Rapid Development and Optimization of Thermal Management Solutions for Advanced Semiconductor Packaging Feb 14, 2024 · By Dr. Dongkai Shangguan · 3D In-Depth, Materials
The Rise of Organic and Glass Substrates May 30, 2023 · By Keith Felton · 3D In-Depth, Design, Materials
Digital and Physical: Thermal Twins for Developing Thermal Management Solutions Apr 10, 2023 · By Dr. Dongkai Shangguan · 3D In-Depth, Materials, Test and Inspection
Alchimer Resurfaces at the European 3D TSV SummitFeb 04, 2013 · By Francoise von Trapp · 3D Event CoverageIt had been awhile since I heard from the folks at Alchimer about the progress of electrografting (eG), its “all...
2013 Predictions for 3D ICs as told by Everyone – Part 1Jan 08, 2013 · By Francoise von Trapp · 3D In-DepthIt’s that time of year again when various electronics trade publications invite industry executives to peer into their crystal balls...
Temporary Bond/Debond: Not Ready for 3D TSV Prime TImeDec 21, 2012 · By Francoise von Trapp · 3D Event CoverageIt’s too bad SUSS MicroTec’s Wilfried Bair was one of the last presenters on Friday at 3D Architecures for Systems...
3DIC Tech UpdatesOct 23, 2012 · By Francoise von Trapp · ManufacturingBut first, a 3D history lesson thanks to a recent SemiWiki blog post, Hybrids on BeO then, 3D-IC in silicon now,...
The Stacked Die Reality Check Continues; FPGAs Lead the 3D ChargeOct 09, 2012 · By Francoise von Trapp · 3D In-DepthIt’s been one of those Mondays. I started making the coffee this morning (put in a clean filter, poured in...
Update on 3D transistors (That “other” 3D)Sep 20, 2012 · By Francoise von Trapp · 3D In-DepthI always hesitate to cove 3D transistors, because before they came along, I only focused on what I knew to...
SEMICON Europa 2012 Focuses on Materials, 3D ICs, and 450mmSep 10, 2012 · By Francoise von Trapp · 3D Event CoverageSEMICON Europa got underway yesterday, and reports from the event point to new materials, 450mm and 3D ICs as the...
Today in 3D: HMCC Drafts Specs; Materials Suppliers take on TB/DB; OSATS add CapacityAug 14, 2012 · By Francoise von Trapp · 3D In-DepthI’ve come across a few interesting announcements in the 3D space today that separately are just random bits of news,...
Glass vs. Silicon Interposers for 2.5D and 3D IC ApplicationsMar 20, 2012 · By Francoise von Trapp · 3D In-DepthThere has been enough interest stirred up in R&D around glass as a low-cost alternative interposer substrate material compared with...
Ziptronix Direct Oxide Bond Technology Gains MomentumDec 21, 2011 · By Francoise von Trapp · 3D In-DepthAt RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the...
Perspectives on 3D Integration: The ResearchersOct 13, 2011 · By Francoise von Trapp · 3D In-DepthTo listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for...
Georgia Tech’s 3D Interposer Technologies Provide Low-cost 3D OptionAug 22, 2011 · By Francoise von Trapp · 3D In-DepthAt SEMICON West 2011, Prof. Rao Tummala of Georgia Tech presented the unique glass and silicon-based 3D Interposer technologies being...
Things are humming along at EV GroupJul 27, 2011 · By Francoise von Trapp · 3D In-Depth“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate...
Alchimer’s Technology Breakthrough Brings Tomorrow’s Solutions to Today’s ApplicationsMay 30, 2011 · By Francoise von Trapp · 3D In-DepthAlchimer’s latest technology breakthrough is an interesting twist on the way semiconductor solutions generally presents themselves. We’re used to hearing...
C2W Bonding Approaches: Variations on ThemeMar 23, 2011 · By Francoise von Trapp · 3D In-DepthAs chip-to-wafer (C2W) stacking has been identified by most technologists as the best approach to 3D stacking for optimum yields...
EV Group: Progress on Advanced C2W BondingFeb 02, 2011 · By Francoise von Trapp · 3D In-DepthWhen it comes to 3D chip stacking, chip-to-wafer (C2W) processes have proven to be the way to go for stacking...
SPTS Begins 2010 with Solid Q1 Shipments of US$40MDec 04, 2010 · By Francoise von Trapp · 3D In-DepthSPP Process Technology Systems Ltd. (SPTS), announced shipments of US$40 million during the first quarter...
Alchimer in Asia: Things are CookingOct 18, 2010 · By Francoise von Trapp · 3D In-DepthI caught up with Alchimer CEO, Steve Lerner last week at the IWLPC in Santa Clara, to find out how...
Progress is Progress in the Medical Device WorldSep 27, 2010 · By Francoise von Trapp · 3D In-DepthThis was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when...
Extending Legacy Technologies into the 3D SpaceJul 21, 2010 · By Francoise von Trapp · 3D In-DepthWhile TSVs technologies make their way out of R&D on to the manufacturing floor, improvements and developments in non-TSV 3D...