2019 3D InCites Awards Nomination

2019 3D InCites Awards Nomination

Submit your nomination to recognize excellence in heterogeneous integration.

Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer level packaging, MEMS and sensors, and full system integration. Winners will be chosen by industry peers, through an online voting process.

New this year, is the SemiSister Award – awarded to either an individual or a company that exhibits excellence in practicing gender diversity.

Nominations open January 8, 2019, and close February 11, 2018. Online voting opens February 13 and closes February 28, 2018.

Winners will be announced at the 3D InCites Awards Ceremony, March 6, 2019, at the 2019 IMAPS Device Packaging Conference.

Learn more about the awards here. 

Nominations Form

Name of person/product/company being nominated:

Category being nominated to:

Significant Accomplishment (Max 1000 characters, approx. 150 words)


Your Name

Your Email

Your Phone

There is no fee for submitting a nomination, but we welcome donations in any amount to benefit Phoenix Children’s Hospital and IMAPS Foundations.