2019 3D InCites Awards Nominees

2019 3D InCites Awards Nominees

The nominees for the 2019 3D InCites Awards are listed below by category. Winners will be chosen by industry peers, through an online voting process. We are accepting nominations through February 11, 2019.

Online voting opens February 13 and closes February 28, 2018.

Winners will be announced at the 3D InCites Awards Ceremony, March 6, 2019, at the 2019 IMAPS Device Packaging Conference

Device Manufacturer of the Year

Samsung

n the Samsung Exynos 9110 with ePLP, the first generation of Samsung’s fan-out panel level package, Samsung has managed to bring together an application processor engine (APE) and a power management integrated circuit (PMIC) in the same package in a system-in-package (SiP)-PoP configuration. This solution is integrated on the main board of the Samsung Galaxy Watch. The module includes the Exynos 9110 application processor and Samsung’s Power management system in a single package < 80 mm². This is only the second multi-chip fan-out device on the market, according to System Plus Consulting.

Sony Semiconductor Solutions Corporation

Sony Semiconductor Solutions Corporation was founded as a device solutions manufacturer that constantly provides new value and excitement to the world. Our semiconductor device business is driven primarily by image sensors, and also includes various LSIs, lasers, and display devices. By integrating development, design, and manufacturing, we will be better able to reliably meet the diversifying needs of customers and to enrich people's lifestyles. The measure of this success is that, according to Bloomberg, Sony's CMOS Image Sensor business is more profitable than is its entertainment business.

OmniVision Technologies, Inc.

OmniVision Technologies is a leading developer of advanced digital imaging solutions. Our award-winning CMOS imaging technology enables superior image quality in many of today’s consumer and commercial applications, including mobile phones, notebooks, tablets and webcams, digital still and video cameras, security and surveillance, entertainment devices, automotive and medical imaging systems. We are one of the top three manufacturers in the image-sensor market, which totaled nearly $12 billion in revenue for 2017, and we participate in every image-sensor market segment worldwide. Additionally, we cover the entire market at a more comprehensive level than our competitors. While the competition is engaged in one or more segments, OmniVision is the only image-sensor company that serves every market segment.


Device of the Year

Sony IMX586 stacked CMOS Image Sensor

The Sony IMX586 stacked CMOS image sensor for smartphone cameras features 48 effective megapixels*2, the industry’s highest pixel count. The new product achieved a world-first ultra-compact pixel size of 0.8 μm, making it possible to pack 48 effective megapixels*2 onto a 1/2-type (8.0 mm diagonal) unit, thereby supporting enhanced imaging on smartphone cameras. And, original Sony exposure control technology and signal processing functionality are built into the image sensor, enabling real-time output and a superior dynamic range four times greater than conventional units. Even scenes with both bright and dark areas can be captured with minimal highlight blowout or loss of detail in shadows.

NVDIA Tesla V100

NVIDIA® Tesla® V100 is the world’s most advanced data center GPU ever built to accelerate AI, HPC, and graphics. Powered by NVIDIA Volta, the latest GPU architecture, Tesla V100 offers the performance of up to 100 CPUs in a single GPU—enabling data scientists, researchers, and engineers to tackle challenges that were once thought impossible. Using HBM2, with a combination of improved raw bandwidth of 900GB/s and higher DRAM utilization efficiency at 95%, Tesla V100 delivers 1.5X higher memory bandwidth over Pascal GPUs as measured on STREAM.

Disruptive Technologies

Disruptive Technologies AS is an innovator in the IoT market and developer of the world’s smallest commercial-grade wireless sensors. The sensors simplify data collection and deliver the data securely to third-party partners’ analytics programs in the cloud.
The sensor technology from Disruptive Technologies leverages compact innovation and long-lasting durability to provide an environmentally sustainable IoT sensor solution unlike any other. The fully integrated sensor is the size of a single key on a keyboard, extremely easy to set up and can send hundreds of sensor inputs per day for 15 years about temperature, touch and proximity.
A key component of the sensor is an in-house designed application-specific integrated circuit that enables state of the art energy-efficient sensor communication. The system includes an off-the-shelf MEMS and in-house designed sensors. The remarkable form factor has demanded use of chip-scale wafer-level packaging for several of the key components.

