A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.
HPC Drivers and Regionalization Means Steady Growth for Semi Capex and Capacity
Takeaways from the SEMI Capex and Capacity Seminar With Nvidia announcing its earnings in May, it brings closure to the CY Q1 financial calendar. Because of geopolitical and economic uncertainty, the earnings calls had slightly different outlooks over the timing of the quarterly financial announcements, from Micron in April to...
TSMC 2025 Technology Symposium: A Commitment to Customers
Nanosheets, Superpower rails, 3D Fabric, SoW, along with N2, N3, 16A, and 14A. Enough acronyms and numbers to make your head spin. All of these terms and more were discussed at the TSMC 2025 North America Technology Symposium in Santa Clara, held in late April. TSMC holds this event annually...
Onshoring Advanced Packaging Update
Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting...
Artificial Intelligence is Driving Panel Level Packaging
An Intel engineer holds a test glass core substrate panel at Intel’s Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company’s Assembly and Test Technology Development factories. (Credit: Intel Corporation) TSMC has announced a roadmap to 9...
Meeting Sustainability Goals Hits Political and Technical Headwinds
Sustainability goals and efforts are starting to hit some headwinds in the world. In the United States the Trump administration has yet again pulled out of the Paris agreement, and has a campaign promise of “Drill baby, drill!”. However, the United States is not alone in the challenges of keeping...
Heterogenous Integration at ISS: A Key Part of High-Performance Compute
Heterogenous integration and AI are currently moving forward hand-in-hand as the demand for greater computing power in theory, reduces the energy and time needed to train models; (although, DeepSeek may now change some of the thinking along these lines). Larger more complex packages are being built to manage the learning...
Asia May Still Be the Hottest Spot for Advanced Packaging
When the United States and Europe looked to re-shore semiconductor technology, the primary focus was restoring leading-edge manufacturing and creating more resilient supply chains throughout the ecosystem. Eventually, it emerged that nearly all of the leading-edge advanced packaging took place in Asia, and there was minimal packaging capability in either...
SEMI ISS 2025: Ready, Set, Ramp!
The semiconductor industry has been discussing breaching the 1 trillion-dollar mark as it was coming out of COVID-19 and amid a boom year in 2022. The slowdown in 2023 had some resetting the dates for when the industry would crest the 1 trillion mark. The AI boom of 2024 has...
3D Integration Themes Become a Reality at IEDM 2024
The Transistor Wars are back, but they look a little different this time. I’ve been attending the IEDM conference off and on for 30ish years. If you are in the semiconductor process side of the world, this is one of the better conferences to attend to get up to speed...
Semiconductor Industry Forecast: Looking Forward to Balanced Growth in 2025
As the semiconductor industry moves into the last month of 2024, industry pundits are looking back and then looking forward to seeing what they missed in 2024 and preparing their assumptions for 2025. This post looks at what they are predicting to bring you the 3D InCites Semiconductor Industry Forecast....
