TechSearch News
TechSearch International, Inc. Examines Advanced Packaging’s Growth in AI
Advanced Packaging’s Growth in AI TechSearch International’s latest analysis examines the demand for packages used in AI. As the industry...TechSearch International Releases Market Forecast for BGAs and CSPs
Market Forecast Reveals the Downside of the Covid Spending Spree in Electronics, Provides an Update on Build-up Substrate Supply and...TechSearch International Examines Chiplet Strategies and Markets, North American OSAT Capability, and Provides an Update on the Build-up Substrate Supply and Demand
TechSearch International’s latest analysis examines strategies for the adoption of chiplets and current products. While the market is small today...TechSearch International Analyzes Impact of Slowing Demand on FC and WLP
TechSearch International’s latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand...TechSearch International Examines High-Performance Package Options and Provides an Update on the Build-up Substrate Shortage
TechSearch International’s latest analysis describes high-performance package options with an update on TSMC’s new offerings, including the latest organics CoWoS®...
TechSearch International’s Analysis Examines Impact of World Events and Material Shortages on BGA and CSP Market Growth
TechSearch International’s Analysis Examines Impact of World Events and Material Shortages on BGA and CSP Market Growth 2021 was a...TechSearch International’s Analysis Shows Surge in Fan-Out and Embedded Bridge for High Performance Packaging
With AMD’s announcement of its Elevated Fanout Bridge (EFB) GPU package, the embedded bridge for fan-out (FO) on substrate is...TechSearch International’s Analysis Shows Shortage of FC-BGAs Substrates Persists
Despite capacity increases this year, and additional plans through 2025, demand for FC-BGA substrates is outstripping supply. What’s driving the...
What’s in the Apple Watch Series 6?
TechSearch International’s teardown of the Apple Watch Series 6 GPS+LTE examined 108 board-level packages plus another 17 packages inside modules...TechSearch International’s BGA and CSP Market Analysis
TechSearch International’s BGA and CSP Market Analysis The industry saw strong production growth in 2020 and Q1 2021 was a...TechSearch International Analyzes Substrate Shortages and Explores Potential Solutions
Substrate capacity remains tight for both flip chip ball grid array (FC-BGA) substrates and laminate-based chip scale packages (CSPs). Substrate...TechSearch International Quantifies Heterogeneous Integration Market Growth
The market for heterogeneous integration is projected to grow 10% in number of packages from 2020 to 2025, reaching almost...TechSearch International Examines HBM Growth and Package Options for HBM + Logic
The market for high bandwidth memory (HBM) is projected to grow 49% in wafers, including DRAM and logic layers, from...TechSearch International Projects Growth in FO-WLP Market
The fan-out wafer level package (FO-WLP) market is projected to grow 15.5% in units from 2020 to 2024. Growth is...
5G, AI, and Server Markets Provide Growth, Despite Pandemic
Despite the economic downturn caused by the fight against the Covid-19 virus pandemic, there are some potential growth areas this...
Emerging Market for Low-Density Panel FO Analyzed
Large area fan-out (FO) remains a hot topic in the industry. There is some confusion over the term “panel” because...
High-Performance IC Substrate Manufacturing Reaches an Inflection Point
Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing. Increasing I/O counts...
Analysis Highlights Impact of Trade Friction on Electronics Industry
The impact of the ban on selling components to Huawei combined with generally lower shipments for PCs and mobile phones... 