OmniVision OS02C10 Image Sensor

Security cameras with AI need the highest possible resolution in all lighting conditions for accurate facial recognition. Our new OS02C10 image sensor combines our breakthrough ultra low light (ULL) and industry-leading Nyxel™ near-infrared (NIR) technologies for the industry’s best nighttime camera performance, enabling designers to integrate facial-recognition AI in all lighting conditions.

Our Nyxel NIR technology infuses the OS02C10 with quantum efficiency (QE) of 60% at 850nm and 40% at 940nm, which is 2x to 4x better than the competition. This enables the use of less IR light in total darkness, resulting in an estimated 3x lower power consumption.

The OS02C10 also has a superior low-noise design for better ULL performance, achieving an SNR1 of 0.16 lux while producing 1080p HD images. Our proprietary dual-conversion-gain technology provides the industry’s best ULL performance, while the 3-frame staggered shutter minimizes motion artifacts and enables a 120dB high dynamic range.


EDA Provider of the Year

Mentor xSI and Calibre 3DSTACK

During the development of a complex FinFET-class ASIC, there were several modifications to netlist names and package connectivity to maintain compatibility with a legacy product. These events created the opportunity for inconsistent data.

The use of XSI and 3DSTACK to do a system-level LVS allowed us to detect out-of-sync connectivity between the design intent and the design implementation, even though the individual design systems were passing LVS/DRC. The same LVS allowed us to detect and prevent potential opens/shorts that could have occurred between the package and the PCB, avoiding a costly and time-consuming re-spin.

Zuken CR-8000 Design Force

As IC packaging architecture advances, Zuken’s Design Force enables the designer to deal with the growing complexity in design space in handling high pin-counts, high density designs and the need to interface with multiple formats and flows. Design Force accommodates Flip Chip, SiP, FOWLP, WLCSP, and other flavors of advanced semiconductor packaging designs.

Cadence Design Systems

Cadence plays an essential role in the creation of today’s ICs, advanced IC packages, and PCBs. Over the past three decades, Cadence has consistently demonstrated its commitment to providing EDA solutions that address the challenges of electronic product design. Cadence cross-domain co-design solutions deliver state-of-the-art design automation and have become the de facto standard in system-level co-design and advanced IC packaging.
Recently, Cadence announced the Virtuoso RF Solution. This cross-platform solution integrates the Cadence IC design platform with the Cadence advanced package design/analysis tools - including 3DEM and MoM modeling technologies - providing the industries first solution that delivers a holistic, system-level design flow - with built-in LVS - for RF and mixed-signal multi-die, heterogeneously integrated designs.


Engineer of the Year

Amy Lujan, SavanSys Solutions LLC

Amy's academic background is in polymer chemistry and mathematics, while her professional background is in the electronics industry. Amy has worked in a variety of engineering roles, including mechanical and electromechanical, and spent one year on a Fulbright grant studying the cost effects of lead-free manufacturing. Amy transitioned from engineering roles into technical sales and account management in late 2010; and thinks that her experience living abroad and working with multiple global corporations has provided her with an international view of the electronics industry. Amy's work with cost comparisons of Panel Level and Wafer Level Fan-out Packaging processes has been outstanding, and of great value to our industry.

Gerard John, Amkor Technology

As one of Amkor’s leading “Test Technologist”, Gerard’s expertise covers a wide range of products and services, including: commercial MEMS devices, 77 GHz collision-avoidance radar, high speed photonics and wireless cellular communications products. He has additional proficiency in System Level Test, with a primary focus on test innovation and providing solutions that lower test costs. Gerard strives to engage early with MEMS design engineers to understand the platform architecture, functionality and final use application, review test requirements, design and develop device validation fixtures (bench top setups) that can be migrated to a HVM test solution. By including these Design For Test (DFT) capabilities, the goal of potential massive parallel test increasing throughput and reducing overall test costs can be realized. He has more than 20 years of product and test development experience and holds several patents on RF and MEMS test technologies. Gerard holds a bachelor’s degree from Osmania University and an MBA from Gainey School of Business.

