John Ferguson, Author at 3D InCites

Why Do We Need Assembly Design Kits for Packages?

Why Do We Need Assembly Design Kits for Packages?

In our last article, we talked about a project we participated in to test the feasibility of an assembly design kit (ADK) for package design verification. This time, we’d like to delve a little more into the reasons why assembly design kits are needed. Naturally, one of the reactions to our article was “But I already have requirements from my package house. Why do I need an ADK?” True, packa... »

Assembly Design Kits are the Future of Package Design Verification

Assembly Design Kits are the Future of Package Design Verification

Unlike the traditional system-on-chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and assembly houses have no integrated circuit (IC) package co-design sign-off verification process to help ensure that an IC package will meet manufacturability and performance requirements. Package die are often produ... »

Silicon Photonics and 2.5D Interposer Design

Silicon Photonics and 2.5D Interposer Design

Historically, we all took Moore’s Law for granted. With each new node, we could expect to see faster-performing devices, smaller design footprints and, ultimately, lower design costs. Nowadays these benefits are not clearly achievable for all designers. At the latest advanced technology nodes, we may be able to see faster devices through the miracles of finFET technologies, but do we really get ... »

3D By Design: PDKs Can Enable an Open Market for Interposer and 3D Solutions

3D By Design: PDKs Can Enable an Open Market for Interposer and 3D Solutions

As an integral part of the established integrated circuit (IC) supply chain, Outsourced Assembly and Test (OSAT) companies offer IC packaging services on the open market, independent of the chip manufacturer or foundry. OSATs are a subset of the total worldwide IC packaging market, since some IC package assembly is still performed in-house at integrated semiconductor manufacturers (ISM). However, ... »