Latest Posts
PDN Noise: PDN and Signal
In a previous blog, I discussed a power design network’s (PDN) self and transfer impedances. Self impedance highlights anti-resonances causing a...
Path Finding and 3DPF
In the past year, I have written short pieces explaining how Path Finding methodology can proactively help identify viable solutions...
Path Finding Series Part 3: The Cost of Non-robust Design
In previous posts, I discussed a process for process-centering a design. In this post, we will examine how non-robust design’s...
3D ASIP 2014: All Aboard the 3D IC Train!
Like the previous 10 years, RTI International held the 11th 3D-IC focused conference in early December. Instead of the usual...
Can Product Design learn a Trick from Manufacturing?
You might think this is crazy but bear with me for 421 words. Early in my career, I worked at...
3D By Design: Exploring Viable Path Finding
Fruitful path finding eventually identifies solutions that are viable for mechanical, electrical, thermal, and cost (METC) requirements. Hopefully, more than one...
3D By Design: Are Path Finding Tools the Missing Link?
TechSearch International’s recently published 3D IC Gap Analysis report has a section for a new class of tools called Path...
Are there still Gaps in 3D IC Readiness?
Good news! At last week’s GSA 3D IC Packaging Working Group Meeting, July 23, 2014, Jan Vardaman uttered the words...
Path Finding: Who Performs and When?
Microelectronic products all have mechanical, thermal and electrical properties that degrade until the device is permanently damaged. Path finding adds...
