A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.


ISS 2019: Semiconductor Industry Faces New Challenges and Opportunities

SEMI held its annual Industry Strategy Symposium (ISS 2019) at the Ritz Carlton in Halfmoon Bay, CA January 6-9, 2019. Many high-level executives represented key areas of the electronic products supply chain. Former government officials emphasized that our country’s leaders recognize the strategic importance of semiconductors. The theme of ISS 2019 was: “The Golden Age of Semiconductors: Enabl... »

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Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium

The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturing and test, as well as electronic design automation (EDA) and IC design experts, got together to present and discuss how to integrate heterogeneous functions in advanced IC packages to better meet cus... »

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EDA Design Tools/Flows Targeting WLP Featured at IWLPC 2018

Wafer and panel-level packaging (WLP/PLP) offers technical and business advantages, compared to traditional IC packages. These cost-effective packaging solutions attracted more than 800 industry experts to the International Wafer Level Packaging Conference (IWLPC 2018) in San Jose’s DoubleTree Hotel at the end of October. In case you were wondering, a multi-die WLP design, created with the tools... »

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Wally Rhines Discusses the Importance of EDA and Design at IWLPC 2018

At this year’s International Wafer-level Packaging Conference, almost 1000 semiconductor experts from all parts of the supply chain gathered at the DoubleTree Hotel in San Jose from October 23 to 25. Among them were also several electronic design automation (EDA) experts who discussed how to streamline die-package-board co-design. They explained how EDA tools enable higher performance per Watt a... »

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TSMC Announces SoC Design in the Cloud at the OIP 2018 Ecosystem Forum

As I prepared to attend TSMC’s OIP 2018 Forum on October 3, 2018 two emails from TSMC caught my attention. They conveyed the news that TSMC just lowered the entry barrier for SoC design significantly by announcing the OIP Cloud Alliance. This is the latest addition to their four Open Innovation Platform Alliances for EDA, IP, Design Services and Value Chain Aggregators. Having promoted Barcelona... »

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SEMI’s Strategic Materials Conference Calls for Supply Chain Cooperation

The message remains consistent: following Moore’s Law is no longer economical for most IC designs. A major part of the IC value creation is moving from the die to the IC package. Now advanced packaging technologies and materials enable combining multiple dies with heterogeneous functions as well as high-quality passives into one package. This integration increases performance, while significantl... »

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SEMICON West Confirms:  AI is the New Killer-app for Semiconductors

SEMICON West (San Francisco, July 10 to 12) confirmed that our industry’s rapid growth will continue. Machine learning (ML) and artificial intelligence (AI) will be the core technologies for a wide range of new applications. Applying AI to win in new and diverse markets – like autonomous cars, medical equipment, military systems, factory automation and a broad range of consumer products – wi... »

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DAC 2018: New Opportunities for EDA and the Entire Semiconductor Supply Chain

This year’s Design Automation Conference (DAC 2018) was held at Moscone West, San Francisco, CA. On three levels, about 175 exhibitors showed their capabilities and discussed market needs. Our industry’s focus on artificial intelligence (AI) and machine learning (ML) solutions were clearly obvious, and I suspect, attracted more young people and a fairly large number of new exhibitors to DAC th... »

2018 TSMC Technology Symposium: Listen – Analyze – Act

May 1st is a holiday in many countries, but not in the U.S. and not for TSMC. A very professional TSMC team and many of its Open Innovation partners demonstrated recent accomplishments to a gathering of more than 2000 attendees at the 2018 TSMC Technology Symposium at the Santa Clara Convention Center. TSMC’s strategy to listen to market needs, analyze how best to meet the requirements and act a... »


Strategic Partnership with ESD Alliance Extends SEMI’s Reach to Semiconductor Design

On Monday, April 16, 2018, SEMI, the industry association representing the global electronics manufacturing supply chain, and the Electronic System Design (ESD) Alliance, representing the design community, announced a strategic partnership. On Tuesday I had a very informative conference call with Bettina Weiss, VP Business Development at SEMI and Bob Smith, Executive Director, the ESD Alliance to ... »

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