Submit your nomination to recognize excellence in heterogeneous integration.
Nominations are open to all who would like to recognize a technology, individual, or company that has made a significant contribution to the advancement of the heterogeneous roadmap including 3D packaging, interposer integration, advanced fan-out wafer level packaging, MEMS and sensors, and full system integration. Winners will be chosen by industry peers, through an online voting process.
New this year, is the SemiSister Award – awarded by the 3D InCites SemiSister Project to a company/organization/individual that is doing the most to foster gender diversity and inclusion in the semiconductor workplace.
The nominations for the 2019 3D InCites Awards are now closed. Voting begins February 13, 2019, and closes February 28, 2018.
Winners will be announced at the 3D InCites Awards Ceremony, March 6, 2019, at the 2019 IMAPS Device Packaging Conference.
There is no fee for submitting a nomination, but we welcome donations in any amount to benefit Phoenix Children’s Hospital and IMAPS Foundations.