Search Results

Matches for your search: "hybrid bonding "

The SMTAI Conference to Feature a Presentation by NHanced Semiconductors VP Charles Woychik on Hybrid Bonding in Chiplet Architectures

Oct 10, 2025

Woychik’s presentation will highlight the role of hybrid bonding in supporting die-to-wafer and wafer-to-wafer in delivering high-density, low-latency interconnection technology for multi-chiplet integration in advanced packaging At the upcoming SMTA International Conference, NHanced Semiconductors vice-president Dr. Charles Woychik will present “The Future of Electronics Packaging is Chiplet Architecture,” describing the industry’s...

EV Group Highlights Hybrid Bonding, Lithography, and Support for U.S. Semiconductor Onshoring at SEMICON West 2025

Sep 30, 2025

EVG celebrates 30th anniversary of its North America subsidiary in Arizona EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is highlighting the latest developments in hybrid bonding, maskless lithography, metrology and nanometer-precision layer...

NHanced Semiconductors Announces Delivery of the First Next-Generation Hybrid Bonding System from BE Semiconductor Industries

May 29, 2024

The Besi Datacon 8800 CHAMEO ultra plus advanced hybrid bonding system delivers faster throughput, enhanced accuracy, and superior warpage control for room temperature direct fusion & hybrid bonding processes.  NHanced Semiconductors, the first U.S.-based pure-play advanced packaging foundry, announced the delivery of the first BE Semiconductor Industries (Besi) next-generation hybrid bonding system to the NHanced advanced...

IFTLE 562: Die to Wafer Hybrid Bonding from Adeia

Jul 10, 2023

Continuing our look at the hybrid bonding (HB) presentations at the recent IMAPS Device Packaging Conference with a look at Adeia’s presentation. Adeia (previously known as Xperi/Tessera/Ziptronix – Tessera acquired Ziptronix in 2010) has been focusing on bringing die-to-wafer (D2W) HB to the memory market. The presentation discussed “Hybrid Bonding...

ClassOne Technology and Fraunhofer ENAS to Collaborate on Hybrid Bonding for Advanced Imaging Devices

Jun 02, 2022

Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density pixel array applications  Kalispell, Mont. – June 2, 2022 – ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today announced it is...

Xperi and LAPIS, a ROHM Group Company, Enter into Hybrid Bonding License Agreement

May 09, 2022

Technology transfer includes DBI® Ultra die-to-wafer hybrid bonding know-how SAN JOSE, Calif. & YOKOHAMA, Japan, May 04, 2022–(BUSINESS WIRE)–Adeia, the newly launched brand for the intellectual property (IP) licensing business of Xperi Holding Corporation (NASDAQ: XPER) (“Xperi”) and LAPIS Technology Co., Ltd., (“LAPIS”), a ROHM Group subsidiary, today announced an agreement that includes...

Xperi and Micron Enter Into License Agreement for Hybrid Bonding

Feb 23, 2022

Xperi’s IP Licensing Business Deepens its Presence in Memory Market SAN JOSE, Calif.–(BUSINESS WIRE)–Adeia, the newly launched brand for the IP Licensing business Xperi Holding Corporation (NASDAQ: XPER) (“Xperi”), today announced that Xperi Corporation entered into a new, multi-year agreement with Micron Technology Inc. (“Micron”), a world leader in innovative...

Xperi and UMC Partner to Produce Direct and Hybrid Bonding 3D Semiconductor Technologies

Aug 02, 2018

SAN JOSE, Calif. (August 2, 2018) – Xperi Corporation (Nasdaq: XPER) (“Xperi”) is pleased to announce a partnership with leading global semiconductor foundry, UMC. This strategic partnership will enable the companies to support the growing demand for Invensas’ direct and hybrid bonding (ZiBond® and  DBI®) 3D semiconductor technologies. Together, Xperi and...