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A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.

2018 TSMC Technology Symposium: Listen – Analyze – Act

May 1st is a holiday in many countries, but not in the U.S. and not for TSMC. A very professional TSMC team and many of its Open Innovation partners demonstrated recent accomplishments to a gathering of more than 2000 attendees at the 2018 TSMC Technology Symposium at the Santa Clara Convention Center. TSMC’s strategy to listen to market needs, analyze how best to meet the requirements and act a... »

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Strategic Partnership with ESD Alliance Extends SEMI’s Reach to Semiconductor Design

On Monday, April 16, 2018, SEMI, the industry association representing the global electronics manufacturing supply chain, and the Electronic System Design (ESD) Alliance, representing the design community, announced a strategic partnership. On Tuesday I had a very informative conference call with Bettina Weiss, VP Business Development at SEMI and Bob Smith, Executive Director, the ESD Alliance to ... »

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FLEX2018 Shows how 3D Printed Electronics Will Impact Our Lives

If you drive a late model car, you may be impressed by the many sensors that capture engine conditions, tire pressure, etc. and report to you. Many cars even call the factory if they need preventive maintenance. Wouldn’t it be great if we could one day show the same preventive tender loving care (TLC) to our own bodies, as our cars enjoy today – instead of experiencing emergency room visits ... »

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The 14th ASIP Addresses a Spectrum of Advanced Packaging Opportunities, Part 2

Part 1 of my 3D ASIP blog covered the five keynotes presented at 3D ASIP 2017. Part 2 focuses on more than 20 informative presentations, where focused experts gave an in-depth view of new and/or improved technologies for 3DIC-related advanced packaging. Before we address these, allow me a one-sentence recap of Part 1’s key message: We no longer have one major application, like mainframes, PCs, a... »

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The 14th 3D ASIP Conference Addresses a Spectrum of 0pportunities, Part 1

Several years before I started promoting 3D IC benefits in 2008, a small team of industry visionaries founded the 3D Architectures for Semiconductor Integration and Packaging conference (3D ASIP Conference). Rechristened to 3D Architectures for Heterogeneous Integration and Packaging (still 3D ASIP), each December sees several hundred key players from across the supply chain meeting to discuss mar... »

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IEDM 2017 Looks Way Beyond Moore’s Law

The International Electronic Device Manufacturing Conference (IEDM) has always focused on device scaling, successfully guiding our industry for several decades along the challenging paths of Moore’s Law and the ITRS Roadmap. Both were primarily focused on digital functions. However, we all must agree that the real world around us is analog. To allow our electronic devices to better assist us in... »

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Sir Walter Raleigh towered above the 50th IMAPS Symposium

Almost 500 years ago Walter Raleigh was born in England, rose rapidly in the favor of Queen Elizabeth I and was knighted in 1585. In 1587 he initiated the founding of Raleigh. Last week he welcomed – appropriately dressed – about one thousand semiconductor experts to the 50th International Symposium on Microelectronics at the Raleigh, NC, Convention Center (Figure 1). If you look closer at thi... »

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EDPS 2017: NOT the usual Electronic DESIGN Process Symposium

When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold steps EDPS was traditionally held in the spring. We moved EDPS to the fall because that’s a time when more new IC projects are being planned. After many years of holding it in Monterey, we moved EDPS to Milpitas to make it more easily accessible for Silicon Valley folks... »

TSMC’s OIP 2017 Symposium Shows The Awesome Power of an Ecosystem

Last week, September 13 to be exact, TSMC held its Open Innovation Forum (OIP 2017) Symposium at the Santa Clara Convention Center. Before getting into product and market details, allow me to share some of my general impression of this, as usual, very well-organized event. After several decades of experience with alliance management and ecosystem building, I see TSMC as the master of these discipl... »

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IMAPS 2017 SiP Conference Takes on Sonoma

California’s Wine Country attracts visitors from all over the world. They can enjoy the scenic countryside, historic places, golf courses, tennis courts, gambling and of course great wine and excellent food. How well can a highly technical conference compete with all these “distractions”? Please read about the sessions I attended and judge for yourself! The Inaugural Conference and Exhibitio... »

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