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Xperi Sets Out to Enable Immersive Experiences
Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was...Fraunhofer EMFT Signs Agreement to Implement ZiBond and DBI Technologies in MEMS Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., (Nasdaq: TSRA) has announced that Fraunhofer EMFT has signed a...
Invensas Announces That Sandia National Laboratories Has Licensed ZiBond and DBI Technologies for Advanced 3D Semiconductor Applications
Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Sandia National Laboratories signed a...
3D Stacking is Part of Life
Sitaram Arkalgud, VP 3D technologies, Invensas, provided the entertainment at last week’s IWLPC 2015. As soon as he realized Phil... Ziptronix Teams with Tezzaron and Novati Technologies to Accelerate 3D IC Development
Ziptronix Inc., provider of patented, low-temperature direct bonding technology for 3D integration, announced an agreement with Tezzaron Semiconductor Corporation and...Ziptronix Takes on 3D Memory
After seeing the latest press release on Ziptronix foray into the memory space, I sought out Kathy Cook, business development...Ziptronix Direct Oxide Bond Technology Gains Momentum
At RTI’s 3D ASIP last week, I sat down with Paul Enquist, of Ziptronix, to get an update on the...Ziptronix Goes Commercial
Ever since I got involved in the world of advanced packaging, and particularly 3D, I’ve had a soft spot for...
