Archives June 2017 - 3D InCites

DAC 54: From Grey to Colorful and Solutions-minded Messaging

DAC 54: From Grey to Colorful and Solutions-minded Messaging

The 54th Design Automation Conference (DAC 54) at the Austin Convention Center was very different, compared to the last several years’ events. Walking the exhibition floor, listening to keynotes, SKY talks and CEO interviews I got the following key impressions: While still representing a big part of the audience, the grey-haired men (like myself) were less dominant this year. Many younger people... »

EV Group Brings Home Its Fifth Triple Crown in VLSIresearch Customer Satisfaction Survey

EV Group Brings Home Its Fifth Triple Crown in VLSIresearch Customer Satisfaction Survey

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that, for the fifth successive year, it has earned all three awards resulting from VLSIresearch’s annual Customer Satisfaction Survey. For 2017, EVG was ranked as one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of THE BEST Sup... »

Warpage Issues in Fan-Out Wafer Level Packaging

Warpage Issues in Fan-Out Wafer Level Packaging

As you all know, warpage is a critical issue for fan-out wafer/panel level packaging. Many people like to talk about it, however, most of them don’t know what they are talking about. Let’s use the chips first, face-up fan-out wafer level packaging (FOWLP) approach as an example. Also, let’s consider three redistribution layers (RDLs). The process flow is schematically shown in the figure b... »

Advanced Packaging Adds Value and Reduces Cost for Future Semiconductor Products

Yole Développement (Yole) confirms the consolidation of the advanced packaging industry, that is showing a steady growth in revenue of +7% between 2016 and 2022. “Advanced packaging is showing a total revenue CAGR higher than the total packaging industry (3-4%), semiconductor industry (4-5%) and generally the global electronics industry (3-4%)”, comments Andrej Ivankovic, Technology & Mar... »

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications

EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing for Advanced Semiconductor Packaging Applications

EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG’s latest products and process development services support this emerging semiconductor back-end fa... »

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP

Executive Viewpoint: Breaking The Chicken and Egg Cycle for HDAP

  For several years now, Herb Reiter, eda2asic, and John Ferguson, Mentor Graphics, have been evangelizing about the necessity of assembly design kits (ADK), similar to the process design kits (PDKs) for chip designers, to help drive ecosystem capabilities for what is collectively now being called high density advanced packaging (HDAP), comprising 2.5D IC, 3D IC and high density fan-out wafer... »

Impressions from ECTC 2017

Impressions from ECTC 2017

Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the fan-out plenary session of ECTC 2017, so tossed my stuff in my room and headed on in (wearing jeans, no less!) You can read about that here. Afterward, I had a bite to eat with industry colleagues. Back in my room at 11:15 to call it a night, only to find it raining ON my bed thanks to a leak... »

Artificial Intelligence: A New Era of the Advanced Packaging Industry

Artificial Intelligence: A New Era of the Advanced Packaging Industry

Artificial Intelligence (AI) is driving the development of 3D TSV and heterogeneous integration technologies. With its new 3D TSV & 2.5D business update report, Yole Développement (Yole), part of Yole Group of Companies investigates the advanced packaging industry and takes a closer look at the AI impact on this market. “3D integration is clearly offering today unequaled performances suitin... »

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

New Design Flow and OSAT Alliance Program Jump-Start High-density Advanced Packaging

Editor’s note: For several years now, Mentor Graphics has evangelized about the critical need for assembly design kits to enable commercialization of high-density advanced packaging technologies, such as fine line and space fan-out, 2.5D and 3D IC packages. With this week’s introduction of a unique, end-to-end, high-density advanced packaging (HDAP) design flow, combined with the launch of an... »

FOPLP

Fifty Shades of Fan-out Discussed at ECTC 2017

The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took place in Orlando at the Walt Disney World Swan and Dolphin Resort. The buzz started during the Tuesday evening plenary session, where panelists Douglas Yu, TSMC, Tim Olson, Deca Technologies; Steffen Kroehnert, NANIUM; Rolf Aschenbrenner... »

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