Dr. Warren Flack, VP of worldwide lithography applications, Veeco Instruments

For 30+ years, Warren Flack has significantly influenced the global advanced packaging (AP) lithography arena with his expertise spanning dry-etching for silicon technologies, optical and electron-beam lithography. Sporting a quiet demeanor, Dr. Flack is much appreciated by customers and colleagues for his valued insights on AP process development and applications. He was on the 1980s VHSIC program that developed the first 0.5µm CMOS process. During the 1990s, he led pioneering design efforts to apply lithography in AP for flip chip and Cu pillars. Dr. Flack received his bachelors and masters degrees in chemical engineering from Georgia Institute of Technology and his Ph.D. with a thesis on optical lithography modeling from University of California, Berkeley. He has five U.S. patents in lithography and has authored 100+ technical articles, including dual-side alignment for TSVs, field stitching for large area interposers and recent work on 1µm RDL lithography for fan-out applications.


Equipment Supplier of the Year

ERS electronic GmbH

ERS electronic GmbH has taken the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700.

The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel format; it offers ERS´s complete range of thermal debonding capabilities and even more powerful warpage adjustment.

Genmark Automation

Since the launch of Genmark’s new high capacity storage tool, CODEX, IDM manufacturers have recognized the benefits of Genmark’s new product due to its capabilities in meeting evolving market demands. CODEX includes valuable features such as highest storage volume of substrates due to its novel rotary “carousel” module and editable library retrieval system for more effective tracking. The Gantry robot allows for substantial extended range and all the system exceeds ISO Class 1 compliance. The CODEX can be configured for a throughput performance of up to 400 I/O wafer per hour. It is also designed to have an optional bay inside the storage system where a metrology unit of the customer’s choice can be installed.
The system not only comes in 300mm format, but has the versatility to be used for 150mm and 200mm Fabs. It also has the unique ability of storing a mixture of these substrates within one system. Genmark’s team with more than 30 years of experience continues to adapt applications

SPTS Technologies Ltd

SPTS Technologies provides etch and deposition equipment which has enabled many of the recent advances in 2.5/3D integration. Working with renowned research institutes, and helping to implement the best processes at device manufacturers, foundries & OSATs, SPTS has been at the forefront of developing a number of key wafer processing techniques and transferring these into full scale production. These include high productivity PVD of UBM/RDL for FOWLP with multi-wafer degas to double wafer throughput and reduce Rc. Our deep silicon etch has transferred from MEMS micromachining, to 3D-TSV etching & plasma dicing of taped wafers up to 300mm. Other processes include low temperature PECVD for dielectric deposition, and HF/XeF2 release etch for MEMS or WLP applications. Our MVD process can deposit anti-stiction films for MEMS and anti-oxidation & -corrosion layers for packaging applications. We also offer additive printing solutions for 3D structural printing of dams & isolating layers.

Veeco AP300E Lithography System

Launched in 2004, AP300 lithography system’s overlay, resolution and broadband exposure flexibility has consistently driven highly automated, cost-effective manufacturing valued by foundries/OSATs for fan-in WLP, FOWLP, TSV, silicon interposer and Cu pillar bumping. The stepper’s variable NA lens can be optimized to maximize DoF while maintaining higher-resolution performance. Its pattern recognition approach eliminates the need to re-tool reticles for custom alignment targets. It can process wafers with up to 7mm of warpage and the configurable optical system provides a full-wafer topography map for optimizing the focus position for each exposure. The system’s modular architecture helps meet a fabs’ specific requirements and is designed for easy extendibility to accommodate future process nodes. In 2018, the world’s largest OSATs and leading memory chip manufacturers purchased multiple AP300 systems, citing its superior uptime, lower CoO and exceptional performance as key factors.


