Passing the Torch: Reflections from SEMICON Europa 2025
Nov 24, 2025 · By Francoise von Trapp · Blogs, Francoise in 3D
Latest Posts - Page 15
Executive Viewpoint: Update on Cleans
Last time I checked in with Kim Pollard, Technology Manager, Dynaloy, was a few years ago, when we talked about...
ABC, easy as 123: Does Alphabet Spell Good News for the Semiconductor Industry?
I’m sure by now you’ve all heard or read about the big news at Google: The creation of Alphabet as a...
Taking 3D Integration to the Next Level
There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t...
Semiconductor Supplier Updates from SEMICON West 2015
No SEMICON West would be complete without a few laps around Moscone North and South, and some one-on-one chats with...
At AMD, Die Stacking Hits the Big Time
It’s official. Die stacking and interposer integration have been implemented in a high volume consumer application. AMD officially launched the...
SEMICON West Keynote Panel: Semiconductor Manufacturing is a Team Sport
I almost didn’t attend the keynote panel titled, Scaling the Walls of Sub 14nm Manufacturing, at SEMICON West last week,...
The IoT at SEMICON West 2015: We Just Can’t Get Enough
As a topic of much discussion and debate, the Internet of Things (IoT) stole the show once again, this time...
Congratulations to the Winners of the 2015 3D InCites Awards
For the third consecutive year, 3D integration enthusiasts gathered at the Impress Lounge at SEMICON West for the 2015 3D...
Executive Viewpoint: Providing A Golden Boat of Wafers
As 3D integration technologies become established in low volume manufacturing, the supply chain is gearing up to address high volume...
aveni: The New Name and Face of Alchimer
I’ve been following the Alchimer story as it unfolds ever since I first started following the course of 3D integration...
The 2015 3D InCites Guide to 3D at SEMICON West
2015 will go down in history as the year 3D finally got real. It’s not an emerging technology anymore, and...
Will the Internet of Everything Really Make the World a Better Place?
I recently started watching the HBO sitcom, Silicon Valley. If you haven’t seen it, it’s a great parody of what...
Amkor Execs Outline Strategy for the Future of Advanced Packaging
I was invited to attend Amkor’s bi-annual customer symposium, which was held in Santa Clara two weeks ago. It was...
Who Should Win the First 3D InCites Individual Achievement Award?
The journey to the commercialization of 3D integration technologies has been long – longer than most expected – an arduous....
Will the Chip Industry Benefit from the Internet of Everything?
The Internet of Things (IoT) or as Cisco calls it, the Internet of Everything, has been the theme du jour for...
ECTC 2015: Advanced Packaging Sets Sail in San Diego
The 65th annual Electronics Technology Components Conference (ECTC 2015) logged record numbers (over 1500 attendees, 20% increase over last year) as...
Spotlight on FOWLP, Monolithic 3D IC and 3D TSVs
Fan-out wafer level packaging’s star is clearly on the rise as a low-cost solution for consumer mobile products, and the...
3D InCites Turns Six and Hits Over 1000 Posts
Today, LinkedIN reminded me that 3D InCites just celebrated its 6th anniversary. I also noticed that Paul Werbaneth’s latest 3D+...
How Will Future Capex Spending Affect Semiconductor Suppliers?
At the recent Arizona SEMI Breakfast Forum, held April 17, 2015, semiconductor suppliers gathered at the Mother Ship (aka Intel) in Ocotillo,...
