Two schools of thought clearly emerged at last week’s European 3D TSV Summit, which took place on January 20 and 21, 2014 at Minatec campus in Grenoble France. One I addressed in yesterday’s post – about realizing system-level benefits – including cost – by integrating 2.5D and 3D IC technologies. The other big question mark, as we all know, is how to reduce the cost-of-ownership of thes... »
The technologies are ready, the target high volume applications for 3D IC manufacturing have been identified, and now it’s about convincing system architects there’s more to gain from designing in 2.5D and 3D ICs than there is to lose. At last week’s European 3D TSV Summit (January 21-22), two European manufacturers took to the podium to shared their reasons for implementing 2.5D and 3D in... »
Tessera Technologies, Inc. and Samsung Electronics Co., Ltd. announced today that Tessera’s subsidiaries Tessera, Inc. and Invensas Corporation each entered into new patent license agreements with Samsung. “We are pleased to announce an expanded relationship with Samsung, one of the leading mobile device and semiconductor chip manufacturers in the world,” said Tom Lacey, presid... »
BERLIN, Germany — January 28, 2014 — At the SEMI Industry Strategy Symposium Europe (ISS Europe 2014) on February 23-25 in Salzburg, semiconductor industry executives will examine the conditions required to achieve the EU’s 10/100/20 strategy — 20% market share of global semiconductor manufacturing by 2020. Presenters from ASML, ASMI, Deutsche Bank, GlobalFoundries, Infineon, Nomura Resear... »
For almost 50 years the semiconductor industry has practiced continued shrinking of transistor feature sizes and has been able to pack, with every new process generation, more functionality, at lower cost, onto a single piece of silicon in one IC package. However, physical limits to shrinking and rapidly increasing cost of this methodology have triggered the development of alternatives that combin... »
I just boarded my flight home after attending the 2014 European 3D TSV Summit. Three days, 332 attendees from 21 countries, 24 presentations, 3 keynote speakers, 2 panel discussions, several face-to-face interviews and lots of side conversation all about 3D TSVS being Application Ready leads to a good deal of information to process and write about. So let me start off with some key take-aways and ... »
The 2013 European 3D TSV Summit (January 20-22, Grenoble, France) kicked off with a pre-conference symposium on 3D TSVs for MEMS applications. My initial thought after attending, was that I’m not sure the MEMS people realize this, but some of us who don’t work in the MEMS market but DO work in the 2.5D and 3D IC space aren’t fully aware of the differences between TSVs for MEMS and TSVs for 3... »
The way I see it, it was only a matter of time before Nordson DAGE brought its X-ray technology into the 2.5D and 3D IC space. The company has long been the leader for X-ray inspection in the electronics market and is now positioned to address the growing need for wafer metrology and defect review in features such as through silicon vias (TSVs). According to John Tingay, Technical Director Nordson... »
Rarely do I have the opportunity to visit a company two times and find something new to write about, never mind three. But as always, EV Group didn’t disappoint for my visit Friday (January 17, 2014) to see the company’s latest additions, both to the physical plant and to the product and technology line for 3D integration technologies. My visit really started the evening before with a lovel... »
I thought I would go to Singapore, attend EPTC (Electronic Packaging Technology Conference 2013) and then take off on my personal vacation to India to attend my 40th high school reunion and 35th college reunion – two weeks tops. It escalated quickly. It ended up being 34 day, 20 city, 6 country marathon. Why you ask? Either I was not willing to give up on the opportunity to meet with packaging t... »
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