EVG celebrates 30th anniversary of its North America subsidiary in Arizona EV Group (EVG), a leading provider of innovative process...
New EVG®40 D2W overlay metrology system provides 100 percent overlay measurement on every die at up to 15X higher throughput...
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...
EVG achieves five star rating across all participating award categories, including first-place finishes in “Global Semiconductor Supplier” segments, lithography equipment,...
LITHOSCALE XT provides up to five-fold increase in throughput versus previous industry benchmark LITHOSCALE system; EVG maskless exposure technology to...
Establishment of fully-owned subsidiary is the culmination of a decades-long commitment to the region supporting evolving needs in semiconductor wafer...
ST. FLORIAN, Austria, May 14, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and...
Effective May 1, Dr. Uhrmann will oversee the entire sales organization and report to EVG’s executive board EV Group (EVG),...
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...
Presentations to highlight breakthrough capabilities of EVG’s maskless lithography, hybrid bonding and IR laser release solutions for heterogeneous integration; EVG...
EVG achieves RANKED 1st status across all participating award categories, including first-place finishes in “10 BEST” and “THE BEST” suppliers...
EV Group and Fraunhofer IZM-ASSID partnership kicks off with the installation of EVG850 automated laser debonding system at the newly...
The dedicated HVM EVG®880 LayerRelease™ system boosts productivity and lowers the cost-of-ownership of novel infrared laser release technology through silicon...
Papers will highlight heterogeneous integration solutions such as hybrid bonding, maskless lithography, and layer transfer technology for advanced packaging applications....
EV Group’s LITHOSCALE® maskless exposure solution is ideally suited for fine-pitch probe cards, which involve complex designs and product mixes...
Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and...
Company expansion driven by market growth in 3D/heterogeneous integration fueling strong demand for EVG hybrid bonding and other leading process...
Expanded collaboration includes installation of EVG’s LITHOSCALE® maskless exposure system, EVG®7300 UV-NIL system and complementary resist processing systems FLORIAN /...
