcing the Winners of the 2017 3D InCites Awards!
The 2017 3D InCites Awards program has turned out to be the most exciting yet! We had as many as...
SMIC Signs License Agreement For Invensas’ DBI Technology
Semiconductor Manufacturing International Corporation, one of the leading semiconductor foundries in the world and the largest and most advanced foundry...
Direct Bond Interconnect (DBI®) Technology as an Alternative to Thermocompression Bonding
The industry standard interconnect technology for fine-pitch 2.5D assembly and 3D stacking is thermocompression bonding of solder capped μbumps. This...
Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a...
With the Acquisition of Ziptronix, Tessera Takes the 3D IC Plunge
Tessera Technologies has been testing the 3D waters for several years, with the launch of its wholly owned subsidiary, Invensas,... Tessera to Acquire Ziptronix, Inc. for $39 Million
SAN JOSE, CA (August 28) — Tessera Technologies, Inc. announced the acquisition of Ziptronix, Inc. for $39 million in cash....
Executive Viewpoint: Invensas Opens its Toolbox of Interconnect Options
We’ve heard it expressed many times whenever there’s a new interconnect technology vying for adoption: manufacturers will select the best...
Circumventing Temporary Bond/Debond, and other Cost-Saving Approaches to 2.5D Interposers
While GLOBALFOUNDRIES and STATS ChipPAC may have it all figured out, there are many who still consider temporary bond/debond (TB/DB)... STS Semiconductor and Invensas to Partner on High Volume Bond Via Array (BVA) Mobile Solutions
Tessera Technologies, Inc., announced today that Invensas Corporation, its wholly owned subsidiary, and Seoul, South Korea-based STS Semiconductor & Telecommunications...
Tessera and Samsung Enter into New Patent License Agreements
Tessera Technologies, Inc. and Samsung Electronics Co., Ltd. announced today that Tessera’s subsidiaries Tessera, Inc. and Invensas Corporation each entered...
Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action
It may have been a coincidence that at last week’s 3D ASIP Conference, Invensas, Tezzaron/Novati, and Ziptronix booths were lined... Invensas and Tezzaron Partner to Deliver Commercial 3D IC Products
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that it is partnering with Tezzaron... Invensas Wins Frost & Sullivan 2013 Mobile Computing Customer Value Enhancement Award for Bond Via Array (BVA)
Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), today...
Talking Points: Interconnectology, Inspiring a Paradigm Shift
At the BiTS Workshop 2013, the talk show segment, Talking Points, examined the concept of Interconnectology and how adopting new...
2013 Predictions for 3D ICs as reported by SPN
While most of the semiconductor trade publications wrapped up their 2013 prediction posts by mid January, Semiconductor Packaging News (SPN) forged...
Sitaram Arkalgud: Going the Distance with 3D ICs
Since the early days of 3D InCites, as a member of our technical advisory board, Sitaram Arkulgud has been one...
