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The EU’s Semiconductor Strategy: CHIPS Act 2.0, Investments, and More
Dec 03, 2025 · By Jillian McNichol · Interconnectology 101
3D In Context View all
SEMICON West Navigates Semiconductor Industry Changes
Nov 18, 2025 · By Dean Freeman · 3D In Context
As Benjimen Franklin said, shortly after the US Constitution was written, “In this world, nothing can be said to be certain, except death and taxes.” I’ll add one comment to that: Change. Change is constant. Over the past year, there has been a significant amount of change in the semiconductor...
Advanced Packaging: A Community Coming Together
Nov 12, 2025 · By Dean Freeman · 3D In Context
In the past 16 years, 3D InCites has watched the 3D packaging industry grow. The philosophy of 3D InCites was to create an advanced packaging community. At SEMICON West in Phoenix, the community was out in force, from ribbon-cutting ceremonies for new facilities, to new packaging equipment companies showing for...
The 3DICAMA and Other Efforts to Develop the 3D IC Ecosystem
Oct 14, 2025 · By Dean Freeman · 3D In Context
This Fall has been a busy time for semiconductor events. Starting with SEMICON Taiwan at the start of the month, IMAPS in Late September into early October, followed closely by SEMICON West last week. Fortunately, there is a month off to catch your breath before heading to Semicon Europa. There...
Can We Make Data Centers Less Power Hungry?
Aug 19, 2025 · By Dean Freeman · 3D In Context
When the headline reads “Power Usage in Wyoming data center could eclipse consumption if the state’s human residents by 5x, the tenant of colossal investment remains a mystery.“ It grabs your attention. The article goes on to discuss that the data center is expected to start at 1.8 gigawatts and...
Francoise in 3D View all
Passing the Torch: Reflections from SEMICON Europa 2025
Nov 24, 2025 · By Francoise von Trapp · Blogs
While announcing my retirement after 20 years in the industry at IMAPS Symposium brought my career in advanced packaging full circle, wrapping up my 3D InCites career at SEMICON Europa brought closure. It was at SEMICON Europa 2007, held in Stuttgart, where my fascination with 3D integration and packaging first...
Francoise Unfiltered: Thoughts from IMAPS Symposium and SEMICON West
Oct 15, 2025 · By Francoise von Trapp · Blogs
Maybe it’s my impending retirement, but I’m feeling a little salty these days. This my fifth draft about the highlights, low-lights and Aha moments of both IMAPS Symposium and SEMICON West. And I can’t get it right. All that comes up is my annoyance with carefully crafted messaging because nobody...
Changes at 3D InCites: Here’s What You Need to Know
Oct 01, 2025 · By Francoise von Trapp · Blogs
I recently realized that IMAPS Symposium 2025 marks my 20th anniversary in the microelectronics industry. It was the first industry event I attended, as the Associate Editor of Advanced Packaging Magazine. My first SEMICON West was in 2006, and my first SEMICON Europa was in 2007. That was when I was first...
IMAPS Executive Summit: Advanced Packaging Comes to Silicon Valley
Sep 29, 2025 · By Francoise von Trapp · Blogs
To celebrate the re-boot of Silicon Valley’s IMAPS Chapter, Chair Rozalia Beica, Rapidus, conceptualized and launched – with the help of the local committee and the IMAPS team – the first ever IMAPS Executive Summit. The theme was Advanced Packaging 2025: Market Momentum & Investment Outlook. According to Beica, what...
From Different Dimensions View all
From Reactive to Proactive: Semiconductor Shipment Visibility in 2025 and Beyond
Nov 17, 2025 · By Shreya Mehta · Blogs
In 2024, electronics cargo theft, including semiconductors, servers, and high-end computing equipment, surged dramatically, exposing a critical vulnerability in supply chains. ¹ This threat is not just a security issue for companies shipping semiconductors and other high-tech components; it directly impacts revenue, causes production delays, and compromises customer trust. Often,...
Jessica Yang: My Summer Internship at Saras Micro Devices
Nov 11, 2025 · By Saras Micro Devices · Blogs
By Jessica Yang, HR Intern, Saras Micro Devices Hi, I’m Jessica Yang, a rising junior at Washington University in St. Louis, studying Organizational & Strategic Management and Sociology. With my two interests, I’ve always been passionate about the people side of business, which is why I was looking for internships...
