2019 3D InCites Awards Nominees

2019 3D InCites Awards Nominees

The nominees for the 2019 3D InCites Awards are listed below by category. Winners will be chosen by industry peers, through an online voting process. We are accepting nominations through February 11, 2019.

Online voting opens February 13 and closes February 28, 2018.

Winners will be announced at the 3D InCites Awards Ceremony, March 6, 2019, at the 2019 IMAPS Device Packaging Conference

Device Manufacturer of the Year

This category doesn't have nominations yet


Device of the Year

This category doesn't have nominations yet


EDA Provider of the Year

Mentor, a Siemens Business

Mentor continues to drive the proliferation of Assembly Design Kits with integration of packaging design tools like Xpedition to the Calibre platform.


Engineer of the Year

This category doesn't have nominations yet


Equipment Supplier of the Year

ERS electronic GmbH

ERS electronic GmbH has taken the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700.

The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel format; it offers ERS´s complete range of thermal debonding capabilities and even more powerful warpage adjustment.


Materials Supplier of the Year

This category doesn't have nominations yet


Process of the Year

imec

Imec 3D team Eric Beyne: Wafer level molding

HSIO Technologies-Benchmark Electronics

HSIO Technologies has developed an exciting new manufacturing process technology focused on Direct Die Attach Liquid Crystal Polymer dielectric material (LCP). HSIO's manufacturing partner Benchmark Electronics is establishing volume production capability that combines Substrate Fabrication, Direct Die Attach and Test During Assembly all within the same process loop to enable very high performance LCP substrates and rigid flex assemblies with Known Good Die challenges resolved. LCP has been used for RF-MW products due to its' excellent electrical properties, but it has suffered a bad reputation for delamination and difficult to process manufacturing. Aimed at applications like the DARPA CHIPS initiative, the HSIO LCP substrate technology provides up to 16-20 layers of LCP with a unique mask layer technique that allows for direct die attach, and the ability to embed active semiconductors, passive devices and coaxial-twinaxial high speed signal lines and RFantennae tuned for performance.


Research Institute of the Year

This category doesn't have nominations yet


SemiSister Award

Rozalia Beica

Too much to catch in 150 characters


Startup of the Year

This category doesn't have nominations yet