Press Releases

Koh Young Recognized with Productronica Innovation Award for its AI-powered Process Optimization Solution

Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, has been recognized with a Productronica Innovation Award...

Industry Leaders Koh Young, Fuji America, and Creative Electron Unite to Launch The SMT Future Experience

Three of electronics manufacturing’s most innovative companies announced the formation of THE SMT FUTURE EXPERIENCE, an independent collaborative venue designed...

Accelerating Quantum Computing Innovation: Veeco Expands Global Footprint with MBE Wins

Veeco Instruments Inc., a global leader in advanced semiconductor and compound semiconductor process equipment, announced wins with Sparrow Quantum (Denmark)...

imec and Brewer Science to Co-Present Breakthroughs in Thin Interposer Assembly and Flash-Lamp Debonding at EPTC 2025

Brewer Science, Inc., a global leader in advanced packaging materials and processes, will co‑present two technical papers with imec at...

SurplusGLOBAL Holds Topping-Out Ceremony for Yongin Cluster Building B, Laying Groundwork for the SemiMarket Parts Mall

SurplusGLOBAL (CEO: Bruce Kim) announced that it has successfully held a topping-out ceremony for Building B of its Yongin Namsa...

Koh Young Highlights 3D Inspection for Advanced Packaging at SEMICON Japan 2025 in Tokyo Big Sight

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, will showcase its latest semiconductor inspection...

Circuits Integrated Expands to the UK to Develop Next-generation Satellite Chipsets

Greek Semiconductor Specialist Joins Space South Central to Advance 3D Compound–silicon Integration for Satellite and Defence Communications Greek semiconductor design...

ACM Research Delivers Advanced Ultra Lith BK Photoresist Hardening Tool with Industry-Leading UV Curing and Temperature Uniformity

Ultra Lith BK delivers exceptional uniformity and flexible processing capabilities to enhance process stability, yield, and scalability in advanced lithography...

ACM Research Delivers First Horizontal Panel Electroplating Tool Strengthening Its Leadership in Fan-Out Panel-Level Packaging

ACM Research, a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced it...

StratEdge Celebrates IMAPS Awards for President Tim Going and VP Casey Krawiec

Dual honors spotlight leadership, innovation, and industry impact StratEdge Corporation is proud to announce that President Tim Going has been awarded the prestigious IMAPS...

Indium Corporation is Electrifying the Future with Advanced Materials Solutions at Productronica

As one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly...

Brewer Science Showcases Advanced-Node and Wafer-Thinning Materials for Energy-Efficient Semiconductor Manufacturing

Visit Booth #B1465 at SEMICON Europa to explore PFAS-free, high-performance materials enabling next-gen AI packaging Brewer Science, Inc., a global...

Nordson Electronics Solutions to Demonstrate Automated Fluid Dispensing and Selective Soldering Systems for Electronics Manufacturing at Productronica 2025

See equipment demonstrations, including the SELECT Synchro selective soldering system for electronics manufacturing  Nordson Electronics Solutions, a global leader in...

ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation

Advanced Semiconductor Engineering, Inc. (ASE) announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE)...

Indium Corporation Leaders Receive SMTA Next Gen 10 Awards at SMTA International

With its commitment to innovation and growth through employee development, Indium Corporation announces that Senior Product Development Specialist, Kevin Brennan,...

Koh Young Technology Appoints Jeff Lee as Head of Industrial Solutions Business

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, has appointed Jeff Lee as Head...