Materials

Understanding The Complexity of Cleans

Understanding The Complexity of Cleans

There is nothing like a little hands-on experience to help someone understand a particular technology better and more fully. Last week I spent two days in Indianapolis learning about how cleaning formulations are made, at the invitation of Steve Dwyer, Business Director Electronic Materials Dynaloy LLC, A subsidiary of Eastman Chemical Company. The company is in the business of developing solvent ... »

wet etch

SSEC’s New Chemistry for TSV Reveal

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SSEC had a lot to celebrate at this year’s SEMICON West, 2013. The company launched two new equipment platforms, WaferStorm and WaferEtch, each configuring single wet wafer processes for specific applications. Two of the tools launched on these platforms apply directly to the 3D IC market, the TSV ... »

Figure 1: Electrografting provides a very strong adhesion between organics and any surface

Alchimer Streamlines Wet Approach

Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development and technology, Alchimer, about recent developments to further optimize the companies’ electrografting processes for through silicon via (TSV), isolation, barrier, seed and fill steps. I wrote about them frequently in the company’s early days, and again si... »

Figure 2: Shows the photo of a 50 μm thin wafer after debond on a tape.

Dow Corning offers the Power of Silicone Technology

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview with imec’s Ludo Deferm, I met up with Andrew Ho, global industry director, advanced semiconductor materials, for Dow Corning’s Electronic Solutions, to get an update on Dow Corning’s developments in 3D IC assembly materials. I’d previously interviewed Ho’s colleague,... »

And a Good Time was had by All – 3D InCites Awards Breakfast, 2013

And a Good Time was had by All – 3D InCites Awards Breakfast, 2013

Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge to witness the inaugural 3D InCites Awards Breakfast, held July 11, 2013 during SEMICON West. For me, it was especially significant as it marked four years since I first launched 3D InCites at SEMICON West 2009. I felt truly honored to be surrounded by such industry elit... »

2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure

2013 SUSS MicroTec Technology Forum Focuses on 3D TSV infrastructure

SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on ensuring that all pieces of the 3D IC puzzle are in place. This was evident from the range of presenters they had lined up during this year’s Technology Forum, held at the The St. Regis San Francisco, 125 3rd St, San Francisco, as part of the company’s SE... »

Alchimer Signs Collaboration with CEA-Leti to Evaluate Metallization Processes for High Aspect Ratio TSV Applications

Alchimer Signs Collaboration with CEA-Leti to Evaluate Metallization Processes for High Aspect Ratio TSV Applications

Wet Nanometric Film Deposition Processes Capable of Delivering 20:1 Aspect Ratio TSVs at Low Cost of Ownership MASSY, France – July 8, 2013 – Alchimer, S.A. today announced a collaboration with the French research institute CEA-Leti to evaluate and implement Alchimer’s wet deposition processes for 300mm high-volume manufacturing. The project will evaluate Alchimer’s Electr... »

Momentum Builds for the 2013 3D InCites Awards

Momentum Builds for the 2013 3D InCites Awards

Subscribers are practically blowing up 3D InCites as they duke it out online and race the  July 3rd deadline for casting their ballots in the public opinion poll for this inaugural 3D InCites Awards; which is great because the first 3D InCites Awards Breakfast, co-presented by 3D InCites and TechSearch International, is fast approaching, and we’ve got an exciting program shaping up. We’re hap... »

EV Group and Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution for 3D-IC/TSV, Advanced Packaging, MEMS and Compound Semiconductor Applications

EV Group and Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution for 3D-IC/TSV, Advanced Packaging, MEMS and Compound Semiconductor Applications

CoatsClean™ combines process, equipment and formulation technology to deliver innovative, low cost-of-ownership approach to single-wafer photoresist and residue removal ST. FLORIAN, Austria and INDIANAPOLIS, Ind., June 17, 2013—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics industry... »

Technology Updates at ECTC 2013

Technology Updates at ECTC 2013

The ECTC 2013 stats are in. This year showed increases across the board with: Over 1,300 attendees, the highest attendance ever, from 26 countries 377 technical papers, presented in 36 oral and five interactive presentation sessions, including a student poster session 12 sessions focused on 3D/TSV, including several of the best attended sessions of the conference 16 professional development course... »

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