Glass-based Solutions for Packaging are Here
Apr 07, 2021 · By Aric Shorey · 3D In-Depth, Materials
Latest Posts - Page 3
Ziptronix Direct Oxide Bond Technology Gains Momentum
At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the...Perspectives on 3D Integration: The Researchers
To listen to John Lau, of ITRI, speak on the topic of 3D integration is to experience a passion for...Georgia Tech’s 3D Interposer Technologies Provide Low-cost 3D Option
At SEMICON West 2011, Prof. Rao Tummala of Georgia Tech presented the unique glass and silicon-based 3D Interposer technologies being...Things are humming along at EV Group
“Keeping busy” doesn’t begin to describe what’s happening at EV Group these days. I sat down with Markus Wimplinger, Corporate...Alchimer’s Technology Breakthrough Brings Tomorrow’s Solutions to Today’s Applications
Alchimer’s latest technology breakthrough is an interesting twist on the way semiconductor solutions generally presents themselves. We’re used to hearing...C2W Bonding Approaches: Variations on Theme
As chip-to-wafer (C2W) stacking has been identified by most technologists as the best approach to 3D stacking for optimum yields...EV Group: Progress on Advanced C2W Bonding
When it comes to 3D chip stacking, chip-to-wafer (C2W) processes have proven to be the way to go for stacking...SPTS Begins 2010 with Solid Q1 Shipments of US$40M
SPP Process Technology Systems Ltd. (SPTS), announced shipments of US$40 million during the first quarter...Alchimer in Asia: Things are Cooking
I caught up with Alchimer CEO, Steve Lerner last week at the IWLPC in Santa Clara, to find out how...Progress is Progress in the Medical Device World
This was my second year attending the Medical Electronics Symposium, and I’m not sure what I was expecting, but when...
Extending Legacy Technologies into the 3D Space
While TSVs technologies make their way out of R&D on to the manufacturing floor, improvements and developments in non-TSV 3D...New Realities for TSV Processing
In this article, published in the May/June 2010 issue of Chip Scale Review Magazine, Steve...Alchimer creates launch pad for industrialization
Launching a disruptive technology into an industry that is set in their ways is not a job for sissies. But...Suppliers offer solutions to TSV formation challenges
As part of the 3D tracks at both this year’s International Wafer Level Packaging Conference, held October 27-30 in...