DAC 2016: There is More to Life than IC DesignJun 16, 2016 · By Herb Reiter · 3D In Context In the past, the Design Automation Conference was known to me and many of my colleagues as the annual event that...
Challenges and Solutions for EDA of 3D Chip StacksMay 05, 2016 · By Johann Knechtel · Resource Library It is often claimed that 3D chip stacks offer the potential to meet current and future requirements of digital circuits,...
DesignCon 2016: Where the Chip meets the Board and Great Ideas Come to LifeFeb 02, 2016 · By Herb Reiter · 3D In Context DesignCon 2016 at the Santa Clara Convention Center gave football fans among us an opportunity to watch the preparation work...
SEMICON West 2015 Demonstrates the Powerful IC Manufacturing BaseJul 21, 2015 · By Herb Reiter · 3D In Context A few weeks ago, San Francisco’s Moscone Center hosted the Design Automation Conference (DAC 2015), with many EDA experts and...
DAC 2015 Focuses on the Automotive MarketJun 22, 2015 · By Herb Reiter · 3D In Context By attracting 7011 EDA and IP developers and users, the 52 Design Automation Conference, held in the South Hall of San...
Executive Interview: Si2 Aims to Boost Confidence in Designing 3D ICsJan 13, 2015 · By Francoise von Trapp · 3D In-Depth There’s no doubt left in the minds of semiconductor device manufacturers that the processes required to build interposer-based and 3D...