Materials Supplier of the Year

Corning Precision Glass Solutions

Glass as a temporary carrier material has proven its value in advanced wafer thinning and high- performance fan-out packaging. As these technologies advance, new challenges emerge that require glass innovation. For example, more RDL layers require carrier glass to be thinner and thinner, yet in-process warp still needs to be managed and controlled. Precision Glass Solutions delivers value to customers through a unique set of capabilities under single leadership within Corning.

Atotech

Atotech offers plating chemistries from fan-out wafer level packaging processes, to through silicon vias. With the understanding that purity determines the reliability of the whole package, the company focuses on delivering the highest purity Cu deposits to meet tough reliability deposits that are micro-crack and void-free for Cu pillars, µ-Vias and fine line RDL.

Brewer Science

Since 1981, Brewer Science has provided the market with advanced materials that both broaden and extend industry roadmaps. Brewer Science’s wafer-level packaging materials have enabled device manufacturers and assemblers to reduce the form factor and increase the efficiency of their products. Spearheading the temporary wafer bonding market with its chemical release platform in 2004, Brewer Science has had multiple generations of products that have increased throughput, performance, and yield rates. From chemical to thermal slide, and today with mechanical and laser release systems, Brewer Science is committed to solving the foremost challenges in the Compound Semiconductor, 2.5D, 3DIC, and Fan-out Packaging market spaces.

Henkel Corporation

Henkel is the premier materials supplier for the electronics assembly and semiconductor packaging industries. Our advanced formulations include a range of products that facilitate electrical interconnect, provide structural integrity, offer critical protection, and transfer heat for reliable performance. Most recently, Henkel has launched two successful products for the advanced packaging of semiconductor devices used in the mobile telecommunications and data center applications. Our wafer applied underfill film (WAUF) materials, LOCTITE® ABLESTIK® NCF 200 series, enables 3-D stacking of electronic chips for high performance computing applications and our post applied capillary underfill material, LOCTITE® ECCOBOND® UF 8000 series, enables high throughput wafer level packaging of processors and memory packages for mobile applications. Henkel provides a strong portfolio of electronics assembly products that enable our customers to be at the leading edge of innovation and technology.


Process of the Year

imec

Imec 3D team lead by Eric Beyne for development of a low-warpage wafer-level transfer mold process that is performed post 3D die-to-wafer assembly. 

HSIO Technologies-Benchmark Electronics

HSIO Technologies has developed an exciting new manufacturing process technology focused on Direct Die Attach Liquid Crystal Polymer dielectric material (LCP). HSIO's manufacturing partner Benchmark Electronics is establishing volume production capability that combines Substrate Fabrication, Direct Die Attach and Test During Assembly all within the same process loop to enable very high performance LCP substrates and rigid flex assemblies with Known Good Die challenges resolved. LCP has been used for RF-MW products due to its' excellent electrical properties, but it has suffered a bad reputation for delamination and difficult to process manufacturing. Aimed at applications like the DARPA CHIPS initiative, the HSIO LCP substrate technology provides up to 16-20 layers of LCP with a unique mask layer technique that allows for direct die attach, and the ability to embed active semiconductors, passive devices and coaxial-twinaxial high speed signal lines and RFantennae tuned for performance.

Eshylon Scientific’s Mobile Electrostatic Carriers

Eshylon Scientific’s multi-patented Mobile Electrostatic Carriers (MESCs) are revolutionizing temporary bonding for thin and exotic wafer handling. Eshylon’s reusable, long-life MESCs offer instant bond/debond on a single station with no adhesives, no clean steps, no ESD, no CTE mismatch and at temperatures exceeding 400°C. Eshylon MESCs are being successfully applied across many fab processes including metrology, lithography, deposition, dry etch, die singulation, substrate stacking, ion implant, transport handling and others. The Eshylon MESC platform delivers unmatched ROI for exotic material wafer handling and small wafer fab retrofits, allowing our customers the flexibility to run multiple size substrates or wafer pieces on existing tool sets.

