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IPC

Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at IPC Workshop

Jun 26, 2025

Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the IPC Component-to-System Level Packaging Workshop, scheduled for July 2-3, 2025, in Berlin, Germany. The presentation, Solder as Known Good Interconnect (KGI) in Heterogeneous Integration, will explore how...

SEMICON West 2022 Hybrid to Spotlight Sustainability, Smart Technologies, Talent  

Jun 08, 2022

MILPITAS, Calif. – June 7, 2022 – Sustainability, smart technologies and workforce development will take center stage at SEMICON West 2022 Hybrid, July 12-14 at the Moscone Center in San Francisco, as more than 200 industry leaders, visionaries and technology experts convene to present insights into the latest trends, innovations and developments...

ECTC 2022 Member Preview — Stacked and Packed

May 23, 2022

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. About 1,500 professionals from the global microelectronics packaging industry are set to gather next week...

Xperi Licenses DBI to Canon for CMOS Image Sensors

Nov 18, 2020

Direct Bond Interconnect (DBI®) hybrid bonding portfolio licensed to Canon to enhance image sensors in its industry-leading products SAN JOSE, Calif.—November 18, 2020—Xperi Holding Corporation(NASDAQ: XPER) (“Xperi”) today announced Canon’s license of Invensas DBI hybrid bonding intellectual property (IP) portfolio to further enhance its image sensors. Hybrid bonding, a foundational...

EV Group Establishes Heterogeneous Integration Competence Center

Mar 02, 2020

New HI Competence Center to help customers accelerate new product development fueled by heterogeneous integration and advanced packaging EV Group (EVG) today announced that it has established the Heterogeneous Integration Competence Center™, which is designed to assist customers in leveraging EVG’s process solutions and expertise to enable new and enhanced...

DBI® Ultra Changes the Game for Heterogeneous Integration

Jun 18, 2019

I’ve been following the DBI story for over a decade (well before Xperi became a sponsor of 3D InCites). I’ve watched it grow from its humble, start-up beginnings as a Ziptronix process to its current rock-star status at Xperi/Invensas, as THE current hybrid bonding technology process for image sensors globally....

EMIB, the 3D Technology Landscape, and other Keynote Moments from IMAPS DPC 2016

Mar 22, 2016

This year’s keynote talks at the 2016 IMAPS Device Packaging Conference (DPC 2016) provided some new insight into a number of interesting areas of importance to the advanced packaging community. I already addressed Bill Chen’s talk, which focused on system-in-package (SiP) and introduced a 3D Fan-out SiP approach. Here, I’ll...

Wafer-to-Wafer Bonding Cost Analysis

Apr 27, 2015

Last year, I did an analysis that included the topic of wafer-to-wafer bonding. Specifically, it was a comparison of the three variations available when stacking wafers and/or die—wafer-to-wafer (W2W), die-to-wafer (D2W), and die-to-die (D2D). The goal of that project was to build cost models for W2W and D2W (with the...

Advances in Heterogeneous Integration Through Wafer Bonding

Mar 03, 2015

Emerging “More than Moore” and photonic applications benefit tremendously from the close integration of compound semiconductor materials. Recently, many of the improvements in device performance achieved within the semiconductor industry are a result of innovation and material research rather than traditional downscaling of design features. One of the major new...