Press Releases

SurplusGLOBAL Holds Topping-Out Ceremony for Yongin Cluster Building B, Laying Groundwork for the SemiMarket Parts Mall

SurplusGLOBAL (CEO: Bruce Kim) announced that it has successfully held a topping-out ceremony for Building B of its Yongin Namsa...

Koh Young Highlights 3D Inspection for Advanced Packaging at SEMICON Japan 2025 in Tokyo Big Sight

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, will showcase its latest semiconductor inspection...

Circuits Integrated Expands to the UK to Develop Next-generation Satellite Chipsets

Greek Semiconductor Specialist Joins Space South Central to Advance 3D Compound–silicon Integration for Satellite and Defence Communications Greek semiconductor design...

ACM Research Delivers Advanced Ultra Lith BK Photoresist Hardening Tool with Industry-Leading UV Curing and Temperature Uniformity

Ultra Lith BK delivers exceptional uniformity and flexible processing capabilities to enhance process stability, yield, and scalability in advanced lithography...

ACM Research Delivers First Horizontal Panel Electroplating Tool Strengthening Its Leadership in Fan-Out Panel-Level Packaging

ACM Research, a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced it...

StratEdge Celebrates IMAPS Awards for President Tim Going and VP Casey Krawiec

Dual honors spotlight leadership, innovation, and industry impact StratEdge Corporation is proud to announce that President Tim Going has been awarded the prestigious IMAPS...

Indium Corporation is Electrifying the Future with Advanced Materials Solutions at Productronica

As one of the leading providers in advanced materials solutions for power device packaging and materials for the electronics assembly...

Brewer Science Showcases Advanced-Node and Wafer-Thinning Materials for Energy-Efficient Semiconductor Manufacturing

Visit Booth #B1465 at SEMICON Europa to explore PFAS-free, high-performance materials enabling next-gen AI packaging Brewer Science, Inc., a global...

Nordson Electronics Solutions to Demonstrate Automated Fluid Dispensing and Selective Soldering Systems for Electronics Manufacturing at Productronica 2025

See equipment demonstrations, including the SELECT Synchro selective soldering system for electronics manufacturing  Nordson Electronics Solutions, a global leader in...

ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation

Advanced Semiconductor Engineering, Inc. (ASE) announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE)...

Indium Corporation Leaders Receive SMTA Next Gen 10 Awards at SMTA International

With its commitment to innovation and growth through employee development, Indium Corporation announces that Senior Product Development Specialist, Kevin Brennan,...

Koh Young Technology Appoints Jeff Lee as Head of Industrial Solutions Business

Koh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, has appointed Jeff Lee as Head...

MacDermid Alpha Electronics Solutions Announces Agreement to Acquire Micromax®

Element Solutions Inc, the parent company of MacDermid Alpha Electronics Solutions, announced that it has signed a definitive agreement to...

Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025

Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at...

Koh Young Earns Service Excellence Award for the Fourth Time in Five Years

Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, has once again been selected by customers for...

NNME Debuts ChipPath as the Central Gateway for U.S. Semiconductor Careers, Featuring 90,000 Live Job Openings

AI-enabled Platform Provides Resources for Resume Building, Career Mapping and Exploration, Training and Development, and More  To help meet the...

YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications by a Leading AI Infrastructure Supplier

Yield Engineering Systems (YES), a leading provider of advanced process equipment for AI and high-performance computing (HPC) semiconductor applications, announced...