Press Releases

Indium Corporation Expert to Present on AI Thermal Challenges at INEMI Forum on Complex Integrated Electronics

Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with...

StratEdge to Display Packaging Innovation at European Microwave Week Exhibition

3F Energy appointed to serve customers across Europe; see us at Booth A095. StratEdge Corporation, leader in the design and production...

Indium Corporation to Showcase Innovative Materials Enabling AI Technology at SEMICON Taiwan

Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, AI, thin-film, and thermal management markets,...

NHanced Semiconductors & University of Florida to Present Chiplet Paper at 36th Electronics Packaging Symposium Held at GE’s Aerospace Research Campus

The paper presents a comprehensive technical roadmap and process assessment of using hybrid bonding to integrate fine pitch chiplet architectures ...

SEMICON West 2025 CEO Summit Keynote Program to Explore Trends Shaping the Global Semiconductor Industry

SEMI Announces Session and Speaker Lineups Headlined by Arizona Governor and Global Tech Executives    SEMI, the industry association serving...

MacDermid Alpha Electronics Solutions Announces New Strategy Vice President Role for India

MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is pleased to announce...

2026 IEEE Electronic Components and Technology Conference Announces Call for Papers

The 2026 IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor...

Syenta Raises A$8.8M to Break AI’s Memory Wall with Next-Gen Chip Packaging Technology

Australian semiconductor technology company Syenta has raised A$8.8 million in Pre-Series A funding to commercialize a breakthrough in chip packaging...

SEMI Foundation Launches SEMIquest: An Immersive STEM Experience to Inspire Arizona’s Future Tech Talent

Pop-Up Exhibition at the Arizona Science Center to be Featured at SEMICON West The SEMI Foundation, the nonprofit arm of SEMI, today...

Koh Young Highlighting Dimensional Metrology & Inspection Solutions at the Binghamton University Electronics Packaging Symposium (EPS) in Niskayuna, NY

Koh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, is proud to announce its sponsorship...

Brewer Science Supports the Restoration of Full R&D Tax Deductibility with the Passage of OBBB

Legislation Strengthens U.S. Semiconductor Manufacturing and Innovation Brewer Science, a global leader in developing and manufacturing next-generation materials and products...

Brewer Science Named 2025 National Top Workplace in Manufacturing Industry

Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries,...

Nordson Test & Inspection to Deliver Technical Presentation at the Heterogeneous Integration Global Summit During SEMICON Taiwan

Nordson Test & Inspection announced plans to present on Day 2 at the Heterogeneous Integration Global Summit (HIGS), during SEMICON...

Nordson Test & Inspection to Unveil Next-Generation Inspection and Metrology Technology at SEMICON Taiwan

Nordson Test & Inspection announced plans to unveil advanced technology at SEMICON Taiwan, scheduled to take place at TaiNex in...

Indium Corporation Promotes Two Leaders in EMEA (Europe, Middle East, and Africa) Markets

With its commitment to innovation and growth through employee development, Indium Corporation announced the promotions of Andy Seager to Associate...

Leadership Change at Koh Young Europe

After 16 years of leading Koh Young Europe as General Manager, we would like to announce that Harald Eppinger will step...

Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices

Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a...