A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.
As long as the “social distancing” requirement is in force, you won’t see me in person at conferences or any other kind of events, where people get closer than six feet. Thanks to webinars and the internet in general, I’ll be able to continue capturing news and – with Francoise’s...
At the March 11 MEPTEC Luncheon at SEMI, Paul Pickering, Managing Director at Microtech Ventures, braved, together with a rather small audience, the ongoing Coronavirus threat. Because our semiconductor supply chain relies on many countries that are currently suffering under this virus, there is no better time to address this...
SEMI, together with FlexTech, the MEMS & Sensors Industry Group, the Nano-Bio Materials Consortium (NBMC) and NextFlex, held FLEX/MSTC 2020 at the DoubleTree in San Jose from February 24 to 27. Executives from above industry organizations and their member companies presented current capabilities of flexible hybrid electronics (FHE), MEMS and...
The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry to achieve $ 1 Trillion in revenues. SEMI hosted the event at its headquarters in Milpitas. Almost 200 IC design and manufacturing experts joined, to celebrate the release of the 2019...
At the latest MEPTEC Luncheon, held February 5, 2020, and hosted by SEMI at its Milpitas HQ, Google’s Dr. Preeti S. Chauhan, Technical Program Manager for Data Center Quality, presented her perspectives on the benefits and challenges of advanced IC packaging technologies. Considering that Alphabet, Google’s parent company, controls about...
About 5000 attendees, as well as more than 200 exhibitors, took over the entire Santa Clara Convention Center from January 28 to 30, to hear the latest about IC, package and board innovations and to celebrate the 25th Anniversary of DesignCon. About 200 presenters conveyed very useful information in 14...
In Part 1 of my ISS 2020 blog, I described Monday’s opening keynote by LAM’s CTO, Richard Gottscho. He explained how valuable Coventor software is for minimizing trial and error loops in manufacturing. Part 1 also addressed Wall Street’s and market researcher’s thinking about the data explosion, our industry’s future,...
From January 14 to 16, 2020 SEMI welcomed about 300 high-level executives to the Industry Strategy Symposium (ISS 2020) at the Ritz-Carlton in Half Moon Bay. Dave Anderson, President, SEMI Americas welcomed everybody and announced that SEMI will celebrate 50 years of service to the semiconductor industry at SEMICON West...
The monthly MEPTEC Luncheons at SEMI in Milpitas focus on microelectronics packaging and test topics. Javier DeLaCruz, Xperi’s VP of Engineering, presented at the latest Luncheon on January 8 a joint study with eSilicon. It compared how die-to-wafer (D2W) bonding, using Direct Bonding Interconnect (DBI) technology, compares with traditional (2.5/3D-IC)...
The San Francisco Hilton on O’Farrell Street welcomed IEDM 2019 and it’s 1800 attendees in early December. While the conference name implies its focus to be the International Electronic DEVICES Meeting, I was glad to see that IEDM looked again way beyond devices into application-specific topics and system-level challenges of...