Rohinni LLC

Rohinni simplifies formerly complex LED placement/manufacture by omitting traditional packaging steps to optimize manufacturing processes. While extremely thin microLED packages enable consumer electronics to be greatly slimmed down, it has not been viable to cost-effectively manufacture these devices in large volumes. Rohinni’s innovative robotic process places mini- and microLEDs directly onto virtually any substrate at unprecedented speeds, in high volumes, making it well suited for a wide range of end-use applications. In the last six months, Rohinni formed strategic partnerships that will extend the market reach of its unique process: With Magna Electronics, the company formed Magna Rohinni Automotive, a joint venture that will produce ultra-thin lighting microLED lighting solutions for mobility industries; With Kulicke & Soffa (K&S), Rohinni jointly developed and launched PIXALUX™, K&S’s micro and mini LED advanced placement solution; and with BOE, Rohinni formed a joint venture to produce ultra-thin microLED lighting solutions for display backlights.


Research Institute of the Year

Binghamton University Integrated Electronics Engineering Center (IEEC)

The Integrated Electronics Engineering Center is committed to the advancement of electronic packaging technology and the electronics industry. Founded in 1991, this New York State Center for Advanced Technology conducts leading edge research in a wide variety of packaging areas that benefit technological advancements, and member companies. Its Electronics Packaging Symposium in 2018 covered a broad array of topics presented by speakers of note from the Center itself and beyond; attendees heard about 2.5-3D Packaging, 5G Needs in Packaging, Bioelectronics, and Materials for Packaging and Energy Storage, among other program subjects.

UCLA Engineering Center for Heterogeneous Integration and Performance Scaling (CHIPS)

Classical Si based CMOS scaling has achieved a 1000X reduction in feature size over the last five decades and is still scaling even though development and manufacturing costs are rising. However, other aspects of the system such as the package and board have not kept up. Integrating more and increasingly diverse function on a single die – SOC technology – is also getting more expensive and complex. The barrier to entry has become exorbitant while the time to product has grown longer. CHIPS is developing technologies to circumvent these problems with a radically different way of assembling systems.


SemiSister Award

Cornell University College of Engineering

With the arrival of the Class of 2022, the Cornell University College of Engineering now enrolls equal numbers of undergraduate women and men – the first engineering school of its size and stature to achieve this milestone. Particular gains have been made in computer science, where female students once comprised a fraction of the department. Achieving gender equity at the College of Engineering was decades in the making, a product of advocacy at the university’s highest levels.

FRT - the art of metrology

Diversity drives us! The individuality of employees is encouraged at FRT. Completely independent of gender or sexual orientation, the unique characters are underlined with positive appreciation. The diversity of the workforce creates a productive overall atmosphere in which ideas thrive and the acceptance of otherness is lived - without social discrimination. At FRT every employee has the same chance: 17 different countries of origin, 33% females and age between 23 and 60 years prove that. Our employees are our future!

Our diversity of origin and the language skills associated with it are also advantageous in customer and supplier communication. Cultural and linguistic commonalities create relationships based on partnership and trust.

Career paths are smoothed out - the decisive factor here at FRT is the ability to master the new challenge in the best possible way. This is how equal opportunities, motivation, competitiveness and creativity thrive.

Wanna be like FRT!

SPTS Technologies Ltd

SPTS values and encourages gender diversity within our workforce with a variety of strategies aimed at attracting new talent and retaining staff, through equal opportunities, equal pay, training & support of their life-long career aspirations. In the past 7 years we have quadrupled the percentage of females in Operations/Engineering, and in 2018 females accounted for 15% of the company’s apprentices & 22% of the graduate engineers, compared to none in 2011. SPTS invests in leadership training to ensure employees can secure internal promotion. Flexible working practices enable employees to manage responsibilities outside the workplace & an enhanced maternity policy supports female staff during this important time.
We participate in the UK-wide STEM Ambassador Scheme, and 40% of our registered Ambassadors are female, providing inspirational role models at internal/external events with local schools/colleges/universities - promoting STEM careers & encouraging girls to enter our industry.

