Latest Posts
February Member News: Expansion, Collaborations, and Events Galore
February member news shows dynamic activity for semiconductor industry, with exciting advancements in technology, strategic expansions, key industry events, and...
January Member News: Technology Innovation, Strategic partnerships, Expansion and More
January Member News celebrates major developments in semiconductor technology, strategic partnerships, industry expansions, and workforce growth. Companies introduced cutting-edge packaging,...
Community Member Highlights for September 2024
As summer holidays came to a close, September found our member companies ramping up new products and opening new facilities....
SEMICON West 2024 “Stronger Together” Member Preview
SEMICON West 2024 is themed Stronger Together. SEMI’s message of the year is focused on the need for global collaboration...
March Member Highlights: Anniversaries, Events, Collaborations, New Products, and More
March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance...
IMAPS DPC 2024 Community Member Preview
IMAPS 20th Annual Device Packaging Conference – Event Highlights The International Microelectronics Assembly and Packaging Society (IMAPS) 20th annual Device...
Community Member Conversations from IMAPS 2023
At the 2023 IMAPS Symposium in October, I had some great community member conversations about some of the hot topics...
IMAPS San Diego Community Member Preview
The 56th International Symposium on Microelectronics organized by the International Microelectronics Assembly and Packaging Society (IMAPS) is just around the corner. This...
MRSI Introduces 705HF High-Force Die Bonder for Power Devices and Advanced Chip Packaging
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy...
MRSI Mycronic to Showcase and Present Innovative Die Bonder Solutions at CIOE 2023
MRSI, a part of Mycronic Group, will exhibit our family of die bonders and present at the 24th China International...
MRSI Systems Wins Silver Honoree for Laser Focus World Innovators Award 2023
MRSI Systems, a part of Mycronic Group, a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing...
MRSI to Exhibit with Live Demonstrations and Present at LASER World of PHOTONICS CHINA
We are pleased to announce that MRSI, Mycronic Group will be exhibiting at LASER World of PHOTONICS CHINA and will...
MRSI Systems Offers Various On-site Customer Training Programs
MRSI Systems offers a variety of service contract options to provide fixed cost material, labor, and expenses for machine repairs....
SEMICON West 2023 Member Preview
SEMICON West 2023 is taking aim at Building a Path Forward with a reimagined exhibition and conference as industry experts and visionaries...
MRSI Systems Launches Free Software Training Video Program
MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing...
MRSI-H-HPLD 1.5 micron Die Bonder Wins Award for “Infostone 2022 Outstanding Technology”
On December 29, 2022, Infostone 2022 Annual meeting and the 9th Heroes List award live conference was successfully held. During...
Community Member Monthly Highlights – September
Welcome to our new monthly community member news in review where we will highlight community news, events, milestones, anything worth...
3DInCites Community Members Well Represented at IMAPS Boston — Here’s a Preview
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with...
