Materials

ECTC 2013 Interview: Dow Corning throws its Hat in the Temporary Bond/Debond Ring

ECTC 2013 Interview: Dow Corning throws its Hat in the Temporary Bond/Debond Ring

At ECTC 2013, Dow Corning Corporation (DCC) introduced its solution to the temporary bond/debond conundrum. During the materials and process session, Ranjith John, materials development & integration engineer at Dow Corning, presented a paper titled Low Cost, Room Temperature Debondable Spin on Temporary Bonding Solution: A Key Enabler for 2.5D/3D IC Packaging, co-authored with equipment suppl... »

wet etch

ECTC 2013 Interview: SSEC’s Laura Mauer Talks about TSV Reveal and TSV Clean

This year’s 3D InCites coverage of ECTC 2013 features a series of interviews with suppliers to the 2.5D and 3D IC market. I spoke with a number of exhibiting and attending companies who had progress reports on their tools, processes and materials aimed at leaping over the remaining hurdles. The first of these was Laura Mauer, CTO, SSEC, who explained the company’s all wet processes for such cr... »

3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

3D InCites and TechSearch International Launch Awards Program To Recognize Achievements in 2.5D and 3D IC Technologies

Proceeds to Benefit The Frances B. Hugle Engineering Scholarship Phoenix AZ and Austin TX – May 21, 2012 – 3D InCites, the premiere online content source for reliable 3D technology information, and TechSearch International, the leading market research and intelligence firm for advanced semiconductor packaging technology, today announced the first annual 3D InCites Awards. All proceeds of the a... »

2013 Predictions for 3D ICs as reported by SPN

2013 Predictions for 3D ICs as reported by SPN

While most of the semiconductor trade publications wrapped up their 2013 prediction posts by mid January, Semiconductor Packaging News (SPN) forged on with its original annual Viewpoints series right up until last week. I spent some time pouring over the musings of industry executives’ contributions. Many discuss the proliferation of mobile devices driving technology requirements and 3D ICs as ... »

Alchimer Resurfaces at the European 3D TSV Summit

Alchimer Resurfaces at the European 3D TSV Summit

It had been awhile since I heard from the folks at Alchimer about the progress of electrografting (eG), its “all wet” nanometric film deposition processes.  For a while, it seemed like there were exciting things to report every few months, and then POOF – All went dark. So I was happy to find out that the company and its technology is alive, well and experiencing a re-bound after corporate ... »

2013 Predictions for 3D ICs as told by Everyone – Part 2

2013 Predictions for 3D ICs as told by Everyone – Part 2

No sooner did I post last week’s curation of predictions for the semiconductor industry, and particularly for 3D ICs, than several more popped up online. I suspect this type of thing to continue for the next few weeks, and I will try and continue to cherry-pick the ones that made reference to 3D integration. In a Semiconductor Packaging News Viewpoint, Doug Goodman, CEO, Ridgetop Group, Inc. tal... »

2013 Predictions for 3D ICs as told by Everyone – Part 1

2013 Predictions for 3D ICs as told by Everyone – Part 1

It’s that time of year again when various electronics trade publications invite industry executives to peer into their crystal balls and make their predictions for the coming year. I’ve been perusing through everything from overall industry forecasts by market analysts to suppliers eager to promote their core competencies for 3D IC manufacturing. Here are some that especially caught my attenti... »

Strong adhesives

Temporary Bond/Debond: Not Ready for 3D TSV Prime TIme

It’s too bad SUSS MicroTec’s Wilfried Bair was one of the last presenters on Friday at 3D Architecures for Systems in Packaging Symposium (3DASIP), Dec. 14, 2012, because more people should have been present to hear what he had to say. While most presenters focused on successes and future work for optimization and lower cost of ownership, he really went out on a limb to explain why there are s... »

3D TSVs: Will Europe Lead the Way?

The first European 3D TSV Summit (January 22-23, 2013) hasn’t even happened yet, and already its intended message is becoming clear: Europe is ready to tackle those remaining issues and lead the world down the home stretch. It makes sense, since Europe’s R&D centers (imec, CEA Leti, Fraunhofer IZM) has been leading the way from the beginning, its foundries and IDMs (ST Microelectronics an... »

3D IC Blogosphere Update

After wrapping up a run of blog posts from two weeks of travel and 4 conferences,(IWLPC 2012, the IEEE 3D Test Workshop, and MEPTEC’s co-located Roadmaps to Multi-die Integration and Known Good Die Symposium) it’s time to catch my breath and see what else has been going on in the 3D blogosphere. From the looks of Phil Garrou’s SST post, I missed out on hanging with “many of the world's 3... »

Page 3 of 512345