A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.
At the latest MEPTEC Luncheon, held February 5, 2020, and hosted by SEMI at its Milpitas HQ, Google’s Dr. Preeti S. Chauhan, Technical Program Manager for Data Center Quality, presented her perspectives on the benefits and challenges of advanced IC packaging technologies. Considering that Alphabet, Google’s parent company, controls about...
About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January 28 to 30, to hear the latest about IC, package and board innovations and to celebrate the 25th Anniversary of DesignCon. About 200 presenters conveyed very useful information in 14...
In Part 1 of my ISS 2020 blog, I described Monday’s opening keynote by LAM’s CTO, Richard Gottscho. He explained how valuable Coventor software is for minimizing trial and error loops in manufacturing. Part 1 also addressed Wall Street’s and market researcher’s thinking about the data explosion, our industry’s future,...
From January 14 to 16, 2020 SEMI welcomed about 300 high-level executives to the Industry Strategy Symposium (ISS 2020) at the Ritz-Carlton in Half Moon Bay. Dave Anderson, President, SEMI Americas welcomed everybody and announced that SEMI will celebrate 50 years of service to the semiconductor industry at SEMICON West...
The monthly MEPTEC Luncheons at SEMI in Milpitas focus on microelectronics packaging and test topics. Javier DeLaCruz, Xperi’s VP of Engineering, presented at the latest Luncheon on January 8 a joint study with eSilicon. It compared how die-to-wafer (D2W) bonding, using Direct Bonding Interconnect (DBI) technology, compares with traditional (2.5/3D-IC)...
The San Francisco Hilton on O’Farrell Street welcomed IEDM 2019 and it’s 1800 attendees in early December. While the conference name implies its focus to be the International Electronic DEVICES Meeting, I was glad to see that IEDM looked again way beyond devices into application-specific topics and system-level challenges of...
Ira Feldman welcomed about 100 attendees to MEPTEC’s December luncheon at SEMI Headquarters to hear Jan Vardaman, Founder and President of TechSearch International deliver her annual “State of the IC Packaging Industry” address titled, “Market Drivers for Advanced Packaging: 2020 and Beyond.” In her opening statement, Vardaman emphasized that our...
A few thousand semiconductor experts, including many high-level executives, got together on December 5, 2019, celebrate the Global Semiconductor Alliance’s (GSA) 25th Anniversary at the annual GSA Awards Dinner, which took place at the Santa Clara Convention Center. The purpose of the evening was to acknowledge and celebrate the semiconductor...
Once a month, MEPTEC, now managed by Ira Feldman, organizes a very informative luncheon at SEMI in Milpitas. On November 13, 2019, two well-known industry experts, Anand Joshi and Tom Dillinger, addressed today’s hot topics —neural networks and System-on-Chip (SoC) design challenges — with short, but very informative presentations. Can...
From November 5 to 7, 2019, I had the opportunity to attend the inaugural MEMS and sensors focused Microtech Innovation Summit at the DoubleTree Hotel in San Jose. I have to admit, until recently I didn’t follow MEMS and sensors (M&S) and didn’t notice the broad and rapid market acceptance...
