3D In Context

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A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.

Modeling, Simulation and Test for Multi-die IC Designs

On May 20 MEPTEC’s Executive Director, Ira Feldman, moderated another informative MEPTEC & iMAPS webinar. Two Knowledgeable speakers from Ansys and International Test Solutions (ITS) outlined their company’s technical capabilities and explained the value these tools and methodologies provide for multi-die IC design and test. Modeling and Simulation of Multi-die...

Covid-19: The Way Forward for Semiconductor Success

In 2002, the first consulting client for my newly founded eda2asic consulting company was Synplicity, located in Sunnyvale. They focused on software for FPGA design and were a clear leader in this rapidly growing field. For about three years I really enjoyed contributing to their success, primarily for three reasons: ...

Handel Jones: The Road to Recovery from Covid-19

Covid-19 has created unprecedented problems for health and economies worldwide. Executives must make now important and often very difficult decisions that significantly impact the future of their companies and the lives of their workforces. The Global Semiconductor Alliance (GSA) started a webinar series to provide essential information to its members...

Geopolitics and Manufacturing: A Changing Landscape

At the March 11 MEPTEC Luncheon at SEMI, Paul Pickering, Managing Director at Microtech Ventures,  braved, together with a rather small audience, the ongoing Coronavirus threat. Because our semiconductor supply chain relies on many countries that are currently suffering under this virus, there is no better time to address this...

FLEX/MSTC 2020: Change has Never Been So Fast…

SEMI, together with FlexTech, the MEMS & Sensors Industry Group, the Nano-Bio Materials Consortium (NBMC) and NextFlex, held FLEX/MSTC 2020 at the DoubleTree in San Jose from February 24 to 27. Executives from above industry organizations and their member companies presented current capabilities of flexible hybrid electronics (FHE), MEMS and...

Is The HIR the Best Path to Increased Revenues?

The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry to achieve $ 1 Trillion in revenues. SEMI hosted the event at its headquarters in Milpitas. Almost 200 IC design and manufacturing experts joined, to celebrate the release of the 2019...

Big Data, Speed and Security Dominate DesignCon 2020

About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January 28 to 30, to hear the latest about IC, package and board innovations and to celebrate the 25th Anniversary of DesignCon. About 200 presenters conveyed very useful information in 14...