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MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to have received the 3D InCites Technology Enablement Award for its latest advanced packaging solution, the NOVAFAB® Fine Grain Copper electroplating process. Recognized by one of the industry’s most respected platforms in...
One form of advanced packaging is 3D stacking, in which two (or more) chips are stacked together. This differs from interposer-based packaging, in which a silicon (or other type of) interposer is used as a base to place multiple die side-by-side on the interposer. In that case, the interposer has...
2024 is a big year for 3D InCites members at the Electronic Components and Technology Conference (ECTC). With 34 of our community member companies presenting, exhibiting, and in some cases both, this may be our most well-represented year yet! ECTC 2024 is packed with program sessions, interactive presentations, and special...
SAN JOSE, Calif., Feb. 15, 2023 (GLOBE NEWSWIRE) — Adeia Inc. (Nasdaq: ADEA) (“Adeia” or the “Company”), the company whose patented innovations enhance billions of devices, today announced that Qorvo, a leading global provider of connectivity and power solutions, has licensed Adeia’s hybrid bonding technology. “Semiconductor industry leaders are looking...
Before we take a look at some exciting news from AMD, it’s that time of year to please allow me to wish all of you a very Merry Christmas and Happy new year. As long-time readers know, I always use this time of year to update you on the activities...
The semiconductor industry is currently undergoing the most radical change in its history. Many new applications such as artificial intelligence (AI), augmented/virtual reality, and autonomous driving require enormous computing power with processors optimized specifically for each application. At the same time, development cycles are becoming shorter, costs for new chip...
More on TSMC’s SoIC Hybrid Bonding Technology Nikkei Asia announced that TSMC is working with Google and AMD to develop its SoIC hybrid bonding packaging technology. Google plans to use the SoIC chips for autonomous driving systems and other applications. AMD is reportedly eager to take advantage of chip stacking...
EVG®320 D2W die preparation and activation system provides seamless integration with third-party die bonders; completes EVG’s equipment portfolio for end-to-end hybrid bonding for 3D/Heterogeneous Integration EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today introduced the EVG®320 D2W die...
Samsung’s X-Cube Samsung has announced that its advanced 3D integrated circuit (IC) packaging technology, dubbed “X-Cube,” is now available for advanced process nodes. The X stands for extended interconnect density and extended functionality Samsung’s X-Cube silicon-proven design methodology and flow are available now for advanced nodes including 7nm and 5nm....
Permanent wafer bonding can be categorized based on bonding with or without an intermediate layer. Intermediate layers can be subcategorized into insulating layers including glass frit bonding, adhesive bonding, or metallic bonding including Cu-Cu/oxide “hybrid” bonding, solder bonding, and thermo-compression copper-copper bonding as shown in Figure 1. MEMS devices are...
