2.5D and 3D IC Technologies: Application Ready but Cost Limited?
Two schools of thought clearly emerged at last week’s European 3D TSV Summit, which took place on January 20 and 21, 2014 at Minatec campus in Grenoble France. One I addressed in yesterday’s post – about realizing system-level benefits – including cost – by integrating 2.5D and 3D IC technologies. The other big question mark, as we all know, is how to reduce the cost-of-ownership of thes... »
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