Press Releases

Koh Young Technology Appoints Jeff Lee as Head of Industrial Solutions Business

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, has appointed Jeff Lee as Head...

MacDermid Alpha Electronics Solutions Announces Agreement to Acquire Micromax®

Element Solutions Inc, the parent company of MacDermid Alpha Electronics Solutions, announced that it has signed a definitive agreement to...

Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025

Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at...

Koh Young Earns Service Excellence Award for the Fourth Time in Five Years

Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, has once again been selected by customers for...

NNME Debuts ChipPath as the Central Gateway for U.S. Semiconductor Careers, Featuring 90,000 Live Job Openings

AI-enabled Platform Provides Resources for Resume Building, Career Mapping and Exploration, Training and Development, and More  To help meet the...

YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications by a Leading AI Infrastructure Supplier

Yield Engineering Systems (YES), a leading provider of advanced process equipment for AI and high-performance computing (HPC) semiconductor applications, announced...

ASE and Analog Devices Announce Strategic Collaboration

• ASE plans to purchase ADI’s Penang, Malaysia facility to enhance global supply chain resilience and manufacturing diversity • ADI and ASE...

SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation

Registration is Open for Exhibition Dec.17-19 in Tokyo   SEMICON Japan 2025, the largest gathering of leaders from the microelectronics manufacturing...

Indium Corporation Expert to Present on Advancing Thermal Performance at TestConX China

Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will...

Leaders Recognized for Significant Contributions to Standards Advancing Semiconductor Manufacturing

SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the recipients of the...

Indium Corporation Introduces 2026 DIY Internship Program to Empower the Next Generation of Industry Leaders

Indium Corporation is proud to announce its 2026 Internship Program, introducing a do-it-yourself (DIY) format that allows students to shape...

Nova Announces the Release of Nova WMC: A Next-Generation Modular Optical Metrology Platform for Advanced Packaging

Nova announced the release of its latest optical metrology solution, the Nova WMC. This next-generation modular platform has been specifically designed...

The 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits Announces Call for Papers on the Theme “Advancing the AI Frontier through VLSI Innovation”

Delivering a unique convergence of technology and circuits that maximizes the synergy across both domains in the microelectronics industry for...

Veeco Receives Multiple Lumina Systems Order from Leading Optical Communications Laser Manufacture

Veeco Instruments Inc. announced that a leading optical communications laser manufacturer placed an order for multiple Lumina™ metal organic chemical...

Koh Young Discussing Ways to Apply Smart Factory Insights to Maximizing Productivity at SMTA Tijuana

Koh Young, the industry leader in True 3D measurement-based inspection solutions, will present at the SMTA Tijuana Expo & Tech...

Indium Corporation Experts to Deliver Technical Presentations at SMTA International

As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical...

The SMTAI Conference to Feature a Presentation by NHanced Semiconductors VP Charles Woychik on Hybrid Bonding in Chiplet Architectures

Woychik’s presentation will highlight the role of hybrid bonding in supporting die-to-wafer and wafer-to-wafer in delivering high-density, low-latency interconnection technology...