Latest Posts
October Member News: Shaping a Smarter, More Connected Semiconductor Future
October proved to be a dynamic month across the semiconductor and advanced packaging ecosystem, marked by innovation, expansion, and global...
September Member News: Innovation and Collaboration
The month of September saw continued momentum in the semiconductor industry, highlighted by exciting industry events, innovative technology launches, and...
August Member News: Pivotal Shifts in Leadership, Investments and Innovation
The month of August held pivotal shifts in the semiconductor industry, marked by leadership transitions, targeted investments, and continued innovation...
July Member News: Bold Investments and Strategic Acquisitions
July marked a dynamic period for our community members, characterized by bold investments, strategic acquisitions, and advancements in AI-driven design...
May Member News: Committed to Long-Term Impact
May 2025 marked another active month for the semiconductor industry, showcasing innovation, global engagement, and strategic progress across multiple fronts....
IFTLE 627: Amkor Studying Hybrid Panel Level Technology
In IFTLE 626 we looked at the Yole article that addressed the question of whether panel level processing was finally...
April Member News: A More Connected and Sustainable Future
April 2025 marked a dynamic month for the semiconductor industry, with major developments across technology, sustainability, and global collaboration. Companies...
IFTLE 621: TSMC Chip and Package Activity in the U.S.
Commercial Times reports that TSMC’s Arizona wafer fab, Fab 21 Phase 1, has officially entered mass production on its 4nm...
SEMICON Korea 2025 Member Preview: Lead the Edge
In its continued focus on AI and smart devices, SEMI’s theme for this SEMICON Korea 2025 is “Lead the Edge”. ...
IFTLE 617: SK Hynix considers 2.5D packaging business with Amkor
Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked...
December Member News: Celebrating Progress and Achievements
Despite being the holiday season for much of the world, many of our members have made remarkable progress and celebrated...
November 3D InCites Member News: Advancements and Milestones
This month has been full of exciting advancements and milestones for our members. From cutting-edge technological breakthroughs and prestigious award...
October 2024 Member News
October 2024 member news was marked by significant developments and milestones. From the grand openings of cutting-edge facilities that enhance...
IFTLE 609: TSMC/Amkor U.S. Advanced Packaging Partnership; Reshoring at IMAPS 2024
TSMC/Amkor agreement Will Put U.S. Advanced Packaging on The Map TSMC has signed a memorandum of understanding (MoU) with Amkor...
Community Member Highlights for September 2024
As summer holidays came to a close, September found our member companies ramping up new products and opening new facilities....
IFTLE 603: Amkor’s Slice of the CHIPS Pie for its HVM OSAT; Samsung Texas Update
HVM OSAT In Peoria, AZ Commerce Secretary Gina M. Raimondo has identified advanced packaging as a major area of focus...
July Member News: Progress in Sustainability, Industry Expansion, and Technology Innovation
July is always an exciting month for the semiconductor industry thanks to SEMICON West. July Member News reflects the significant...
Amkor’s Science-Based Net-Zero Targets Approved by SBTi
Amkor Technology, Inc., a leading semiconductor packaging and test service provider, announced today that the Science Based Targets initiative (SBTi)...
