October proved to be a dynamic month across the semiconductor and advanced packaging ecosystem, marked by innovation, expansion, and global...
To celebrate the re-boot of Silicon Valley’s IMAPS Chapter, Chair Rozalia Beica, Rapidus, conceptualized and launched – with the help...
The month of September saw continued momentum in the semiconductor industry, highlighted by exciting industry events, innovative technology launches, and...
May 2025 marked another active month for the semiconductor industry, showcasing innovation, global engagement, and strategic progress across multiple fronts....
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and...
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging,...
Despite being the holiday season for much of the world, many of our members have made remarkable progress and celebrated...
October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
In August of 2023, I attended the inaugural meeting of the Southwest Advanced Prototyping (SWAP) Hub, spearheaded by the Ira...
This June, we’ve seen exciting strides in AI for semiconductor design, showcasing how AI and Digital Twin technologies are revolutionizing...
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of...
March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance...
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to...
IMAPS held its Arizona Chapter Event at Deca Technologies, which included a presentation from Clifford Sandstrom on: “Achieving High-Density Die-to-Die Integration with...
In 2023, The International Microelectronics Packaging Society (IMAPS) reinvigorated its Arizona Chapter with monthly events at member sites. So far,...
October flew by and our community members were busy… Deca was the recipient of the prestigious IMAPS Corporate Recognition Award...
It wasn’t long ago that the IMAPS International Symposium focused mainly on legacy packaging technologies, occasionally dipping its toe in...
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
