Archives June 2014 - 3D InCites

Xcerra™ President and CEO to Join Panel Discussion at Semicon West

Xcerra™ President and CEO to Join Panel Discussion at Semicon West

Xcerra™ Corporation announced that Dave Tacelli will join the panel discussion “Testing into the Future” at SEMICON West, scheduled to take place July 8 to 10 in San Francisco. The panel discussion will be part of the TechXpot North session “Seeking Growth” on Tuesday, July 8, 2014 from 10:30 am – 12:30 pm hosted by Collaborative Alliance for Semiconductor Test (CAST). This session wil... »

EV Group Clears Key Barriers to 3D-IC/TSVs HVM with Breakthrough Fusion Wafer Bonding Solution

EV Group Clears Key Barriers to 3D-IC/TSVs HVM with Breakthrough Fusion Wafer Bonding Solution

GEMINI®FB XT surpasses ITRS requirements for wafer bonding with up to 3X improvement in wafer-to-wafer alignment; enhanced productivity enables 50 percent increased throughput.  ST. FLORIAN, Austria, June 30, 2014—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the GEMINI®FB XT—its next-gene... »

Electrical Design and Modeling Challenges for 3D Systems Integration

Electrical Design and Modeling Challenges for 3D Systems Integration

Over the last several years, the buzzword in the electronics industry has been “More than Moore”, referring to the embedding of components in the the package substrate and stacking of ICs and packages using wire bond and package-on-package (PoP) technologies. This has led to the development of technologies that can lead to ultra-miniaturization of electronic systems with coining of ter... »

A Path Finding Based SI Design Methodology for 3D Integration

A Path Finding Based SI Design Methodology for 3D Integration

3D integration is being touted as the next semiconductor revolution by industry. 3D integration involves the use of various interconnects that include balls, pillars, bond wires, through silicon vias (TSV) and redistribution layers (RDL) for enabling chip stacking, interposer and printed circuit board (PCB) based technologies. More recently 2.5D integration using silicon interposers has gained mom... »

Path Finding: Who Performs and When?

Path Finding: Who Performs and When?

Microelectronic products all have mechanical, thermal and electrical properties that degrade until the device is permanently damaged. Path finding adds value to an end-product by pre-determining where the breaking points are, and if or how they can be enlarged. For decades, product designers have used various methods of path finding to determine optimum solutions for the design and manufacture of ... »

3D Integration 101: Explore, Learn, Share

3D Integration 101: Explore, Learn, Share

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2.5/3D Packaging: Path Finding

2.5/3D Packaging: Path Finding

2.5D/3D packaging technologies are revitalizing creativity in high technology products. We thought we knew what faster, better, lighter and smaller meant. 2.5D/3D packaging can revolutionize what we thought possible but it will require augmenting our current methods and tools. One key methodology to add would be Path Finding. Path Finding can ensure a design’s structural integrity early in the... »

2014 VLSI Symposium, Honolulu

3D NAND Flash at the 2014 VLSI Symposium

Imagine this: aquamarine tints of the Pacific washing sandy Hawaiian beaches amid the balmy breeze and only yards away, several 3D NAND papers being presented at the recent VLSI Symposium in Honolulu. Idyllic! I counted five papers in total associated with various forms of 3D NAND. The protagonists were: SK Hynix in association with KAIST on one paper and Seoul National University on another; Macr... »

Intel’s Next-Gen Xeon Phi processor to have Micron 3D Memory Inside

Intel’s Next-Gen Xeon Phi processor to have Micron 3D Memory Inside

Somehow in all my preparations for the 2014 3D InCites Awards and planning the schedule for SEMICON West this week, a significant piece of news slipped right by usually alert 3D radar for TWO WHOLE DAYS! On Tuesday, Micron issued a press release announcing a collaboration with Intel to deliver an on-package 3D memory solution for Intel’s next-generation Xeon Phi™ processor, codenamed R... »

2014 3D InCites Guide to 3D at SEMICON West

2014 3D InCites Guide to 3D at SEMICON West

I can’t believe it’s already been a year since I last posted my annual guide to 3D at SEMICON West.  One thing I’ve noticed in scanning the “regulars” (SEMI and SEMI partner events) is that all the agendas are  much less focused on 3D integration developments. I think there are a couple reasons for this. First of all, many suppliers are in a holding pattern waiting for high volume manu... »

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