Latest Posts
IMAPS Executive Summit: Advanced Packaging Comes to Silicon Valley
To celebrate the re-boot of Silicon Valley’s IMAPS Chapter, Chair Rozalia Beica, Rapidus, conceptualized and launched – with the help...
September Member News: Innovation and Collaboration
The month of September saw continued momentum in the semiconductor industry, highlighted by exciting industry events, innovative technology launches, and...
May Member News: Committed to Long-Term Impact
May 2025 marked another active month for the semiconductor industry, showcasing innovation, global engagement, and strategic progress across multiple fronts....
February Member News: Expansion, Collaborations, and Events Galore
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and...
January Member News: Technology Innovation, Strategic partnerships, Expansion and More
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging,...
December Member News: Celebrating Progress and Achievements
Despite being the holiday season for much of the world, many of our members have made remarkable progress and celebrated...
October 2024 Member News
October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
IFTLE 609: TSMC/Amkor U.S. Advanced Packaging Partnership; Reshoring at IMAPS 2024
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
ASU’s SWAP Hub and National Collaborations Shape U.S. Microelectronics Leadership
In August of 2023, I attended the inaugural meeting of the Southwest Advanced Prototyping (SWAP) Hub, spearheaded by the Ira...
June Member News Highlights Semiconductor Design Tools, Collaborations, and More
This June, we’ve seen exciting strides in AI for semiconductor design, showcasing how AI and Digital Twin technologies are revolutionizing...
ECTC 2024 3D InCites Community Member Preview
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
March Member Highlights: Anniversaries, Events, Collaborations, New Products, and More
March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance...
IMAPS DPC 2024 Community Member Preview
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
Announcing the Winners of the 2024 3D InCites Awards
It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to...
Member Monthly Highlights – November
IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with...
Tapping into the Power of the Microelectronics Community
In 2023, The International Microelectronics Packaging Society (IMAPS) reinvigorated its Arizona Chapter with monthly events at member sites. So far,...
Community Member Monthly News – October
October flew by and our community members were busy… Deca was the recipient of the prestigious IMAPS Corporate Recognition Award...
The IMAPS 2023 International Symposium Inspires Generations of Microelectronics Leaders
It wasn’t long ago that the IMAPS International Symposium focused mainly on legacy packaging technologies, occasionally dipping its toe in...
