3D In Context

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A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.

Progress in Sustainability: Will it be Enough?

Progress in Sustainability has become one of SEMI’s key focus points in supporting its members. It was initiated with a series of keynotes at SEMICON West in 2019, followed by the formation of the SEMI Sustainability Initiative, to help bring focus to the Startups for Sustainability venture capital programs. And...

Will the Green Shoots Be Damaged by a Long Winter?

“Green shoots” refers to signs of economic recovery As a former analyst, I always found forecasting for the next year in December to be the biggest challenge, and perhaps the biggest miss of the year. You essentially are working without a net. Historically calendar Q4 revenue estimates by the equipment...

Takeaways from the Inaugural Chiplet Summit

I was first exposed to chiplet technology in 2017 when Lisa Su presented the concept at the IEEE IEDM meeting. At that time, I thought it made sense, as the industry had been doing systems-in-package (SiP) for several years and chiplets seemed very much the next step in advanced computing....

SEMI ISS 2023: Finding a Sustainable Path to a $1Trillion

Two interesting pieces of climate news emerged in the second week of January 2023. The first was a report in the Wall Street Journal about the cost of damage due to climate incidences. The U.S. National Oceanic and Atmospheric Administration said this week that weather-related disasters caused $165 billion of...

Will 3D Packaging Extend Moore’s Law?

There is a bit of debate about the role that heterogeneous packaging plays in furthering Moore’s Law. Moore’s Law has historically focused on the number of transistors doubling per unit area. In discussions at IEDM, it appears that the definition is being modified to include the chip stacking that is...

SEMI Attends COP 27

SEMI Attends COP 27

COP 27 was held in the second and third week of November 2022. In the media, there was news of calls to accountability for promises made at COP 26, for which richer nations are still lagging. These included a $100 billion fund to assist smaller countries that are significantly impacted...

The Semiconductor Market Roller Coaster Ride is Back

Pat Gelsinger attended the WSJ Tech event in late October and as always had some interesting things to say about the state of the semiconductor industry. In the interview with the WSJ, Gelsinger laid out his view of the current industry environment and the long-term benefits of the CHIPS Act....

Setting Goals For Net Zero

2022 is a turning point year for the semiconductor industry in more ways than one. While it is one of the biggest years ever from a capital expenditures/semiconductor equipment perspective, it is also the year when sustainability became a major focus of nearly every company in the industry.  At SEMICON...