MILPITAS, Calif. — September 11, 2023 — The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is now accepting abstract submissions for its 2024 event, May 13-16, in Albany, New York. ASMC 2024 will feature technical presentations of more than 90 peer-reviewed manuscripts on advanced semiconductor manufacturing along with keynotes, a tutorial, a panel discussion, and networking events. Technical abstracts are due October 20, 2023. See the ASMC 2024 Author Kit for submission details.

ASMC 2024 encourages submissions of abstracts of papers co-authored by device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing.

Selected speakers will present to IC manufacturers, equipment manufacturers, materials suppliers, chief technology officers, operations managers, process engineers, product managers and academics gathered at the event. All technical papers will be published by IEEE, and papers may be published in a special section on ASMC 2024 in IEEE Transactions on Semiconductor Manufacturing.

Technical presentation topics include:

  • Advanced Equipment Processes and Materials
  • Advanced Metrology
  • Advanced Patterning, Design for Manufacturability and Design-Technology Co-Optimization
  • Advanced Process Control
  • Big Data Management and Mining
  • Contamination Free Manufacturing
  • Defect Inspection and Reduction
  • Discrete and Power Devices
  • Equipment Optimization
  • Factory Automation
  • Industrial Engineering
  • Innovative Silicon Devices and Processes
  • Lean Manufacturing
  • Manufacturing for Sustainability
  • Non-silicon and Non-CMOS
  • Packaging and Through Silicon Via
  • Smart Manufacturing
  • The Fabless Experience
  • Workforce Development
  • Yield Enhancement and Learning
  • Yield Methodologies

ASMC, in its 35th year, provides critical insights into advanced semiconductor manufacturing and remains a vital venue for professionals to network and exchange knowledge about best practices.

To learn more about the conference and selection process, please contact Taylor Zhao at

ASMC is organized by SEMI Americas.

About SEMI
SEMI® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.


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