IFTLE 648: Unimicron Glass Core Substrates and Hybrid Bonding
Dec 01, 2025 · By Phil Garrou · Blogs, Packaging IFTLE
Latest Posts
IFTLE 645: ASE Packaging in Koahsiung; Amkor Advanced Packaging in AZ; US-SMC?
ASE to build new packaging facility in Kaohsiung Taipei Times reports that ASE, the world’s biggest chip assembly and testing...
IFTLE 644: IBM’s Scott Sikorski details their Onshore Advanced Packaging for AI, HPC and Defense Applications
The recent IMAPS Onshoring workshop included Scott Sikorski, IBM Global Business Development Leader, reviewing details of their onshore advanced packaging...
IFTLE 643: GlobalFoundries New York Advanced Packaging and Photonics Center
At the recent IMAPS Onshoring Workshop, Greg Kleese, Director of Aero & Defense Business Development, GlobalFoundries, made the presentation “GlobalFoundries...
IFTLE 642: TSMC Advanced Co-packaged Optics Integrated CoWoS and COUPE
At the Open Compute Project (OCP) / APAC Summit in Taiwan, S.Y Hou (Director of Advanced Packaging Integration, gave a...
IFTLE 641: Is the CHIPS Act Becoming the CHIPS Investment Act?
Plus: TSMC Packaging in AZ; Deca/Microchip/SST Non-volatile Memory Packaging Taiwans Minister of Economic Affairs reports that he received information about...
IFTLE 640: Intel Ohio in Limbo; US Government Acquires 10% Stake in Intel
Intel Ohio is started, but when will it be finished? The Columbus Ohio Dispatch has just reported that Intel is...
IFTLE 639: Are Things Worsening for Intel? Will Samsung Add Advanced Packaging in Texas?
Intel Concerns Continue to Grow Long time readers of IFTLE know that we have been following the technical and financial...
IFTLE 638: TSMC Advanced Packaging Coming to AZ; Intel Stops Internal Glass Core Substrate Funding
TSMC Advanced Packaging in US Scheduled for 2028; Focusing on SoIC/CoPoS From Taiwan we hear that TSMC has accelerated Fab...
IFTLE 637: UMC Re-Enters the Advanced Chip and Advanced Packaging Markets
According to Nikkei Asia, UMC is eyeing 6nm production, with a focus on chips for Wi-Fi, RF, Bluetooth, AI accelerators,...
IFTLE 636: Samsung’s Approach to Silicon Bridges; Micron HBM Packaging Planned for Virginia
ECTC 2025 The 75th annual IEEE Electronic Components and Technology Conference (ECTC), was held this year in Dallas TX over...
IFTLE 635: KAIST / Tera HBM Roadmap
In a recent presentation by Korea Advanced Institute of Science & Technology (KAIST), and the Terabyte Interconnection and Package Laboratory...
IFTLE 634: Micron Invests Onshore; TSMC CoPoS
Micron Expands Investment In IFTLE 631 we asked whether any other companies would up their own investments to onshore chip...
IFTLE 633: What’s Inside Apple’s A20 Chip? Also: Introducing Intel EMIB-T
Packaging Apple’s A20 chip Apple’s A20 chip is forthcoming; set to power the iPhone 18 and iPhone 18 Pro models...
IFTLE 632: Deca and IBM Partner to Produce Fan-Out Interposer in North America
At the recent ECTC conference in Dallas, IBM and DECA announced the signing of an agreement to implement Deca’s M-Series...
IFTLE 631: CHIPS Act Now Under U.S. Investment Accelerator
The U.S. Investment Accelerator was officially established on March 31, 2025, as part of an effort to modernize the investment...
IFTLE 630: Micron HBM; More GaN in RF Devices?
HBM is one of the hottest markets right now thanks to the tremendous demand for AI GPU computing power. HBM...
IFTLE 629: GlobalFoundries New York Advanced Packaging and Photonics Center
Earlier this year GlobalFoundries (GF) announced a New York Advanced Packaging and Photonics Center (NY APPC) billed as “…the first...
IFTLE 628: TSMC System-on-Wafer in the Works; Update on Intel Layoffs
Dr. Cliff Hou, Senior Vice President and Deputy Co-COO (above), spoke at this year’s 2025 Technology Symposium. highlighting TSMC’s continued...
IFTLE 627: Amkor Studying Hybrid Panel Level Technology
In IFTLE 626 we looked at the Yole article that addressed the question of whether panel level processing was finally...
