EV Group News
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
New EVG®40 D2W overlay metrology system provides 100 percent overlay measurement on every die at up to 15X higher throughput...
EV Group Promotes Cindy Lee to General Manager of EVG Taiwan Subsidiary
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...
EV Group Tops Customer Rankings in TechInsights 2025 Global Semiconductor Industry Customer Satisfaction Survey
EVG achieves five star rating across all participating award categories, including first-place finishes in “Global Semiconductor Supplier” segments, lithography equipment,...
EV Group Brings Digital Lithography to Heterogeneous Integration HVM Applications with LITHOSCALE® XT
LITHOSCALE XT provides up to five-fold increase in throughput versus previous industry benchmark LITHOSCALE system; EVG maskless exposure technology to...
EV Group Forms Subsidiary in Singapore to Strengthen Local Customer Support
Establishment of fully-owned subsidiary is the culmination of a decades-long commitment to the region supporting evolving needs in semiconductor wafer...
EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2025
ST. FLORIAN, Austria, May 14, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and...
EV Group Appoints Dr. Thomas Uhrmann Vice President of Sales
Effective May 1, Dr. Uhrmann will oversee the entire sales organization and report to EVG’s executive board EV Group (EVG),...
EV Group Advances 300-mm MEMS Manufacturing with Next-Generation GEMINI® Automated Production Wafer Bonding System
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...
EV Group Highlights Revolutionary Temporary Wafer Bonding and Debonding Solution for HBM and 3D DRAM at SEMICON Korea
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...
EV Group Expands Management Board In Light Of Unabated Growth
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip...
EV Group Highlights 3D Integration Process Solutions at SEMICON Taiwan 2024
Presentations to highlight breakthrough capabilities of EVG’s maskless lithography, hybrid bonding and IR laser release solutions for heterogeneous integration; EVG...
EV Group Tops Customer Rankings With 12th Consecutive Triple Crown Win in TechInsights 2024 Customer Satisfaction Survey
EVG achieves RANKED 1st status across all participating award categories, including first-place finishes in “10 BEST” and “THE BEST” suppliers...
EV Group and Fraunhofer IZM-ASSID Expand Partnership in Wafer Bonding for Quantum Computing Applications
EV Group and Fraunhofer IZM-ASSID partnership kicks off with the installation of EVG850 automated laser debonding system at the newly...
EV Group Doubles Throughput of Innovative Semiconductor Layer Transfer Technology
The dedicated HVM EVG®880 LayerRelease™ system boosts productivity and lowers the cost-of-ownership of novel infrared laser release technology through silicon...
EV Group Heterogeneous Integration Solutions To Be Highlighted at ECTC 2024
Papers will highlight heterogeneous integration solutions such as hybrid bonding, maskless lithography, and layer transfer technology for advanced packaging applications....PROTEC MEMS Technology Orders Maskless Lithography System from EV Group for Advanced Memory Wafer Probe Card Manufacturing
EV Group’s LITHOSCALE® maskless exposure solution is ideally suited for fine-pitch probe cards, which involve complex designs and product mixes...
EV Group Brings Revolutionary Layer Transfer Technology to High-volume Manufacturing with EVG®850 NanoCleave™ System
Infrared laser cleave technology enables ultra-thin-layer transfer from silicon substrates with nanometer precision, revolutionizing 3D integration for advanced packaging and...
EV Group Completes Construction of New Manufacturing V Building at Corporate Headquarters to Expand Production Capacity
Company expansion driven by market growth in 3D/heterogeneous integration fueling strong demand for EVG hybrid bonding and other leading process...