Henrik Ng: My Summer Internship at Saras Micro Devices
Nov 05, 2025 · By Saras Micro Devices · Blogs
My name is Henrik Ng and I am an Electrical Engineering student entering my junior year at Georgia Tech. I was eager to gain both hands-on experiences and theoretical understandings in the realms of RF engineering, as inspired by my previous research project surrounding RFID energy harvesting. At the same...
October Member News: Shaping a Smarter, More Connected Semiconductor Future
Oct 29, 2025 · By Camden McCrea · Blogs
October proved to be a dynamic month across the semiconductor and advanced packaging ecosystem, marked by innovation, expansion, and global collaboration. From groundbreaking facility announcements and strategic partnerships to prestigious industry recognitions, members continued to push technological and manufacturing boundaries. The month also featured major events, where companies unveiled cutting-edge...
Interconnectology 101 View all
Co-Packaged Optics: Today’s Biggest Packaging Push
Nov 26, 2025 · By Jillian McNichol · Interconnectology 101
Co-packaged optics is one of the most talked about innovations in advanced packaging right now, and it’s for good reason. It promises higher bandwidth density, lower power consumption, and reduced latency over other packaging approaches – all of which are essential for enabling smarter AI solutions. To learn more about...
Will AI Ever Become Profitable?
Nov 04, 2025 · By Jillian McNichol · Interconnectology 101
Last year, I wrote a blog on the growth of AI, where I broke down the public hype around the technology and the barriers preventing it from scaling further. Earlier this year, Gartner projected that worldwide AI spending will reach $1.5 trillion by the end of 2025, up $490 billion...
Geopolitical Changes, Sustainability Progress, and Collaboration Efforts at SEMICON West 2025
Oct 20, 2025 · By Jillian McNichol · Interconnectology 101
This year’s SEMICON West was its largest exhibition in over 18 years. With a 60% boost in registrations over 2024, the size of SEMI’s first-ever Phoenix conference points to growing interest in the semiconductor industry. As you can imagine, much of this interest is driven by AI. On October 7th,...
What the U.S. Government Stake in Intel Could Mean for the Semiconductor Industry
Sep 22, 2025 · By Jillian McNichol · Interconnectology 101
On August 22, Intel confirmed in a press release that it agreed to give a 10% stake of its company to the United States federal government in exchange for $8.9 billion in funding. Of this amount, $5.7 billion was set to come from its CHIPS Act allocation, and $3.2 would...
Packaging IFTLE View all
IFTLE 647: Micross AIT on Track to Deliver 300mm Bumping Onshore
Nov 25, 2025 · By Phil Garrou · Blogs
Continuing our look at program information deemed “OK for public release” at the recent IMAPS Onshoring conference, let’s examine what Micross had to say about progress on its Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) 300mm bumping line, sponsored by DARPA’s Industrial Base Analysis and Sustainment (IBAS) program....
IFTLE 646: TSMC 3Dblox 2.0 Helps Advanced Packaging Designs
Nov 19, 2025 · By Phil Garrou · Blogs
The 3Dblox Open Standard Continues to Evolve Introduced in 2022, the 3Dblox open standard has provided EDA vendors with a pathway to model the essential physical stacking and logical connectivity information for 3D IC designs in a single format. 3Dblox reportedly simplifies 3D IC design by providing a complete view...
IFTLE 645: ASE Packaging in Koahsiung; Amkor Advanced Packaging in AZ; US-SMC?
Nov 10, 2025 · By Phil Garrou · Blogs
ASE to build new packaging facility in Kaohsiung Taipei Times reports that ASE, the world’s biggest chip assembly and testing service provider, said it is investing $578.6M to build a new advanced chip packaging facility in Kaohsiung to cope with fast-growing demand from artificial intelligence (AI), high-performance-computing (HPC) and automotive...
IFTLE 644: IBM’s Scott Sikorski details their Onshore Advanced Packaging for AI, HPC and Defense Applications
Oct 27, 2025 · By Phil Garrou · Blogs
The recent IMAPS Onshoring workshop included Scott Sikorski, IBM Global Business Development Leader, reviewing details of their onshore advanced packaging efforts for AI, hig performance computing (HPC) and defense applications. The IMAPS “Onshoring” meeting is restricted to US citizens and thus IFTLE will not be able to review most of...
