3DInContext_logo

A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring heterogeneous ntegration to the masses.

LisaSu FIgure 2

SEMICON West Keynotes Look to a Future Beyond Moore’s Law

Reporting from the SEMICON West keynote talks, Herb Reiter relays the perspectives of industry experts on everything from More than Moore, to hot topics and future technologies. »

ESDWestFig1

The Importance of a Well-coordinated Semiconductor Supply Chain

Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard and/or ketchup and veggies from the nearest supermarket…?  If yes, you may find the sausage being too small, the veggies too big for the bun, and, when you finally finished adding mustard/ketchup and start eating, you may “enjoy” a cold sausage o... »

u2ufig2 u2ufig3 u2ufig4 u2ufig6 u2ufig7

U2U 2019 Conference Dives into 2.5/3D IC Design

Key advanced packaging technology influencers came out in force to discuss the status of  EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor, TechSearch International Inc., and Qualcomm lent their voices to the cause. Technology T... »

TechSymposiumlogo IMG_0206 TSMCFig1 TSMCFig2 TSMCFig3 TSMCFig4

TSMC’s 2019 Technology Symposium highlights 25 Years of Innovation

In 1994 TSMC, a small wafer foundry from Taiwan held its first Technology Symposium. Since 1999 I have had the privilege to work with TSMC and closely follow their success in building a powerful and cost-effective ecosystem for the fabless IC vendors and foundry business model. To measure their success in hard numbers, please check IC Insights’ 2018 revenue estimates here and see that TSMC has a... »

Zeiss Zeiss2 Xperi1 Xperi2 Xperi3 Xperi4

Update on 3D X-ray and DBI Technology for Advanced and 3D Packaging

The Microelectronics Packaging & Test Engineering Council (MEPTEC) held its monthly meeting at SEMI in Milpitas on April 10.  Two speakers outlined their companies’ capabilities and demonstrated their own expertise in solving specific industry challenges. Tom Gregorich presented why and how Zeiss supports IC package inspection with 3D X-ray machines, then Sitaram Arkalgud conveyed the benef... »

HerbFlexFig1 HerbFlexfig2 HerbFLEXFig3 HerbFlexFig5 HerbFlexFig6

FLEX/MSTC Keynotes Confirm: Our Customers Need System-level Solutions

From February 18 to 21, 2019, Monterey, CA, was again the venue for SEMI’s Flexible Hybrid Electronics (FLEX) and MEMS & Sensors Technical Congress (MSTC), conference. As in previous years, the joint keynotes, 2-track technical sessions, and more than 50 exhibitors demonstrated the synergies between these two industry segments and their fast pace of innovation. The entire conference focused ... »

DesignConFig1 DesignConFig2 DesignConFig3 Futuristic flying car flying over traffic jam in highway DesignConFig4

DesignCon 2019 Shows Board and System Designers the Benefits of Advanced IC Packaging

Santa Clara’s Convention Center was home to DesignCon 2019 from January 29-31, 2019. This conference is well known for showing printed circuit board (PCB) and system designers the latest technology advances, enabling higher performance and lower power and lower cost solutions. Bootcamps, tutorials, keynotes, and many in-depth technical sessions offered engineers up-to-date information to make th... »

ISS2Fig1 ISS2Fig2 ISS2Fig3 ISSFig3 ISSFIg4 ISS2Fig5

ISS 2019 Continued: Facing New Challenges and Opportunities

Just in case you didn’t have a chance yet to read part 1 of the ISS 2019 blog, covering day 1, it’s posted here. Technology and Manufacturing Trends Day 2 started with a keynote about the magic nanodevices can create, delivered byJo de Boeck, imec’s EVP and chief strategy officer. He emphasized that we need to find smarter ways to compute, store data and connect building blocks. De Boeck ... »

Darwin ISS_Fig2 ISSFig3 ISSFIg4 ISSFig6 ISSFig9 ISSFig9 ISSFig12 ISSFIG13 ISSFIg7 ISSFig6 ISSFig4

ISS 2019: Semiconductor Industry Faces New Challenges and Opportunities

SEMI held its annual Industry Strategy Symposium (ISS 2019) at the Ritz Carlton in Halfmoon Bay, CA January 6-9, 2019. Many high-level executives represented key areas of the electronic products supply chain. Former government officials emphasized that our country’s leaders recognize the strategic importance of semiconductors. The theme of ISS 2019 was: “The Golden Age of Semiconductors: Enabl... »

meptec1 Meptec2 Meptec3 Meptec4 Meptec5 Meptec6 Meptec7

Highlights From MEPTEC’s 2018 Heterogeneous Integration Symposium

The Microelectronics Packaging and Test Engineering Council (MEPTEC) held its annual heterogeneous integration symposium at SEMI’s headquarters in Milpitas, CA on December 5, 2018. Many manufacturing and test, as well as electronic design automation (EDA) and IC design experts, got together to present and discuss how to integrate heterogeneous functions in advanced IC packages to better meet cus... »

Page 1 of 9123»