Brewer Science

Brewer Science has long been a proponent of gender diversity and inclusion. This commitment is infused throughout the company. Our executive leadership team includes Barbara Picarelli, Executive Director of Finance, Purchasing, and IT; Rama Puligadda, Executive Director of Corporate R&D; and Kim Arnold, Executive Director of WLP Materials. Brewer Science averages 10-25% more women in technical jobs, leadership roles, and total workforce than most technology leaders in the semiconductor industry. Brewer Science is also known for developing and participating in programs that support inclusiveness. To promote girls’ STEM interest, we’ve welcomed students from St. Joseph’s Academy, an all-girls’ high school, and we host Science Day Academies yearly at local elementary schools. Our proactive engagement of all employees secured us a Top Workplaces award from the St. Louis Post-Dispatch for the last 5 years, and the Missouri Dept. of Health and Senior Services recognized Brewer Science as a breastfeeding-friendly worksite.

Leslie Tugman, SEMI

Leslie Tugman is an advocate of gender parity focusing on diversity, inclusion and workforce development globally. She has been instrumental in launching industry programs including SEMI High Tech U, SEMI Diversity and Inclusion Council, Spotlight on SEMI Women recognition program; she has been a leader in bringing equity to industry events and forums and in raising money to support these programs. See more at https://www.semifoundation.org/semi-high-tech-u/


Startup of the Year

zGlue

zGlue offers the zGlue Integration Platform (ZIP) and a library of heterogeneous building blocks for rapid prototyping. See more here: https://www.zglue.com/ShuttleProgram
This Startup - out of Stanford University - has many high-profile partners and enables engineers to rapidly prototype designs that are smaller than PCB-based solutions and lower power.

Eshylon Scientific's Mobile Electrostatic Carriers

Eshylon Scientific’s multi-patented Mobile Electrostatic Carriers (MESCs) are revolutionizing temporary bonding for thin and exotic wafer handling. Eshylon’s reusable, long-life MESCs offer instant bond/debond on a single station with no adhesives, no clean steps, no ESD, no CTE mismatch and at temperatures exceeding 400°C. Eshylon MESCs are being successfully applied across many fab processes including metrology, lithography, deposition, dry etch, die singulation, substrate stacking, ion implant, transport handling and others. The Eshylon MESC platform delivers unmatched ROI for exotic material wafer handling and small wafer fab retrofits, allowing our customers the flexibility to run multiple size substrates or wafer pieces on existing tool sets.

Disruptive Technologies

Disruptive Technologies is the result of a great idea by Erik Fossum Færevaag, the architect behind the world’s lowest power microcontroller. After an initial funding and development phase, Disruptive Technologies premiered its revolutionary sensor solution in 2018 and has already sold over 300,000 sensors and partnered with world leaders in facility management, boosting their abilities to provide environmentally sustainable solutions based on IoT. The sensor solution is set to revolutionize practically all industries including logistics, real estate, health care, warehousing as well as paving the way for Industry 4.0.
A key component of the sensor is an in-house designed application-specific integrated circuit that enables state of the art energy-efficient sensor communication. The system includes an off-the-shelf MEMS and in-house designed sensors. The remarkable form factor has demanded use of chip-scale wafer-level packaging for several of the key components.

Rohinni LLC

Rohinni LLC makes beautiful light available anywhere. Its innovative, proprietary robotic process supersedes complex LED manufacture by placing mini- and microLEDs directly on virtually any substrate at unmatched speeds, and at a cost that enables high-volume manufacture of these ultrathin LED packages. Micro LEDs made using Rohinni technology are smaller, thinner, brighter, more accurate, and consume less power than any other currently available packaged LED products. Moreover, by removing manufacturing limitations, the Rohinni process is ideally suited for end products ranging from consumer electronics to automotive lighting to outdoor signage – the applications are virtually limitless. In the display space, Rohinni’s technology process is superior to both OLED and quantum dots. Rohinni has broad patent coverage for its microLED-based products, robotic placement equipment and manufacturing processes. Among its investors is Future Shape, led by Tony Fadell – inventor of the iPod, co-inventor of the iPhone, founder and former CEO of Nest Labs.